Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
Chapter 12 Physical Vapor Deposition (PVD)
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Sputter Yield (S)<br />
Determines rate of sputter deposition<br />
S = # target atoms ejected/number of<br />
ions incident<br />
Depends on:<br />
•Target material<br />
•Mass of bombarding ions<br />
•Energy of bombarding ions<br />
Each target material has a threshold<br />
energy (below that energy no<br />
sputtering occurs), typically 10-30 eV.<br />
Figure <strong>12</strong>.14 Sputter yield as a function of ion<br />
energy for normal incidence id argon ions for a<br />
variety of materials (after Anderson and Bay,<br />
reprinted by permission).
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