Chapter 12 Physical Vapor Deposition (PVD)

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Step Coverage If the substrate surface is not planar, the long mfp in evaporation means that evaporated material will follow a straight line; some areas are “shadowed” AR = step height step diameter Helps to rotate and heat the substrates. Planetary holders rotate simultaneously around two axes. Figure <strong>12</strong>.5 (A) Time evolution of the evaporative coating of a feature with aspect ratio of 1.0, with little surface atom mobility (i.e., low substrate temperature) and no rotation. (B) Final profile of deposition on rotated and heated substrates.
Evaporator systems: crucible heating techniques Resistively Heated Figure <strong>12</strong>.7 Resistive evaporator sources. (A) Simple sources including heating the charge itself and using a coil of refractory metal heater coil and a charge rod. (B) More standard thermal sources including a dimpled boat in resistive media.
Page 1 and 2: Chapter 12 Physical Vapor Depositio
Page 3 and 4: Evaporation Process: *Chamber under
Page 5: Deposition rate depends on position
Page 9 and 10: Evaporator systems: crucible heatin
Page 11 and 12: Evaporation of Alloys Figure 12.11
Page 13 and 14: Basic steps in sputter deposition:
Page 15 and 16: Sputter Yield (S) Determines rate o
Page 17 and 18: Magnetron Sputtering - a magnetic f
Page 19 and 20: Film morphology Zone model (Zones 1
Page 21 and 22: Can improve step coverage by collim
Page 23 and 24: Reactive sputtering: use of reactiv
Page 25 and 26: A thin film deposited on a substrat

Chapter 12 Physical Vapor Deposition (PVD)

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