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Master Thesis - OUFTI-1

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The xEPS card<br />

This card is presented in Figure 5.5.<br />

Figure 5.5: The xEPS card developed in collaboration with Thales Alenia Space ETCA<br />

Except for one (situated at the top of the image, on the left), all the components of<br />

this card belong to the SMT category. So, once again, all the components will be modeled<br />

using the global mass smearing method. The P C 104 connector will still be modeled using<br />

the same method that in the previous cases. The properties nally obtained for this card,<br />

are presented in Table 5.5.<br />

Components Young's moduli (GP a) Poisson ratios Densities (kg/m 3 )<br />

P C 104 connector 0.846 0.3 1406.923<br />

PCB 20 0.3 3404.345<br />

Table 5.5: Properties of the xEPS card<br />

The COM card<br />

Unfortunately, at the moment when this thesis ends, this card is not yet manufactured.<br />

So, no picture of it can be presented. In addition, no accurate information are available<br />

for this card (e.g., concerning its mass). Its nal mass was estimated to maximum 65 g by<br />

the COM subsystem. So, like for the other electronic cards, the P C 104 connector will be<br />

model accurately and the mass of the other components will be spread out over the entire<br />

PCB. The properties nally obtained for this card, are presented in Table 5.6.<br />

107

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