Wafer Level Reliability Testing

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Wafer Level Reliability Testing
Probe Systems
www.suss.com

The Celadon 220 mm Probecard tile
Celadon uses the inherent benefits of ceramic –
high resisivity and low noise to make ideal low leakage
probe cards for reliability testing. The Celadon
Ceramic Tile TM which anchors the probe needles
in place is mounted mounted on a rigid aluminum
chassis which can be configured with several
different connector housings depending on the
test requirements. The large 220mm tiles used in
this application are designed to provide total wafer
coverage, enabling probe placement anywhere on
the wafer.
whole wafer. This movement has been especially
designed with user comfort in mind and has the
control knobs ergonomically placed on the righthand
side of the prober so that one-handed use is
possible. Single chip stepping is accurately undertaken
with a high resolution chuck stage.
The Keithley 4200 Semiconductor
Characterization System
The Celadon tiles and chassis have been designed
to operate consistently for thousands of hours at
300°C with no deterioration in electrical performance.
The rigid ceramic prevents any flex or movement
with empirical evidence indicating little or no observable
movement in the probes during use. High
current and high voltage probes are also available.
The SUSS PM8WLR ProbeShield
The PM8WLR ProbeShield is a light-tight, EMI
shielded probe system which has been especially
designed with the demands of wafer level reliability in
mind. The prober contains a thermal chuck which has
a temperature range from – 60°C to + 300°C and the
ProbeShield's rinsing system ensures frost-free
conditions when probing at sub-zero temperatures.
The Model 4200-SCS provides a total system
solution for DC characterization and stress-measure/
reliability testing of semiconductor devices and test
structures. This advanced parameter analyzer
provides intuitive and sophisticated capabilities for
semiconductor device characterization. The 4200-
SCS combines unprecedented measurement
speed and accuracy with an embedded Windows
NT- or XP based PC and the Keithley Interactive
Test Environment (KITE) to provide a powerful singlebox
solution.
Modular and configurable, the Model 4200-SCS
supports up to eight Source-Measure Units,
including up to four high power SMUs with 1A/20W
capability. An optional Remote PreAmp extends the
resolution of any Source-Measure Unit from 100fA
to 0.1fA.
Probe Systems
Because the probe card contacts all dies simultaneously,
the microscope and not the chuck must
move to perform correct probe to pad alignment.
This PM8 has a special microscope stage which
can move 200 mm in both X & Y to cover the

A Unique Multi-site, Wafer Level Solution for Reliability Testing
The demands of today’s technologies require
precise and economical characterization. Until now,
long-term testing of wafers took a great deal of both
time and money as devices had to be packaged
before testing. Recent innovations in thinner oxides
and gate dielectrics makes packaging devices
without damaging them difficult.
Developed to meet the critical needs of 90 nm or
smaller process technologies used by semiconductor
manufacturers, the SUSS PM8WLR Probe-
Shield system, in combination with Celadon probe
cards and Keithley measurement equipment, provides
long-term process reliability at temperatures up
to 300°C.
In order to prevent the loss of processed and therefore
expensive wafers, it has become essential to
be able to perform reliability tests on the wafer itself.
The importance of this test option will grow in the
near future as process technologies move towards
the 90 nm range. Multi-site probing speeds up the
process and enables the test engineer to obtain
reasonable sample sizes. The need to measure and
characterize now demands low leakage measurement
equipment which can withstand temperatures
up to and exceeding 300°C which accelerates
failure mechanisms.
The SUSS PM8WLR ProbeShield ® system has been
especially developed for extremely accurate, hightemperature,
multi-site Wafer Level Reliability (WLR)
measurements, such as:
● Electro-migration
● TDDB
● Hot carrier
● Wafer level burn-in
● Life test
● Device characterization
Features and Benefits
• Light-tight and EMI shielded environment for
ultra low-signal measurements
• Rinsing system for a frost-free environment
down to –60°C
• Celadon’s 220 mm round probe cards provide
total coverage for 150 mm & 200 mm wafers
• Feed-through’s for 14 x 25 triaxial low-leakage
cable harnesses: max. 350 different electrical
signals
• 50 x 50 mm X-Y high resolution chuck stage
for one chip stepping
• Extremely rigid and stable Z-chuck axis for
high temperature and long time testing with
high pin count probe cards
• 200 x 200 mm X-Y ergonomic microscope
movement with one handed operation
• Ergonomic wafer load/unload via a pull-out
chuck system

