Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD) Chapter 12 Physical Vapor Deposition (PVD)
Step Coverage If the substrate surface is not planar, the long mfp in evaporation means that evaporated material will follow a straight line; some areas are “shadowed” AR = step height step diameter Helps to rotate and heat the substrates. Planetary holders rotate simultaneously around two axes. Figure 12.5 (A) Time evolution of the evaporative coating of a feature with aspect ratio of 1.0, with little surface atom mobility (i.e., low substrate temperature) and no rotation. (B) Final profile of deposition on rotated and heated substrates.
Evaporator systems: crucible heating techniques Resistively Heated Figure 12.7 Resistive evaporator sources. (A) Simple sources including heating the charge itself and using a coil of refractory metal heater coil and a charge rod. (B) More standard thermal sources including a dimpled boat in resistive media.
- Page 1 and 2: Chapter 12 Physical Vapor Depositio
- Page 3 and 4: Evaporation Process: *Chamber under
- Page 5: Deposition rate depends on position
- Page 9 and 10: Evaporator systems: crucible heatin
- Page 11 and 12: Evaporation of Alloys Figure 12.11
- Page 13 and 14: Basic steps in sputter deposition:
- Page 15 and 16: Sputter Yield (S) Determines rate o
- Page 17 and 18: Magnetron Sputtering - a magnetic f
- Page 19 and 20: Film morphology Zone model (Zones 1
- Page 21 and 22: Can improve step coverage by collim
- Page 23 and 24: Reactive sputtering: use of reactiv
- Page 25 and 26: A thin film deposited on a substrat
Step Coverage<br />
If the substrate surface is not<br />
planar, the long mfp in<br />
evaporation means that<br />
evaporated material will follow<br />
a straight line; some areas are<br />
“shadowed”<br />
AR = step height<br />
step diameter<br />
Helps to rotate and heat the<br />
substrates.<br />
Planetary holders rotate<br />
simultaneously around two<br />
axes.<br />
Figure <strong>12</strong>.5 (A) Time evolution of the evaporative<br />
coating of a feature with aspect ratio of 1.0, with<br />
little surface atom mobility (i.e., low substrate<br />
temperature) and no rotation. (B) Final profile of<br />
deposition on rotated and heated substrates.
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