Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
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Ionized Metal Plasma (IMP) sputter deposition – ejected<br />
atoms pass through a second plasma; IMP process produces<br />
near-vertical deposition.<br />
Figure <strong>12</strong>.25 The Endura system by Applied Materials uses a number of <strong>PVD</strong> or CVD chambers<br />
fed by a central robot. For conventional and IMP sputtering, targets are hinged to open upward. Two<br />
open chambers are shown, along with the load lock (from Applied Materials).
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