What's New For DDR3 - Micron
What's New For DDR3 - Micron
What's New For DDR3 - Micron
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4/12/2007<br />
What’s <strong>New</strong> <strong>For</strong> <strong>DDR3</strong><br />
©2006 <strong>Micron</strong> Technology, Inc. All rights reserved. Products are warranted only to meet <strong>Micron</strong>’s production data sheet specifications.<br />
Information, products and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without<br />
warranties of any kind. Dates are estimates only. Drawings not to scale. <strong>Micron</strong> and the <strong>Micron</strong> logo are trademarks of <strong>Micron</strong> Technology, Inc.<br />
All other trademarks are the property of their respective owners.
• <strong>DDR3</strong> Market Transition<br />
� Density, Technology<br />
� <strong>DDR3</strong> Ramp, <strong>Micron</strong> Plans<br />
4/12/2007 2<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Agenda<br />
• <strong>DDR3</strong> Module Configurations<br />
� Standard and High Density<br />
• <strong>DDR3</strong> Component Roadmap<br />
� Monolithic and Stacked<br />
• <strong>DDR3</strong> Module Roadmap<br />
� UDIMM, SODIMM, RDIMM, FBDIMM2
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
<strong>DDR3</strong> Market Transition
Units<br />
Source: IDC, iSuppli Q306<br />
100%<br />
90%<br />
80%<br />
70%<br />
60%<br />
50%<br />
40%<br />
30%<br />
20%<br />
10%<br />
0%<br />
4/12/2007 4<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
DRAM Technology Trends<br />
SDRAM<br />
DDR<br />
DDR2<br />
<strong>DDR3</strong><br />
DDR4<br />
2004 2005 2006 2007 2008 2009 2010 2011
100%<br />
90%<br />
80%<br />
70%<br />
60%<br />
50%<br />
40%<br />
30%<br />
20%<br />
10%<br />
0%<br />
64Mb<br />
128Mb<br />
Source: IDC, Isuppli, Gartner, <strong>Micron</strong> Q107<br />
4/12/2007 5<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
DRAM Density Trends<br />
256Mb<br />
2005 2006 2007 2008 2009 2010 2011<br />
<strong>Micron</strong> 1Gb/512Mb<br />
cost-per-bit parity<br />
by the end of 2007<br />
512Mb<br />
1Gb<br />
<strong>Micron</strong> 2Gb/1Gb<br />
cost-per-bit parity<br />
by the end of 2011<br />
2Gb
<strong>DDR3</strong> Production Mix <strong>For</strong>ecast<br />
• <strong>Micron</strong> is ready when market ramps<br />
� Limited production until 2Q08 ramp<br />
• <strong>DDR3</strong> ramp expectations (percent of industry output)<br />
4/12/2007 6<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2007 2008 2009 2010<br />
DDR 14% 3% 2%<br />
DDR2 83% 78% 64%<br />
31%<br />
<strong>DDR3</strong> 3% 19% 34%<br />
68%<br />
1%
4/12/2007 7<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
<strong>DDR3</strong> Performance Timeline<br />
• <strong>DDR3</strong> server speed/latency timeline<br />
� Is 15ns tAA desirable at higher speeds if price is lower?<br />
2007 2008<br />
2009 2010 2011<br />
Speed Latency tAA(ns) Speed Latency tAA(ns) Speed Latency tAA(ns) Speed Latency tAA(ns) Speed Latency tAA(ns)<br />
1066<br />
CL7<br />
