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ITG-3050 Product Specification Revision 1.3 - InvenSense

ITG-3050 Product Specification Revision 1.3 - InvenSense

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<strong>ITG</strong>-<strong>3050</strong> <strong>Product</strong> <strong>Specification</strong><br />

Document Number: PS-<strong>ITG</strong>-<strong>3050</strong>-00<br />

<strong>Revision</strong>: <strong>1.3</strong><br />

Release Date: 08/25/2011<br />

CONTENTS<br />

1 DOCUMENT INFORMATION ..................................................................................................................... 4<br />

1.1 REVISION HISTORY ................................................................................................................................. 4<br />

1.2 PURPOSE AND SCOPE ............................................................................................................................ 5<br />

<strong>1.3</strong> PRODUCT OVERVIEW.............................................................................................................................. 5<br />

1.4 SOFTWARE SOLUTIONS .......................................................................................................................... 5<br />

1.5 APPLICATIONS ........................................................................................................................................ 7<br />

2 FEATURES ................................................................................................................................................. 8<br />

2.1 SENSORS ............................................................................................................................................... 8<br />

2.2 DIGITAL OUTPUT .................................................................................................................................... 8<br />

2.3 DATA PROCESSING ................................................................................................................................ 8<br />

2.4 CLOCKING .............................................................................................................................................. 8<br />

2.5 POWER .................................................................................................................................................. 8<br />

2.6 PACKAGE ............................................................................................................................................... 8<br />

3 ELECTRICAL CHARACTERISTICS .......................................................................................................... 9<br />

3.1 SENSOR SPECIFICATIONS ....................................................................................................................... 9<br />

3.2 ELECTRICAL SPECIFICATIONS................................................................................................................ 10<br />

3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 11<br />

3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 12<br />

3.5 I 2 C TIMING CHARACTERIZATION ............................................................................................................ 13<br />

3.6 ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 14<br />

4 APPLICATIONS INFORMATION ............................................................................................................. 15<br />

4.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................... 15<br />

4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................... 16<br />

4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ................................................................................. 16<br />

4.4 RECOMMENDED POWER-ON PROCEDURE .............................................................................................. 17<br />

5 FUNCTIONAL OVERVIEW ....................................................................................................................... 18<br />

5.1 BLOCK DIAGRAM .................................................................................................................................. 18<br />

5.2 OVERVIEW ........................................................................................................................................... 18<br />

5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING .................................. 18<br />

5.4 PRIMARY I 2 C SERIAL COMMUNICATIONS INTERFACE............................................................................... 19<br />

5.5 SECONDARY I 2 C SERIAL INTERFACE (FOR 3 RD -PARTY ACCELEROMETERS) ............................................... 19<br />

5.6 3 RD PARTY ACCELEROMETER CIRCUIT CONFIGURATIONS ........................................................................ 22<br />

5.7 INTERNAL CLOCK GENERATION ............................................................................................................. 22<br />

5.8 CLOCK OUTPUT .................................................................................................................................... 23<br />

5.9 SENSOR DATA REGISTERS ................................................................................................................... 23<br />

5.10 FIFO ................................................................................................................................................... 23<br />

5.11 INTERRUPTS ......................................................................................................................................... 23<br />

5.12 DIGITAL-OUTPUT TEMPERATURE SENSOR ............................................................................................. 23<br />

5.13 BIAS AND LDO ..................................................................................................................................... 23<br />

5.14 CHARGE PUMP ..................................................................................................................................... 23<br />

6 DIGITAL INTERFACE ............................................................................................................................... 24<br />

6.1 I 2 C SERIAL INTERFACE ......................................................................................................................... 24<br />

7 SERIAL INTERFACE CONSIDERATIONS .............................................................................................. 28<br />

7.1 <strong>ITG</strong>-<strong>3050</strong> SUPPORTED INTERFACES ..................................................................................................... 28<br />

7.2 LOGIC LEVELS ...................................................................................................................................... 28<br />

8 ASSEMBLY ............................................................................................................................................... 31<br />

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