Master Thesis - OUFTI-1
Master Thesis - OUFTI-1 Master Thesis - OUFTI-1
Contents 1 Introduction 13 1.1 The CubeSat program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 1.1.1 The concept . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 1.1.2 The Pumpkin's CubeSat kit . . . . . . . . . . . . . . . . . . . . . . 14 1.1.3 The P-POD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 1.2 OUFTI-1 project . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 1.2.1 Genesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 1.2.2 The launch opportunity . . . . . . . . . . . . . . . . . . . . . . . . 16 1.2.3 Mission objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 1.2.4 OUFTI team . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2 OUFTI-1: Flight system conguration and general properties 20 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.2 Reference frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.3 Flight system conguration . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.1 Skeleton . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3.2 Solar panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.3 Antenna support . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.4 Permanent magnet and hysteretic bars . . . . . . . . . . . . . . . . 27 2.3.5 Electronic cards and battery support . . . . . . . . . . . . . . . . . 32 2.4 Physical properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.4.1 Catia modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.4.2 Center of gravity . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.4.3 Inertia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2.5 Mass budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.6 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3 Design of a new support for the batteries 44 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 3.2 Problems encountered with the last year's design . . . . . . . . . . . . . . 44 3.3 Available mass budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 3
3.4 Initial idea . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 3.5 Battery selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 3.6 Material selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 3.6.1 Denition of the requirements . . . . . . . . . . . . . . . . . . . . . 51 3.6.2 Objective function and CES software . . . . . . . . . . . . . . . . . 53 3.7 Thermal control's devices selection . . . . . . . . . . . . . . . . . . . . . . 55 3.7.1 Heaters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 3.7.2 Heaters' control system . . . . . . . . . . . . . . . . . . . . . . . . . 56 3.7.3 Thermal insulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 3.8 Final design of the support . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 3.9 Validation of the design . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 3.9.1 Mass budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 3.9.2 Static loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 3.9.3 Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 3.10 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 4 Electronic cards dynamic modeling 72 4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 4.2 State-of-the-art . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 4.2.1 Accuracy of the model . . . . . . . . . . . . . . . . . . . . . . . . . 73 4.2.2 Creating FE models of PCBs . . . . . . . . . . . . . . . . . . . . . 74 4.2.3 Determination of the PCB properties . . . . . . . . . . . . . . . . . 74 4.2.4 Choice of mesh element . . . . . . . . . . . . . . . . . . . . . . . . . 76 4.2.5 Recognition of components eects . . . . . . . . . . . . . . . . . . . 79 4.2.6 Modeling of the chassis . . . . . . . . . . . . . . . . . . . . . . . . . 82 4.2.7 Denition of the boundary conditions . . . . . . . . . . . . . . . . . 82 4.2.8 Introduction of damping . . . . . . . . . . . . . . . . . . . . . . . . 82 4.2.9 Dynamic response computation . . . . . . . . . . . . . . . . . . . . 84 4.3 Application to the homemade on-board computer of OUFTI-1 . . . . . . . 85 4.3.1 Denition of the PCB properties . . . . . . . . . . . . . . . . . . . 85 4.3.2 Recognition of the components eects . . . . . . . . . . . . . . . . . 86 4.3.3 Experimental test of the OBC 2 card . . . . . . . . . . . . . . . . . 88 4.3.4 Application of the simple method . . . . . . . . . . . . . . . . . . . 91 4.3.5 Application of the global mass smearing method . . . . . . . . . . . 93 4.3.6 Application of the local mass smearing method . . . . . . . . . . . 94 4.3.7 Application of a homemade method . . . . . . . . . . . . . . . . . . 95 4.3.8 Sensitivity analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 4.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 4
