Hardware Design Guide Revision 0.3 - elinux
Hardware Design Guide Revision 0.3 - elinux
Hardware Design Guide Revision 0.3 - elinux
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9. SMT and Baking Recommendation<br />
9.1. Baking Recommendation<br />
Doc No: WG7310-00-HDG-R03<br />
� Baking condition:<br />
- Follow MSL Level 4 to do baking process.<br />
- After bag is opened, devices that will be subjected to reflow<br />
solder or other high temperature process must be<br />
a) Mounted within 72 hours of factory conditions