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sms06 cdc200 flyer 1.qxd - Carl Zeiss

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<strong>Carl</strong> <strong>Zeiss</strong> SMT – Semiconductor Metrology Systems Division<br />

CDC200 –<br />

CD Control Tool for Mask and<br />

Lithography Applications<br />

CDC200 TM is the next generation<br />

on-the-fly solution for high-resolution<br />

Critical Dimension Control<br />

(CDC).<br />

The CDC200 enables both Mask<br />

Makers and IC Manufacturers to<br />

control their Critical Dimensions<br />

and significantly improve CD<br />

Uniformity across masks and<br />

wafers during lithographic<br />

operations.<br />

The CDC200 TM is enabling technology for:<br />

Mask Makers<br />

■ Tune your masks to meet required CD<br />

specifications and for optimal performance<br />

■ Yield improvement and fast turn-around on<br />

all mask types<br />

■ Achieve advanced CD Uniformity specifications<br />

■ Leverage existing installed mask<br />

manufacturing equipment<br />

IC Manufacturers<br />

■ Improve your Lithography Process Window<br />

(PW) and overall productivity<br />

■ “Pellicle on” CD Uniformity improvement<br />

■ Improve yield on any targeted mask level:<br />

dry, immersion, double patterning lithography<br />

■ Improve chip binning: higher speed, lower<br />

leakage, etc.<br />

■ Galileo TM option for in-fab haze detection<br />

Enabling the Nano-Age World ®<br />

We make it visible.


<strong>Carl</strong> <strong>Zeiss</strong> SMT – Semiconductor Metrology Systems Division<br />

CDC200 TM<br />

CD Control Tool For Mask and Lithography Applications<br />

Principles of Operation<br />

Shrinking geometries present a continuous challenge for IC Manufacturers seeking<br />

pinpoint control of their most Critical Dimensions, and subsequent CD distribution<br />

across the mask and the wafer. CDC200 TM features a selection of on-the-fly CDC (Critical<br />

Dimension Control) solutions geared specifically for mask and lithography applications.<br />

The system accurately modifies the local mask transmission (which translates into local<br />

CD changes on the wafer during the lithography process), without removing the<br />

pellicle, thus allowing for tool installations at either the mask manufacturing site,<br />

or at the fab line itself. CDC200’s fully automated mask tuning processes enable<br />

seamless operations via a friendly and easy-to-use GUI. Additionally, an internal<br />

transmission measurement unit allows for pre and post transmission verification, so<br />

tool performance is always verified and maintained.<br />

Global CD Uniformity Improvement<br />

In this CDC200 TM application a global improvement of the mask or wafer CD Uniformity<br />

takes place. The user loads a list of CD measurements used to characterize the mask or<br />

the wafer current CD Uniformity. The system then automatically calculates the pixel<br />

density map that defines the attenuation level to be written into the mask glass. The<br />

system uses a smart density interpolation algorithm to calculate the pixel density<br />

required for the rest of the mask area. The pixels are then precisely written into<br />

the glass, and then selected locations are verified using the built-in transmission<br />

measurement unit. CDC is compatible with all design rules and has been demonstrated<br />

on customers masks at the 32 nm node.<br />

Mask Format (SEMI standard)<br />

Minimum Feature Size<br />

Average throughput (per mask)<br />

CDC200 TM General Specifications<br />

Mask loading & unloading time –<br />

≤ 10 min.<br />

SMIF only<br />

Attenuation Correction Performance 2<br />

Attenuation range<br />

Attenuation resolution<br />

Correction unit size<br />

100 µm 3<br />

(discrete attenuation value)<br />

Transmission Measurement System Standard<br />

DUV Full Spot Size<br />

Repeatability (3σ) 4<br />

Reproducibility (3σ) 4<br />

Resolution<br />

Measurement time<br />

6/250<br />

Not limited<br />

< 6.0 hours 1<br />

0 - 3.0 %<br />

0.1 %<br />

≤ 700 µm (FWHM)<br />

≤ 0.1 %<br />

≤ 0.1 %<br />

0.1 %<br />

< 6 sec<br />

1: Average processing time based on customer 70nm production masks<br />

2: Using CDC200 TM build-in transmission measurement unit and standard measurement procedure<br />

3: High Resolution (50 µm) is an Option<br />

4: According to standard measurement procedure on bare quartz<br />

5: All specifications subject to change<br />

Local CD Control<br />

In this CDC200 TM application the user identifies a<br />

local area or multiple areas that require a very<br />

accurate line width control. Once these areas are<br />

identified, multiple CD measurements are taken and<br />

the target CD is defined. The target CD can be<br />

different per local area. The system then operates in a<br />

very similar methodology as described above, in the<br />

“Global CD Uniformity Improvement” application.<br />

<strong>Carl</strong> <strong>Zeiss</strong> SMS GmbH<br />

A <strong>Carl</strong> <strong>Zeiss</strong> SMT AG Company<br />

<strong>Carl</strong>-<strong>Zeiss</strong>-Promenade 10<br />

07745 Jena<br />

Germany<br />

Tel. +49 36 41 / 64 25 63<br />

Fax +493641/642938<br />

info-sms@smt.zeiss.com<br />

www.smt.zeiss.com/sms<br />

Due to a policy of continuous development, we reserve the right to change specifications without notice. Version 03-09 Z-CDC200 © by <strong>Carl</strong> <strong>Zeiss</strong> SMT, Oberkochen

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