Photoresist
Photoresist
Photoresist
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Positive resist<br />
In i-line and g-line exposures, a class of compounds, DQN<br />
DQ: diazoquinone is the PAC and the resin material is<br />
Novolac (benzene ring with substituted methyl and OH<br />
groups)<br />
-evolved from materials to make blueprints<br />
Solvents added to adjust viscosity, much of this evaporates<br />
before the exposure is done<br />
Figure 8.4 Meta-Cresol novolac, a commonly used resin<br />
material in g- and i-line applications. The basic ring<br />
structure may be repeated from 5 to 200 times.<br />
Figure 8.5 Diazo quinone (DQ), the<br />
most commonly used photoactive<br />
compound for g- and i-line<br />
applications. The right-hand ring is not<br />
an aromatic but has a double bond.
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