Photoresist

More documents

Recommendations

Info

Absorbance: a decrease in absorption of the photoresist after it has been exposed is called “bleaching” . Bleaching can provide a more uniform exposure because as the top layers of the resist are exposed, they become partially transparent, allowing a fuller exposure of the lower layers. Figure 8.13 Total absorbance of a layer of SPR511-A resist before and after exposure. The difference between the two curves is the actinic absorbance (courtesy Shipley).
Exposing resist over topology causes resist thickness variations; this has created a need for planarization of the layers → chemical mechanical planarization (CMP) Figure 8.14 Cross-sectional view of resist as it covers a vertical step.
Page 1 and 2: Chapter 8 Photoresists
Page 3 and 4: Photoresists (PR) or resists Three
Page 5 and 6: Substitute: Methyl group Chlorine A
Page 7 and 8: Positive resist In i-line and g-lin
Page 9 and 10: Light, water are the main drivers o
Page 11 and 12: Contrast, γ , is the slope of the
Page 13 and 14: Figure 8.9 Typical process flow in
Page 15: Industrial systems are called “co

Photoresist

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?