- Page 1 and 2: University of Liège Faculty of App
- Page 3: Abstract OUFTI-1, standing for "Orb
- Page 7 and 8: List of Figures 1.1 The Pumpkin's C
- Page 9 and 10: 4.18 MAC matrix using the simple me
- Page 11 and 12: List of Acronyms ADCS Al AlNiCo ASI
- Page 13 and 14: Thesis outline This thesis focuses
- Page 15 and 16: of larger satellites. So, the CubeS
- Page 17 and 18: 1.2 OUFTI-1 project 1.2.1 Genesis O
- Page 19 and 20: • XatCobeo (Vigo - Spain): Develo
- Page 21 and 22: Chapter 2 OUFTI-1: Flight system co
- Page 23 and 24: Figure 2.2: Product tree of OUFTI-1
- Page 25 and 26: 2.3.2 Solar panels The armor panels
- Page 27 and 28: • We do not want to drill or manu
- Page 29 and 30: In our case, because of the limited
- Page 31 and 32: Figure 2.13: Magnetic eld obtained
- Page 33 and 34: Figure 2.17: Pictures of the ADCS c
- Page 35 and 36: consider the possibility of oshorin
- Page 37 and 38: Figure 2.20: Exploded view of OUFTI
- Page 39 and 40: I xx , I yy and I zz are called the
- Page 41 and 42: Subsystem: Structure & Conguration
- Page 43 and 44: Subsystem: Thermal Control Parts Co
- Page 45 and 46: Chapter 3 Design of a new support f
- Page 47 and 48: Figure 3.3: Batteries during and af
- Page 49 and 50: The concept is the following one: F
- Page 51 and 52: A test under vacuum conditions was
- Page 53 and 54: Thermal Expansion (CTE) of the mate
3.4 Initial idea . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47<br />
3.5 Battery selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49<br />
3.6 Material selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51<br />
3.6.1 Denition of the requirements . . . . . . . . . . . . . . . . . . . . . 51<br />
3.6.2 Objective function and CES software . . . . . . . . . . . . . . . . . 53<br />
3.7 Thermal control's devices selection . . . . . . . . . . . . . . . . . . . . . . 55<br />
3.7.1 Heaters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55<br />
3.7.2 Heaters' control system . . . . . . . . . . . . . . . . . . . . . . . . . 56<br />
3.7.3 Thermal insulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58<br />
3.8 Final design of the support . . . . . . . . . . . . . . . . . . . . . . . . . . . 59<br />
3.9 Validation of the design . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63<br />
3.9.1 Mass budget . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63<br />
3.9.2 Static loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65<br />
3.9.3 Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 68<br />
3.10 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70<br />
4 Electronic cards dynamic modeling 72<br />
4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72<br />
4.2 State-of-the-art . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72<br />
4.2.1 Accuracy of the model . . . . . . . . . . . . . . . . . . . . . . . . . 73<br />
4.2.2 Creating FE models of PCBs . . . . . . . . . . . . . . . . . . . . . 74<br />
4.2.3 Determination of the PCB properties . . . . . . . . . . . . . . . . . 74<br />
4.2.4 Choice of mesh element . . . . . . . . . . . . . . . . . . . . . . . . . 76<br />
4.2.5 Recognition of components eects . . . . . . . . . . . . . . . . . . . 79<br />
4.2.6 Modeling of the chassis . . . . . . . . . . . . . . . . . . . . . . . . . 82<br />
4.2.7 Denition of the boundary conditions . . . . . . . . . . . . . . . . . 82<br />
4.2.8 Introduction of damping . . . . . . . . . . . . . . . . . . . . . . . . 82<br />
4.2.9 Dynamic response computation . . . . . . . . . . . . . . . . . . . . 84<br />
4.3 Application to the homemade on-board computer of <strong>OUFTI</strong>-1 . . . . . . . 85<br />
4.3.1 Denition of the PCB properties . . . . . . . . . . . . . . . . . . . 85<br />
4.3.2 Recognition of the components eects . . . . . . . . . . . . . . . . . 86<br />
4.3.3 Experimental test of the OBC 2 card . . . . . . . . . . . . . . . . . 88<br />
4.3.4 Application of the simple method . . . . . . . . . . . . . . . . . . . 91<br />
4.3.5 Application of the global mass smearing method . . . . . . . . . . . 93<br />
4.3.6 Application of the local mass smearing method . . . . . . . . . . . 94<br />
4.3.7 Application of a homemade method . . . . . . . . . . . . . . . . . . 95<br />
4.3.8 Sensitivity analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . 97<br />
4.4 Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100<br />
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