CL8<br />
13.125<br />
15 1333<br />
CL8<br />
CL9<br />
12<br />
13.5<br />
1600<br />
CL10<br />
CL11<br />
12.5<br />
13.75<br />
1866<br />
CL13<br />
CL12<br />
13.91<br />
12.84<br />
2133<br />
CL13<br />
CL14<br />
12.19<br />
13.13<br />
800<br />
CL5<br />
CL6<br />
12.5<br />
15<br />
1066<br />
800<br />
CL10<br />
CL7<br />
CL8<br />
CL5<br />
CL6<br />
15<br />
13.125<br />
15<br />
12.5<br />
15<br />
1333<br />
1066<br />
CL8<br />
CL9<br />
CL10<br />
CL7<br />
CL8<br />
12<br />
13.5<br />
15<br />
13.125<br />
15<br />
1600<br />
1333<br />
CL10<br />
CL11<br />
CL8<br />
CL9<br />
CL10<br />
12.5<br />
13.75<br />
12<br />
13.5<br />
15<br />
1866<br />
1600<br />
CL13<br />
CL12<br />
CL10<br />
CL11<br />
CL8<br />
13.91<br />
12.84<br />
12.5<br />
13.75<br />
12<br />
800<br />
CL5<br />
CL6<br />
12.5<br />
15<br />
1066<br />
CL7<br />
CL8<br />
13.125<br />
15<br />
1333 CL9<br />
CL10<br />
13.5<br />
15
4/12/2007 8<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
<strong>DDR3</strong> Market<br />
• Market segments introductions<br />
� Desktop – mid 07<br />
� Notebook- 1H08<br />
� Server – 2H08<br />
• <strong>Micron</strong> <strong>DDR3</strong> products<br />
� 1Gb x4, x8, x16 samples – now<br />
� 1Gb x4, x8, x16 production ramp starts – 2Q07<br />
� 2Gb x4, x8 samples – 3Q07<br />
� 2Gb x4, x8 production ramp starts – 1Q08
Collateral and Supporting Information<br />
• Marketing data sheets<br />
� Component (1Gb; x4x8x16) – 2Q07<br />
� Module (UDIMM) – 2Q07<br />
� Module (SODIMM) – 2Q07<br />
� Module (RDIMM) – 3Q07<br />
� Module (FBDIMM2) – 1H08<br />
• Component simulation<br />
� <strong>DDR3</strong> web-based point to point simulator - now<br />
� Verilog model– now<br />
� IBIS model – now<br />
� Spice model – now<br />
• Standardization status<br />
� Component specification expected – 2H07<br />
� Modules specifications (UDIMM, SODIMM, RDIMM) expected – 2H07<br />
4/12/2007 9<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Modules
• UDIMM<br />
• RDIMM<br />
• SODIMM<br />
4/12/2007 11<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
<strong>DDR3</strong> Modules<br />
UDIMM<br />
SODIMM<br />
RDIMM
Server Module Trends (DDR2 and <strong>DDR3</strong>)<br />
100%<br />
90%<br />
80%<br />
70%<br />
60%<br />
50%<br />
40%<br />
30%<br />
20%<br />
10%<br />
0%<br />
2H06<br />
1H07<br />
4/12/2007 12<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2H07<br />
1H08<br />
2H08<br />
1H09<br />
2H09<br />
1H10<br />
2H10<br />
1H11<br />
2H11<br />
DDR2 RDIMM DDR2 FBDIMM Custom Modules<br />
<strong>DDR3</strong> RDIMM <strong>DDR3</strong> FBDIMM
4/12/2007 13<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Tree Topology
4/12/2007 14<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Fly-by Topology
• UDIMM & ECC UDIMM<br />
� 4GB<br />
� 2GB<br />
� 1GB<br />
� 2Gb DR x8<br />
� 1Gb DR x8<br />
� 2Gb SR x8<br />
� 1Gb SR x8<br />
4/12/2007 15<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
UDIMM<br />
UDIMM
• SODIMM<br />
� 2GB<br />
� 1GB<br />
� 1Gb DR x8<br />
