the tuesday report(tm) - Chip Scale Review

May 8, 2007
THE
TUESDAY
REPORT
Published every Tuesday by Chip Scale Review
IBM claims ‘self-assembling’ nanotechnology breakthrough
ARMONK, N.Y.—IBM has applied self-assembling nanotechnology
to conventional semiconductor
manufacturing, which it
will use for next-generation
computer chips.
The natural pattern-creating
process, IBM says, has
been “borrowed from nature”
and is comparable to the way
seashells, snowflakes and
tooth enamel are created.
The IBM process forms
trillions of holes to create insulating
vacuums around the
miles of nanoscale wires
packed next to each other
inside each computer chip.
IBM Fellow Dr. Dan Edelstein holds an
experimental version of the company’s latest-generation
microprocessor. (IBM Corp.)
OUT OF THE R&D LAB
The process, patented by IBM, moves a manufacturing method
from the lab to a commercial manufacturing environment for
the first time.
IBM says the technology offers wiring performance
improvement comparable to two generations of Moore’s Law in
a single step.
This new form of insulation is commonly referred to as
“airgaps,” but that is a misnomer, says IBM, since the gaps are
actually a vacuum.
The technique used by IBM causes a vacuum to form
between the copper wires on a computer chip, thus permitting
electrical signals to flow faster, while consuming less electrical
power.
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IBM claims nanotechnology breakthrough
The self-assembly process enables the nanoscale patterning
needed to form the gaps. The pattern, says IBM, “is
considerably smaller than current lithographic techniques can
achieve.”
A vacuum is believed
to be the ultimate insulator
for wiring capacitance,
which occurs when two conductors
siphon electrical
energy from one another.
This condition results in
undesirable heat generation
and reduces the speed that
data can move through a
semiconductor.
Until now, IBM reports,
chip designers were
required to fight capacitance
This microprocessor cross section shows empty
space between the chip’s wiring. Vacuum gaps
insulate the miles of nanoscale wire that connect
hundreds of million of transistors. (IBM Corp.)
issues by pushing more power through chips. Adding power,
however, created many other problems.
Designers have also employed insulators with improved
insulating ability. These insulators, however, have become
fragile as device features become smaller, and their insulating
properties do not compare to those of a vacuum.
A FIRST FOR TECHNOLOGY
“This is the first time anyone has proven the ability to synthesize
mass quantities of these self-assembled polymers and
integrate them into an existing manufacturing process with
great yield results,” reports Dr. Dan Edelstein, IBM Fellow and
chief scientist for the self-assembly airgap project.
IBM says the secret of its breakthrough resides in how
IBM scientists moved the self-assembly process from the lab to
a production manufacturing environment in a way that potentially
yields million of chips with consistent, high-performance
results.
The method deployed to make airgaps by self-assembly
eliminates the traditional masking and light-etching process.
Instead, IBM scientists employ a mixture of compounds, which
they pour onto a silicon wafer with the wired chip patterns,
before baking the wafer. [ibm.com]
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Amkor chief operating officer to present conference keynote
SAN JOSE—Oleg Khaykin, chief operating officer and executive
vice president of Amkor Technology Inc., a leading provider
of assembly and test services, will present the keynote speech
at the International Wafer-Level Packaging Conference on
September 18.
His topic will be, “Packaging Trends and
Solutions for Advanced Silicon Applications.”
Khaykin was named to Amkor’s top operating
post in January 2006, reporting to Chairman
James Kim, and was vested with overall responsibility
for worldwide sales, marketing, product business
units, advanced product development, and
manufacturing operations.
Khaykin
Khaykin joined Chandler, Ariz.-based Amkor in 2003 as
executive vice president for corporate development and flipchip
operations.
SPEARHEADED AMKOR’S UNITIVE ACQUISITION
He spearheaded Amkor’s 2004 acquisition of Unitive
Electronics and the company’s strategic alliance with IBM.
Prior to joining Amkor, Khaykin was vice president of
strategy and business development for Conexant Systems
Inc./Mind-speed Technologies from 1999-2003.
He also served eight years with The Boston Consulting
Group, where he worked with leading European and North
American companies in the high tech, bio-technology, automotive,
and aerospace industries.
Khaykin holds an MBA from Northwestern University and
a bachelor’s degree in electrical and computer engineering
from Carnegie-Mellon University.
The fourth annual IWLPC will be held from Sep. 17-19,
with the first day devoted to workshops. Days 2 and 3 will
include exhibits, panels, technical paper presentations and the
keynote dinner on Sep. 18 at the Wyndham Hotel in San Jose.
The Conference is co-presented by Chip Scale Review
magazine and the SMTA, the nation’s leading electronics trade
organization.
A special “Early Bird” discount of 10 percent for attendees
is available at the IWLPC website at smta.org/iwlpc.
(Page 3)

People in the News
Ang joins ASAT Holdings as VP of North American sales
HONG KONG—Industry veteran Gabby Ang has joined ASAT
Holdings Ltd. as vice president of North American sales, based
in Milpitas, Calif.
He reports to Joe Martin, executive vice
president of sales and marketing.
Most recently, Ang served as vice president
of sales for Advanced Semiconductor
Engineering, Taiwan. Earlier he served in sales
positions with Advanced Interconnect
Technologies, the packaging foundry recently
acquired by Unisem.
Gabby Ang Ang has also held sales positions with
Amkor Technology Inc. and Interlek/Dynetics.
He holds a master’s degree in international management
and a bachelor’s degree in mechanical engineering. [asat.com]
Indium Corp. announces management changes, promotions
CLINTON, N.Y.—Indium Corp. of America has announced several
management changes and promotions, including Ross
Berntson, Scott Pringle and Jim Slattery.
Berntson has been promoted to vice president of
Indium’s Solder Products Business Unit. He most recently
served as director of that unit.
Pringle has been named sales director for global
accounts, based in Southern California. He has served as a
consultant to Indium for two years.
Slattery has been named vice president of technical service
for Indium’s Metals & Chemicals Business Unit. He was
most recently vice president of technical service for the Solder
Products Business Unit. [indium.com]
THE TUESDAY REPORT(TM)
is published every Tuesday, except on federal and California state holidays,
by Chip Scale Review. Copyright © Gene Selven & Associates Inc.,
2007. All rights reserved. To contact the office of publication, phone
408/996-7016.
Publisher Gene Selven gselven@aol.com
Editor Ron Iscoff chipscale@gmail.com
Senior Editor Terrence E. Thompson tethompson@aol.com
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