PS7341(L) - California Eastern Laboratories

Solid State Relay
OCMOS FET
PS7341-1A,PS7341L-1A
6-PIN DIP, HIGH ISOLATION VOLTAGE
400 V BREAK DOWN VOLTAGE
NORMALLY OPEN TYPE
1-ch Optical Coupled MOS FET
−NEPOC Series−
DESCRIPTION
The PS7341-1A and PS7341L-1A are solid state relays containing GaAs LEDs on the light emitting side (input side)
and MOS FETs on the output side.
They are suitable for analog signal control because of their low offset and high linearity.
The PS7341L-1A has a surface mount type lead.
FEATURES
• High isolation voltage (BV = 3 750 Vr.m.s.)
• 1 channel type (1 a output)
• Low LED Operating Current (IF = 2 mA)
• Designed for AC/DC switching line changer
• Small package (6-pin DIP)
• Low offset voltage
• Ordering number of taping product : PS7341L-1A-E3, E4: 1 000 pcs/reel
• Pb-Free product
• Safety standards
• UL approved: File No. E72422
• BSI approved: No. 8252/8253
• CSA approved: No. CA 101391
• SEMKO approved: No. 606398
• DEMKO approved: No. 309836
• NEMKO approved: No. P00100964
• FIMKO approved: No. FI 15188
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Exchange equipment
• Measurement equipment
• FA/OA equipment
Document No. PN10306EJ02V0DS (2nd edition)
Date Published September 2006 NS CP(K)
The mark shows major revised points.
The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
1996, 2006

PS7341-1A,PS7341L-1A
PACKAGE DIMENSIONS (in millimeters)
PS7341-1A
9.25±0.5
6 5 4
1 2 3
TOP VIEW
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
7.62
6.5±0.5
4.15±0.3
3.5±0.3
3.3±0.3
0.5±0.1
1.34±0.1
0.25 M
2.54
0 to 15˚
PS7341L-1A
9.25±0.5
6 5 4
1 2 3
TOP VIEW
1. LED Anode
2. LED Cathode
3. NC
4. MOS FET Drain
5. MOS FET Source
6. MOS FET Drain
6.5±0.5
3.5±0.3
0.10 +0.10
–0.05
1.34±0.1
0.25 M
2.54
0.9±0.25
9.60±0.4
2
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
MARKING EXAMPLE
No. 1 pin
Mark
PS7341-1A
NL601
Country Assembled
Type Number
Assembly Lot
N L 6 01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
(L: Pb-Free)
Rank Code
Data Sheet PN10306EJ02V0DS 3

PS7341-1A,PS7341L-1A
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number *1
PS7341-1A PS7341-1A-A Pb-Free Magazine case 50 pcs Standard products PS7341-1A
PS7341L-1A PS7341L-1A-A (UL, BSI, CSA, SEMKO,
PS7341L-1A-E3 PS7341L-1A-E3-A Embossed Tape 1 000 pcs/reel DEMKO, NEMKO,
PS7341L-1A-E4 PS7341L-1A-E4-A FIMKO approved)
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) IF 50 mA
Reverse Voltage VR 5.0 V
Power Dissipation PD 50 mW
Peak Forward Current *1 IFP 1 A
MOS FET Break Down Voltage VL 400 V
Continuous Connection A IL 150 mA
Load Current *2 Connection B 200
Connection C 300
Pulse Load Current *3
(AC/DC Connection)
ILP 300 mA
Power Dissipation PD 560 mW
Isolation Voltage *4 BV 3 750 Vr.m.s.
Total Power Dissipation PT 610 mW
Operating Ambient Temperature TA −40 to +85 °C
Storage Temperature Tstg −40 to +125 °C
*1 PW = 100 µs, Duty Cycle = 1%
*2 Conditions: IF ≥ 2 mA. The following types of load connections are available.
Connection A
Connection B
Connection C
6
1
2 5
3
4
6
1
2
5
3 4
1 6
2
5
3
4
1
2
3
6
5
4
IL
IL
IL
IL
IL
L
L
L
L
IL + IL
+
–
–
+
+
–
VL (AC/DC)
VL (DC)
VL (DC)
VL (DC)
*3 PW = 100 ms, 1 shot
*4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
Pins 1-3 shorted together, 4-6 shorted together.
Data Sheet PN10306EJ02V0DS 5