� 2Gb SR x8<br />
� 1Gb SR x8<br />
� 1Gb DR x16<br />
� 512MB<br />
� 1Gb SR x16<br />
4/12/2007 16<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
SODIMM<br />
SODIMM
• 16GB<br />
• 8GB<br />
• 4GB<br />
• 2GB<br />
• 1GB<br />
4/12/2007 17<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
RDIMM<br />
� 2Gb Quad Rank, x4 TwinDie 38mm<br />
� 2Gb DR x4 30mm TwinDie<br />
� 1Gb QR x4 TwinDie<br />
� 1Gb Planar, 30mm, DR x4<br />
� 2Gb SR x4<br />
� 1Gb SR x4<br />
� 2Gb SR x8<br />
RDIMM<br />
� 1Gb SR x8 High Density Planar<br />
RDIMM
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Component Roadmap
QS<br />
68 78<br />
ES<br />
Wafer Process (nm)<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
4Gb<br />
2Gb<br />
1Gb<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
2Q<br />
1.5V <strong>DDR3</strong> Road Map<br />
CY2007<br />
3Q<br />
ES<br />
3Q<br />
CY2007<br />
Note: Speeds are shown in data rates<br />
ES<br />
4Q<br />
QS<br />
4Q<br />
QS<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2008<br />
CY2008<br />
3Q<br />
3Q<br />
4Q<br />
800 Mb/s-1333 Mb/s; x4, x8, x16 (V48A, Rev. B)<br />
ES<br />
4Q<br />
ES<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
800 Mb/s-1333 Mb/s; x4, x8, x16 (V50A, Rev. A)<br />
QS<br />
800 Mb/s-1333 Mb/s; x4, x8, x16 (V59A, Rev. B)<br />
QS<br />
800 Mb/s-1066 Mb/s; x4, x8 (V49A, Rev. A)<br />
ES<br />
800 Mb/s-1600 Mb/s; x4, x8, x16 (V58A, Rev. E)<br />
QS<br />
800 Mb/s-1333 Mb/s; x4, x8 (V48C, Rev. D)<br />
1Q<br />
CY2010
QS<br />
68 78<br />
ES<br />
Wafer Process (nm)<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
1.5V <strong>DDR3</strong> TwinDie Road Map<br />
8Gb<br />
4Gb<br />
2Gb<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
2Q<br />
CY2007<br />
3Q<br />
3Q<br />
CY2007<br />
Note: Speeds are shown in data rates<br />
ES<br />
4Q<br />
ES<br />
4Q<br />
QS<br />
QS<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2008<br />
CY2008<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
800 Mb/s-1333 Mb/s; x4, x8 TwinDie (V50A, Rev. A)<br />
QS<br />
ES<br />
800 Mb/s-1066 Mb/s; x4, x8 TwinDie (V49A, Rev. A)<br />
800 Mb/s-1333 Mb/s; x4, x8 TwinDie (V48C, Rev. D)<br />
1Q<br />
CY2010
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
Module Roadmaps
QS<br />
ES<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
16GB<br />
8GB<br />
4GB<br />
2GB<br />
1GB<br />
<strong>DDR3</strong> RDIMM Road Map<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
2Q<br />
CY2007<br />
3Q<br />
3Q<br />
CY2007<br />
Notes: SR = single rank; DR = dual rank<br />
ES<br />
ES<br />
ES<br />
ES<br />
ES<br />
4Q<br />
4Q<br />
QS<br />
QS<br />
QS<br />
QS<br />
QS<br />
1Q<br />
ES<br />
1Q<br />
QS<br />
2Q<br />
2Q<br />
CY2008<br />
CY2008<br />
3Q<br />
3Q<br />
4Q<br />
ES<br />
4Q<br />
ES<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
1 Gig x 4 DR TwinDie (PC3-6400-PC3-10660)<br />
QS<br />
1 Gig x 4 SR (PC3-6400-PC3-10660)<br />
QS<br />
512 Meg x 4 DR TwinDie (PC3-6400-PC3-10660)<br />
256 Meg x 4 DR (PC3-6400-PC3-10660)<br />
