Photoresist
Photoresist Photoresist
Effects of hardbake temperature; resist profile tends to reflow at high hardbake temperatures. Figure 8.11 Resist profiles of a 1-µm line and space and a large feature in SPR-2FX resist for different hardbake temperatures (courtesy Shipley).
Industrial systems are called “coat and develop tracks” where wafers move from hotplates to PR dispensing stations, spin coating platforms, etc. Figure 8.12 Top view of a photoresist processing system including cassette load and unload, resist application, bake and From: develop stations, and a central robot; more http://classoneequipment.com/equipdetails.aspEQID t / i t il modern systems are in a controlled =853 environment and integrated into an exposure tool (courtesy silicon Valley Group).
- Page 1 and 2: Chapter 8 Photoresists
- Page 3 and 4: Photoresists (PR) or resists Three
- Page 5 and 6: Substitute: Methyl group Chlorine A
- Page 7 and 8: Positive resist In i-line and g-lin
- Page 9 and 10: Light, water are the main drivers o
- Page 11 and 12: Contrast, γ , is the slope of the
- Page 13: Figure 8.9 Typical process flow in
- Page 17: Exposing resist over topology cause
Effects of hardbake temperature;<br />
resist profile tends to reflow at<br />
high hardbake temperatures.<br />
Figure 8.11 Resist profiles of a 1-µm line and<br />
space and a large feature in SPR-2FX resist for<br />
different hardbake temperatures (courtesy<br />
Shipley).
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