international directory of production wire bonders - Chip Scale Review
international directory of production wire bonders - Chip Scale Review
international directory of production wire bonders - Chip Scale Review
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INTERNATIONAL DIRECTORY OF PRODUCTION WIRE BONDERS<br />
Company Name<br />
Address<br />
b Phone > Fax<br />
Year Founded<br />
CM=Consult Manufacturer<br />
Note: Issue advertisers are listed in boldface type.<br />
Information was supplied by the respective companies.<br />
For more information, visit www.chipscalereview.com<br />
or the company’s web sites.<br />
Model<br />
V Introduced<br />
Bonding Area (X, Y) in mm<br />
Package Leadframe<br />
Capabilities<br />
l Length in mm<br />
w Width in mm<br />
t Thickness in mm<br />
Bond Pitch Capability<br />
in µm@ 3 sigma<br />
W Weight in kg<br />
M Type and Method<br />
p Bond Placement<br />
repeatability in µm@ 3 sigma<br />
a Accuracy<br />
in µm@ 3 sigma<br />
F Footprint<br />
(W x D in mm)<br />
H Material Handling<br />
S Conversion Time<br />
in minutes for same<br />
leadframe type<br />
Looping Capability<br />
w Maximum Wire Length in mm<br />
L Minimum Loop Length in µm<br />
8 Applications<br />
1. Discretes; 2. Hybrids;<br />
3. ICs; 4. Laser diodes;<br />
5. MCMs/Other modules;<br />
6. MEMS/MOEMS; 7. Opto/Nano<br />
8. Smart cards; 9. Other<br />
[web site]<br />
Contact<br />
b Phone > Fax<br />
Additional Offices<br />
ASM Technology Singapore<br />
PTE. Ltd.<br />
Division <strong>of</strong> ASM Pacific Technology<br />
Singapore<br />
b +65.67526311<br />
> +65.67582287<br />
1989<br />
Eagle 60AP<br />
V May 2004<br />
54 x 65<br />
@ leadframe width
INTERNATIONAL DIRECTORY OF PRODUCTION WIRE BONDERS<br />
Company Name<br />
Address<br />
b Phone > Fax<br />
Year Founded<br />
CM=Consult Manufacturer<br />
Model<br />
V Introduced<br />
Bonding Area (X, Y) in mm<br />
Package Leadframe<br />
Capabilities<br />
l Length in mm<br />
w Width in mm<br />
t Thickness in mm<br />
Bond Pitch Capability<br />
in µm@ 3 sigma<br />
W Weight in kg<br />
M Type and Method<br />
p Bond Placement<br />
repeatability in µm@ 3 sigma<br />
a Accuracy<br />
in µm@ 3 sigma<br />
F Footprint<br />
(W x D in mm)<br />
H Material Handling<br />
S Conversion Time<br />
in minutes for same<br />
leadframe type<br />
Looping Capability<br />
w Maximum Wire Length in mm<br />
L Minimum Loop Length in µm<br />
8 Applications<br />
1. Discretes; 2. Hybrids;<br />
3. ICs; 4. Laser diodes;<br />
5. MCMs/Other modules;<br />
6. MEMS/MOEMS; 7. Opto/Nano<br />
8. Smart cards; 9. Other<br />
[web site]<br />
Contact<br />
b Phone > Fax<br />
Additional Offices<br />
Orthodyne<br />
16700 Red Hill Ave.<br />
Irvine, CA 92606<br />
b 949.660.0440<br />
> 949.660.0444<br />
1962<br />
7200 Dual Head Semiconductor Bonder<br />
V June 2002<br />
70 x 70<br />
l 160-260<br />
w 18-72 t CM<br />
M360R Large Ribbon Bonder<br />
V December 2003<br />
250 x 150<br />
l w t NA (power modules)<br />
3600Plus Large Wire Bonder<br />
V April 2005<br />
250 x 150 (300 x 300 with<br />
optional work table)<br />
l w t NA (power modules)<br />
CM<br />
W 682<br />
M Ultrasonic/Wedge<br />
p CM<br />
a ±10 large <strong>wire</strong>, ±5 small <strong>wire</strong><br />
CM<br />
W 320<br />
M Ultrasonic/Wedge<br />
p CM<br />
a ±15<br />
CM<br />
W 400<br />
M Ultrasonic/Wedge<br />
p CM<br />
a ±10<br />
F 1740 x 1280<br />
H Leadframe inline<br />
and magazine-tomagazine<br />
S CM<br />
F 610 x 1095<br />
H CM<br />
S CM<br />
F 680 x 1308<br />
H CM<br />
S CM<br />
w CM<br />
L CM<br />
8 1, 3, 5, power leadframes<br />
w CM<br />
L CM<br />
8 9: Automotive, power<br />
modules, power leadframes<br />
w CM<br />
L CM<br />
8 1, 2, 5, 6<br />
[orthodyne.com]<br />
Siegbert Haumann,<br />
Product Manager<br />
siggi.haumann@orthodyne.com<br />
Matt Vorona, Director <strong>of</strong><br />
International Sales<br />
matt.vorona@orthodyne.com<br />
Eastern Regional Office<br />
116 Ellsworth Ave.<br />
Mineola, NY 11501<br />
b 516.739.2690<br />
Mike McKeown,<br />
Sales Manager<br />
mike.mckeown@orthodyne.com<br />
3700Plus Small Wire Wedge Bonder<br />
V April 2005<br />
250 x 150 (300 x 300 with<br />
optional work table)<br />
l w t NA (MCM-type pkgs.)<br />
75, CM<br />
W 400<br />
M Ultrasonic/Wedge<br />
p CM<br />
a ±5<br />
F 680 x 1308<br />
H CM<br />
S CM<br />
w CM<br />
L CM<br />
8 2, 5<br />
Palomar Technologies<br />
2728 Loker Ave. West<br />
Carlsbad, CA 92008<br />
b 760.931.3600<br />
> 760.931.3444<br />
1975<br />
Model 8080<br />
High Speed Au Ball Bumper<br />
V January 2005<br />
300 x 150<br />
l CM<br />
w CM<br />
t CM<br />
Model 8030<br />
High Speed Au Ball Bumper<br />
V January 2005<br />
300 x 150<br />
l CM<br />
w CM<br />
t CM<br />
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