512 Meg x 4 SR (PC3-6400-PC3-10660)<br />
256 Meg x 4 SR (PC3-6400-PC3-10660)<br />
128 Meg x 8 DR (PC3-6400-PC3-10660)<br />
128 Meg x 8 SR (PC3-6400-PC3-10660)<br />
1Q<br />
CY2010
QS<br />
ES<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
16GB<br />
8GB<br />
4GB<br />
2GB<br />
1GB<br />
<strong>DDR3</strong> FBDIMM2 Road Map<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
2Q<br />
CY2007<br />
3Q<br />
3Q<br />
CY2007<br />
4Q<br />
4Q<br />
Notes: SR = single rank; DR = dual rank; QR = quad rank<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2008<br />
ES<br />
ES<br />
ES<br />
CY2008<br />
3Q<br />
3Q<br />
ES<br />
ES<br />
4Q<br />
4Q<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
512 Meg x 4 QR TwinDie (PC3-6400-PC3-10660)<br />
QS<br />
ES<br />
QS<br />
512 Meg x 4 DR (PC3-6400-PC3-10660)<br />
256 Meg x 4 QR TwinDie (PC3-6400-PC3-10660)<br />
QS<br />
QS<br />
QS<br />
QS<br />
256 Meg x 4 DR (PC3-6400-PC3-12800)<br />
128 Meg x 8 DR (PC3-6400-PC3-12800)<br />
128 Meg x 8 SR (PC3-6400-PC3-12800)<br />
1Q<br />
CY2010
QS<br />
ES<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
8GB<br />
4GB<br />
2GB<br />
1GB<br />
512MB<br />
<strong>DDR3</strong> UDIMM Road Map<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
2Q<br />
CY2007<br />
3Q<br />
3Q<br />
CY2007<br />
Notes: SR = single rank; DR = dual rank<br />
ES<br />
4Q<br />
QS<br />
4Q<br />
1Q<br />
1Q<br />
2Q<br />
PC3-12800<br />
2Q<br />
CY2008<br />
CY2008<br />
3Q<br />
3Q<br />
4Q<br />
ES<br />
4Q<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
512 Meg x 8 DR (PC3-6400-PC3-10660)<br />
QS<br />
PC3-10660<br />
256 Meg x 8 DR (PC3-6400-PC3-8500)<br />
128 Meg x 8 DR (PC3-6400-PC3-10660)<br />
PC3-12800<br />
128 Meg x 8 SR (PC3-6400-PC3-10660)<br />
PC3-12800<br />
64 Meg x 16 SR (PC3-6400-PC3-10660)<br />
1Q<br />
CY2010
QS<br />
ES<br />
Qual<br />
Samples<br />
Engineering<br />
Samples<br />
8GB<br />
4GB<br />
2GB<br />
1GB<br />
512MB<br />
<strong>DDR3</strong> SODIMM Road Map<br />
Dates are estimates only. All information is subject to change without notice.<br />
Rev. 3/19/2007<br />
©2007 <strong>Micron</strong> Technology, Inc. All rights reserved.<br />
2Q<br />
QS<br />
QS<br />
2Q<br />
CY2007<br />
3Q<br />
3Q<br />
CY2007<br />
Notes: SR = single rank; DR = dual rank<br />
ES<br />
ES<br />
ES<br />
4Q<br />
QS<br />
4Q<br />
QS<br />
QS<br />
1Q<br />
1Q<br />
2Q<br />
PC3-12800<br />
PC3-12800<br />
PC3-12800<br />
PC3-12800<br />
PC3-12800<br />
2Q<br />
CY2008<br />
CY2008<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
ES<br />
1Q<br />
1Q<br />
2Q<br />
2Q<br />
CY2009<br />
CY2009<br />
3Q<br />
3Q<br />
4Q<br />
4Q<br />
CY2010<br />
1Q<br />
512 Meg x 8 DR TwinDIe (PC3-6400-PC3-10660)<br />
QS<br />
256 Meg x 8 DR TwinDIe (PC3-6400-PC3-10660)<br />
128 Meg x 8 DR (PC3-6400-PC3-10660)<br />
128 Meg x 16 DR (PC3-6400-PC3-10660)<br />
64 Meg x 16 DR (PC3-6400-PC3-10660)<br />
64 Meg x 16 SR (PC3-6400-PC3-10660)<br />
1Q<br />
CY2010
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