Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
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<strong>PVD</strong> methods:<br />
Evaporation – condensation of metal vapor in<br />
high vacuum to deposit a thin film on a wafer; unable to<br />
cover severe topology (poor step coverage) which is<br />
beneficial when doing lift-off patterning; also hard to<br />
deposit alloys due to possible difference in melting<br />
points.<br />
Sputtering - use of plasma and acceleration of<br />
ions towards a target; material “sputtered” from the<br />
target and deposited on the wafer; extensively used in Si<br />
technology; moderate step coverage.
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