Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
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A thin film deposited on a substrate can be either in tensile stress or<br />
compressive stress; if stress is too large, film may peel away from<br />
the surface; implications in reliability.<br />
Figure <strong>12</strong>.30 The change in wafer deflection may be used to<br />
measure the stress in a deposited layer. This is typically measured<br />
using a reflected laser beam.
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