Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
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For reasonable deposition<br />
rates, the vapor pressure<br />
must be ∼ 10 mTorr. This<br />
makes it nearly impossible<br />
ibl<br />
to evaporate some<br />
materials (refractory<br />
metals: Ta, W, Mo, Ti)<br />
Figure <strong>12</strong>.2 <strong>Vapor</strong> pressure curves for some commonly<br />
evaporated materials (data adapted from Alcock et al.).
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