10.11.2012 Views

Hardware Design Guide Revision 0.3 - elinux

Hardware Design Guide Revision 0.3 - elinux

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9. SMT and Baking Recommendation<br />

9.1. Baking Recommendation<br />

Doc No: WG7310-00-HDG-R03<br />

� Baking condition:<br />

- Follow MSL Level 4 to do baking process.<br />

- After bag is opened, devices that will be subjected to reflow<br />

solder or other high temperature process must be<br />

a) Mounted within 72 hours of factory conditions

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