Master Thesis - OUFTI-1

More documents

Recommendations

Info

4.3 Application to the homemade on-board computer of OUFTI-1 Now, the several methods discussed through section 4.2 will be applied to the particular case of the homemade OBC of OUFTI-1. This electronic card is located just above the FM 430 card from Pumpkin (as shown in Figure 4.11). Figure 4.11: Location of the OBC 2 card in OUFTI-1 4.3.1 Denition of the PCB properties Each electronic card of OUFTI-1 was manufactured by Deltatec [55], a very high-level design house specialized in advanced technologies. They provided us the properties of the FR 4 material they used to manufacture the PCB of the OUFTI-1 electronic cards. These properties are presented in Table 4.2. Properties Values Young's modulus 20 GP a Poisson ratio 0.3 Density 2200 kg/m 3 Ultimate stress 423 MP a Table 4.2: Properties of the FR 4 material 85
Their study was based on the fact that the material is isotropic. They did not determine the anisotropic values because, owing to the PCB assembly (which is a piling up of several layers of FR 4 and copper), these values are too complicated to obtain. So, anisotropic FE model of the PCB can not be performed in this thesis. Finally, they give us a value of 1.6 mm for the PCB thickness. But, measuring it by ourselves, the values obtained are included in a range of: [1.65 − 1.75 mm]. So, the value which will be imposed to our FE models, is 1.7 mm. The mesh elements that will be used to mesh the PCB of the OBC 2 card, as already mentioned in section 4.2.4, are shell elements. Finally, for the damping, according to reference [49], a modal damping of 2% is a quite representative value for a PCB because there is a great friction between the dierent layers which constitute it. In our case, a value of 1% will be applied to the model to keep a security margin of 1%. 4.3.2 Recognition of the components eects First of all, we have to decide which type of components will be taken into account in the FE model of the OBC 2. As already mentioned, these components can be divided into three dierent categories: light, SMT and heavy components. The classication of components soldered to this card, is presented in Figure 4.12. Figure 4.12: Components classication of the OBC 2 card 86
Page 1 and 2:
University of Liège Faculty of App
Page 3 and 4:
Abstract OUFTI-1, standing for "Orb
Page 5 and 6:
3.4 Initial idea . . . . . . . . .
Page 7 and 8:
List of Figures 1.1 The Pumpkin's C
Page 9 and 10:
4.18 MAC matrix using the simple me
Page 11 and 12:
List of Acronyms ADCS Al AlNiCo ASI
Page 13 and 14:
Thesis outline This thesis focuses
Page 15 and 16:
of larger satellites. So, the CubeS
Page 17 and 18:
1.2 OUFTI-1 project 1.2.1 Genesis O
Page 19 and 20:
• XatCobeo (Vigo - Spain): Develo
Page 21 and 22:
Chapter 2 OUFTI-1: Flight system co
Page 23 and 24:
Figure 2.2: Product tree of OUFTI-1
Page 25 and 26:
2.3.2 Solar panels The armor panels
Page 27 and 28:
• We do not want to drill or manu
Page 29 and 30:
In our case, because of the limited
Page 31 and 32:
Figure 2.13: Magnetic eld obtained
Page 33 and 34:
Figure 2.17: Pictures of the ADCS c
Page 35 and 36: consider the possibility of oshorin
Page 37 and 38: Figure 2.20: Exploded view of OUFTI
Page 39 and 40: I xx , I yy and I zz are called the
Page 41 and 42: Subsystem: Structure & Conguration
Page 43 and 44: Subsystem: Thermal Control Parts Co
Page 45 and 46: Chapter 3 Design of a new support f
Page 47 and 48: Figure 3.3: Batteries during and af
Page 49 and 50: The concept is the following one: F
Page 51 and 52: A test under vacuum conditions was
Page 53 and 54: Thermal Expansion (CTE) of the mate
Page 55 and 56: Figure 3.9: Classication by density
Page 57 and 58: The last property to determine is t
Page 59 and 60: • So, it was decided to use two t
Page 61 and 62: is to prevent the batteries' bulge.
Page 63 and 64: • Then, the thermostats, that wil
Page 65 and 66: Figure 3.23: Schematics of the cove
Page 67 and 68: • Other components, including the
Page 69 and 70: 3.9.3 Dynamic behavior Finally, it
Page 71 and 72: 3.10 Summary Through this chapter,
Page 73 and 74: Chapter 4 Electronic cards dynamic
Page 75 and 76: Figure 4.1: Example of manufacturin
Page 77 and 78: Figure 4.4: Illustration of the exp
Page 79 and 80: Figure 4.5: MAC between the two mod
Page 81 and 82: • Global mass/stiness smearing me
Page 83 and 84: 4.2.6 Modeling of the chassis A gen
Page 85: Q = ω k = 1 ω b − ω a 2 ζ ⇒
Page 89 and 90: Figure 4.14: Example of spacecraft
Page 91 and 92: Figure 4.15: Location of measuremen
Page 93 and 94: Figure 4.18: MAC matrix using the s
Page 95 and 96: 4.3.6 Application of the local mass
Page 97 and 98: ρ P C 104 connector = 10.12 × 10
Page 99 and 100: According to this particular shape,
Page 101 and 102: This is due to the fact that this c
Page 103 and 104: environment. Then, this model is ex
Page 105 and 106: 5.2.4 Antenna support For the anten
Page 107 and 108: Components Young's moduli (GP a) Po
Page 109 and 110: Components Young's moduli (GP a) Po
Page 111 and 112: 5.3 Static analysis As described in
Page 113 and 114: Figure 5.9: Illustration of the com
Page 115 and 116: Figure 5.11: Maximal Von Mises stre
Page 117 and 118: Figure 5.12: First mode of OUFTI-1
Page 119 and 120: Figure 5.15: Precise PSD of Vega [5
Page 121 and 122: Chapter 6 Conclusions This master t
Page 123 and 124: provided for each method used. We h
Page 125 and 126: last versions of the Verication Con
Page 127 and 128: [13] Ph. LEDENT. "Design and Implem
Page 129 and 130: [40] "Dejond - Aluminum Catalog ".
Page 131 and 132: Appendix A Schemas of solar panels
Page 133 and 134: Appendix B Schemas of electronic ca
Page 135 and 136: Appendix C Fixations of the endless
Page 137 and 138:
Appendix D Datasheet of the battery
show all

Master Thesis - OUFTI-1

Create successful ePaper yourself

Delete template?

Save as template?