Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
SHOW LESS
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Can improve step coverage by collimated sputtering or<br />
application of a bias to the wafer.<br />
Figure <strong>12</strong>.24 In collimated sputtering a<br />
disposable collimator is placed close to the<br />
wafers to increase directionality.<br />
Figure <strong>12</strong>.26 In bias sputtering, the ions<br />
incident on the surface of the wafer<br />
redistribute the deposited film to improve<br />
step coverage.
Change language