Hardware Design Guide Revision 0.3 - elinux

Contents
Doc No: WG7310-00-HDG-R03
1. WG7310 MODULE DESCRIPTION........................................................................3
1.1. WG7310 BLOCK DIAGRAM ...............................................................................3
1.2. PIN DESCRIPTION .................................................................................................4
2. ELECTRICAL CHARACTERISTICS .........................................................................7
2.1. ABSOLUTE MAXIMUM RATINGS.............................................................................7
2.2. RECOMMENDED OPERATING CONDITIONS..........................................................7
2.3. EXTERNAL SLOW CLOCK INPUT (SLEEP_CLK).....................................................7
3. POWER SEQUENCE ................................................................................................9
3.1. WLAN POWER ON SEQUENCE ............................................................................9
3.2. BLUETOOTH POWER UP/DOWN SEQUENCE........................................................10
4. INTERFACE CHARACTERISTICS ......................................................................... 11
4.1. WLAN SDIO CHARACTERISTIC.........................................................................11
4.1.1. SDIO Read Timing ................................................................................ 11
4.1.2. SDIO Interface Write Timing ..............................................................12
4.1.3. SDIO Clock Timing ...................................................................................12
4.2. WLAN WSPI CHARACTERISTICS ........................................................................13
4.2.1. SPI Read/Write Timing.........................................................................13
4.2.2. SPI Clock Timing....................................................................................14
4.3. BLUETOOTH HCI INTERFACE ...............................................................................15
4.4. BLUETOOTH PCM INTERFACE.............................................................................16
5. DEBUG INTERFACE...............................................................................................18
5.1. WLAN RS232 TESTING PORT ............................................................................18
5.2. BLUETOOTH HCI TESTING PORT ..........................................................................18
6. REFERENCE SCHEMATIC.....................................................................................19
7. MODULE MECHANICAL OUTLINE.....................................................................21
8. LAYOUT RECOMMENDATION ...........................................................................22
8.1. RECOMMENDED BUMP PAD DESIGN *...............................................................22
8.2. RECOMMENDED STENCIL DESIGN *....................................................................22
8.3. RECOMMENDED TRACE LAYOUT ........................................................................22
9. SMT AND BAKING RECOMMENDATION ........................................................25
Copyright © JORJIN TECHNOLOGIES INC. LIMITED 2009
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