PS7341-1A,PS7341L-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameter Symbol MIN. TYP. MAX. Unit
LED Operating Current IF 2 10 20 mA
LED Off Voltage VF 0 0.5 V
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 10 mA 1.2 1.4 V
Reverse Current IR VR = 5 V 5.0 µA
MOS FET Off-state Leakage Current ILoff VD = 400 V 0.03 1.0 µA
Output Capacitance Cout VD = 0 V, f = 1 MHz 65 pF
Coupled LED On-state Current IFon IL = 150 mA 2.0 mA
On-state Resistance Ron1 IF = 10 mA, IL = 10 mA 20 30 Ω
Ron2 IF = 10 mA, IL = 150 mA, t ≤ 10 ms 16 25
Turn-on Time *1, 2 ton IF = 10 mA, VO = 5 V, RL = 2 kΩ, 0.35 1.0 ms
Turn-off Time *1, 2 toff PW ≥ 10 ms 0.03 0.2
Isolation Resistance RI-O VI-O = 1.0 kVDC 10 9 Ω
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 1.1 pF
*1 Test Circuit for Switching Time
Pulse Input
IF
VL
Input
50 %
0
Input monitor
VO monitor
VO = 5 V
Output
90 %
Rin
RL
10 %
ton
toff
*2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms.
Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off
time will increase.
6
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
100
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
300
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
Maximum Forward Current IF (mA)
80
60
40
20
Maximum Load Current IL (mA)
200
100
0
–25
0
25
50
75
85
100
0
–25 0 25 50
75
85
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
Forward Voltage VF (V)
1.8
1.6
1.4
1.2
1.0
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1 mA
Output Capacitance Cout (pF)
200
150
100
50
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
f = 1 MHz
0.8
–25 0 25 50 75
100
0
20 40 60 80 100 120
Ambient Temperature TA (˚C)
Applied Voltage VD (V)
Off-state Leakage Current ILoff (A)
10 –5
10 –6
10 –7
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
TA = 85 ˚C
25 ˚C
10 –8
10
0 100 200 300 400
Applied Voltage VD (V)
500
Load Current IL (mA)
LOAD CURRENT vs. LOAD VOLTAGE
200
100
Load Voltage VL (V)
IF = 10 mA
–4.0 –2.0 0 2.0 4.0
–100
–200
Remark The graphs indicate nominal characteristics.
Data Sheet PN10306EJ02V0DS 7

PS7341-1A,PS7341L-1A
Normalized On-state Resistance Ron
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
3.0
2.5
2.0
1.5
1.0
0.5
0.0
–25 0
25
50
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
IL = 10 mA
75
Ambient Temperature TA (˚C)
100
Number (pcs)
ON-STATE RESISTANCE DISTRIBUTION
30
25
20
15
10
5
0
20 21
On-state Resistance Ron (Ω)
n = 50 pcs,
IF = 10 mA,
IL = 10 mA
TURN-ON TIME vs. FORWARD CURRENT
12
VO = 5 V
10
TURN-OFF TIME vs. FORWARD CURRENT
0.30
VO = 5 V
0.25
Turn-on Time ton (ms)
8
6
4
Turn-off Time toff (ms)
0.20
0.15
0.10
2
0.05
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Forward Current IF (mA)
Forward Current IF (mA)
30
25
TURN-ON TIME DISTRIBUTION
n = 50 pcs,
IF = 10 mA,
VO = 5 V
30
25
TURN-OFF TIME DISTRIBUTION
n = 50 pcs,
IF = 10 mA,
VO = 5 V
Number (pcs)
20
15
10
Number (pcs)
20
15
10
5
5
0
0.3 0.4
0
0.03 0.05
Turn-on Time ton (ms)
Turn-off Time toff (ms)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
Normalized Turn-on Time ton
3.0
2.5
2.0
1.5
1.0
0.5
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
Normalized Turn-off Time toff
3.0
2.5
2.0
1.5
1.0
0.5
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
0.0
–25 0 25 50 75
100
0.0
–25 0 25 50 75
100
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10306EJ02V0DS 9

PS7341-1A,PS7341L-1A
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.5 +0.1
–0
1.75±0.1
4.5 MAX.
7.5±0.1
16.0±0.3
10.3±0.1
1.55±0.1
10.4±0.1
4.0±0.1
12.0±0.1
0.3
Tape Direction
PS7341L-1A-E3
PS7341L-1A-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
R 1.0
21.0±0.8
330±2.0
100±1.0
17.5±1.0
21.5±1.0
Packing: 1 000 pcs/reel
15.9 to 19.4
Outer edge of
flange
10
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
Two
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (˚C)
120˚C
120±30 s
(preheating)
180˚C
(heating)
to 10 s
to 60 s
260˚C MAX.
220˚C
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
• Time (each pins)
• Flux
350°C or below
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10306EJ02V0DS 11

PS7341-1A,PS7341L-1A
(4) Cautions
• To avoid quality degradation, assembling within 1 month after take this device out from covered pack is required.
(Storage conditions 25°C, 65%RH MAX.)
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
12
Data Sheet PN10306EJ02V0DS

PS7341-1A,PS7341L-1A
• The information in this document is current as of September, 2006. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
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customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated
"quality assurance program" for a specific application. The recommended applications of an NEC
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PN10306EJ02V0DS 13

PS7341-1A,PS7341L-1A
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: contact@ncsd-hk.necel.com
Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309
Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.eu.necel.com/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
0604