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Master Thesis - OUFTI-1

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5.2.4 Antenna support<br />

For the antenna support, it was chosen to only model the support itself (made of<br />

Al − 5754). Indeed, due to their negligible mass, the antennas do not play an important<br />

role in the global behavior of the support, as well as the thermal knife and the "Dyneema"<br />

wire. However, owing to its complex geometry, this support can not be modeled using shell<br />

components. So, in this case, volume elements are used (in Samcef, it corresponds to apply<br />

the behavior of "exible volume" on the support).<br />

The xing method is the same as the one used for the solar panels. The support is<br />

connected to the face −X of the chassis using a "glue" assembly.<br />

5.2.5 Electronic cards and battery support<br />

The modeling procedure for the electronic cards was discussed in chapter 4. In this<br />

chapter, it was noted that the best method to realize an accurate FE model of an electronic<br />

card is the homemade method, which uses the following simplications:<br />

• The light components are completely neglected.<br />

• The SMT components are modeled using the global mass smearing method.<br />

• The heavy components, such as the P C 104 connectors, are modeled using a detailed<br />

FE model.<br />

It was also noted that the electronic cards, due to their low thickness (1.7 mm), can be<br />

modeled using shell elements.<br />

So, this method will now be applied to each electronic card individually.<br />

The FM 430 card<br />

This card is presented in Figure 5.2.<br />

Applying the homemade method to this card is not so easy. Indeed, it can be seen that<br />

several heavy components are present on this card. Unfortunately, the properties of these<br />

components are not known so, a detailed FE model of these ones can not be realized. For<br />

this reason, it was decided that the P C 104 connector would be modeled using a detailed<br />

FE model, and the other components would be modeled using the global mass smearing<br />

method. The properties nally obtained for this card, are presented in Table 5.2.<br />

104

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