Wafer Level Reliability
Testing vs. Packaged
Part Testing
Saving both time and money
A simple application example can show the
savings that can be gained from multi-site
testing at wafer level. This example examines
the time factor in TDDB testing
Packaged Die: Time 300 hours
Because a packaged part tester is noisy in
itself, the engineer must wait for the leakage
values to significantly increase above the
machine's noise floor before he can be confident
of accurate results.
Wafer Level Testing: Time 12 Hours
The much lower noise floor of the parametric
analyzer, analytical probe station, and probe
card allowed the customer to see precise
leakage trends in an "over-night” test.
Both packaged and wafer level tests were run at the
same temperature and electrical stress levels.
Microscope & mount provide necessary
long working distance
Customized Celadon 220 mm round
high-temperature probe card
Customized thermal chuck
Temp. range: -60°C to + 300°C
50 x 50 mm X - Y high resolution chuck
stage with extremely stable Z-chuck axis
SUSS ProbeShield EMC:
Light-tight, frost-free probing in an EMI
shielded environment
200 x 200 mm X-Y one-handed microscope
travel incl. fast and fine movement

Keithley 4200:
Advanced Parameter Analyzer with
point and click Window's ® based
functionality
Probe Systems
Special remote adjustment and levelling
tool for the Celadon Probecard

ASIA
SUSS MicroTec KK (Japan)
GITC 1-18-2, Hakusan, Midori-ku
Yokohama, Kanagawa, Japan 226-0006
Phone (+81)-45-9 31-56 00
Fax (+81)-45-931-56 01
EUROPE
SUSS MicroTec S.A.S.
131, impasse Bartheudet · BP24
F-74490 Saint Jeoire · France
Phone (+33)-(0) 4 50 35 83 92
Fax (+33)-(0) 4 50 35 88 01
JZ/DD · 04/2004
SUSS MicroTec (Shanghai) Co., Ltd.
580 Nanjing W. Rd · Nanzheng Building Room 606
200041 Shanghai · PRC
Phone (+86) 21-52 34 04 32
Fax (+86) 21-52 34 04 30
SUSS MicroTec (Taiwan) Co., Ltd.
8F-11 · No. 81 · Shui-Lee Road
Hsin-Chu · 300 · Taiwan
Phone (+886)-(3)-5 16 90 98
Fax (+886)-(3)-5 16 92 62
SUSS MicroTec Co., Ltd.
(South and Southeast Asia)
3388/92-93 · 25th Floor · Sirinrat Building
Rama IV Road · Klongtoey
Bangkok 10110 · Thailand
Phone (+66)-(0)-23 50 60 38
Fax (+66)-(0)-26 33 57 28
SUSS MicroTec Test Systems GmbH
Süss-Strasse 1 · D-01561 Sacka/Dresden
Germany
Phone (+49)-(0) 35240-73-0
Fax (+49)-(0) 35240-73-700
NORTH AMERICA
SUSS MicroTec Inc.
228 Suss Drive
Waterbury Center, VT 05677 · USA
Phone (+1) (802) 244-5181
Fax (+1) (802) 244-7853
SUSS MicroTec Inc.
Western Regional Sales Office
8240 So. Kyrene Road Suite 101
Tempe, AZ 85284-2117 · USA
Phone (+1) (480) 557-9370
Fax (+1) (480) 557-9371
PM8WLR · DE · 04/2004 · #1 · 2000
www.suss.com
SUSS WLR Test Partners featured in Brochure:
www.celadonsystems.com
www.keithley.com