Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD) Chapter 12 Physical Vapor Deposition (PVD)
Sputtering Advantages: Moderately ygood step coverage; ;preferred technique for deposition of alloys, can sputter a wide variety of materials Disadvantages: may have some Argon incorporation in the film; could have some damage to substrate although not as much as in e-beam evaporation
- Page 1 and 2: Chapter 12 Physical Vapor Depositio
- Page 3 and 4: Evaporation Process: *Chamber under
- Page 5 and 6: Deposition rate depends on position
- Page 7 and 8: Evaporator systems: crucible heatin
- Page 9 and 10: Evaporator systems: crucible heatin
- Page 11 and 12: Evaporation of Alloys Figure 12.11
- Page 13 and 14: Basic steps in sputter deposition:
- Page 15 and 16: Sputter Yield (S) Determines rate o
- Page 17 and 18: Magnetron Sputtering - a magnetic f
- Page 19 and 20: Film morphology Zone model (Zones 1
- Page 21 and 22: Can improve step coverage by collim
- Page 23 and 24: Reactive sputtering: use of reactiv
- Page 25: A thin film deposited on a substrat
Sputtering<br />
Advantages: Moderately ygood step coverage; ;preferred<br />
technique for deposition of alloys, can sputter a wide variety of<br />
materials<br />
Disadvantages: may have some Argon incorporation in the film;<br />
could have some damage to substrate although not as much as in<br />
e-beam evaporation
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