ITG-3050 Product Specification Revision 1.3 - InvenSense
ITG-3050 Product Specification Revision 1.3 - InvenSense
ITG-3050 Product Specification Revision 1.3 - InvenSense
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<strong>ITG</strong>-<strong>3050</strong> <strong>Product</strong> <strong>Specification</strong><br />
Document Number: PS-<strong>ITG</strong>-<strong>3050</strong>-00<br />
<strong>Revision</strong>: <strong>1.3</strong><br />
Release Date: 08/25/2011<br />
CONTENTS<br />
1 DOCUMENT INFORMATION ..................................................................................................................... 4<br />
1.1 REVISION HISTORY ................................................................................................................................. 4<br />
1.2 PURPOSE AND SCOPE ............................................................................................................................ 5<br />
<strong>1.3</strong> PRODUCT OVERVIEW.............................................................................................................................. 5<br />
1.4 SOFTWARE SOLUTIONS .......................................................................................................................... 5<br />
1.5 APPLICATIONS ........................................................................................................................................ 7<br />
2 FEATURES ................................................................................................................................................. 8<br />
2.1 SENSORS ............................................................................................................................................... 8<br />
2.2 DIGITAL OUTPUT .................................................................................................................................... 8<br />
2.3 DATA PROCESSING ................................................................................................................................ 8<br />
2.4 CLOCKING .............................................................................................................................................. 8<br />
2.5 POWER .................................................................................................................................................. 8<br />
2.6 PACKAGE ............................................................................................................................................... 8<br />
3 ELECTRICAL CHARACTERISTICS .......................................................................................................... 9<br />
3.1 SENSOR SPECIFICATIONS ....................................................................................................................... 9<br />
3.2 ELECTRICAL SPECIFICATIONS................................................................................................................ 10<br />
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 11<br />
3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 12<br />
3.5 I 2 C TIMING CHARACTERIZATION ............................................................................................................ 13<br />
3.6 ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 14<br />
4 APPLICATIONS INFORMATION ............................................................................................................. 15<br />
4.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................... 15<br />
4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................... 16<br />
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ................................................................................. 16<br />
4.4 RECOMMENDED POWER-ON PROCEDURE .............................................................................................. 17<br />
5 FUNCTIONAL OVERVIEW ....................................................................................................................... 18<br />
5.1 BLOCK DIAGRAM .................................................................................................................................. 18<br />
5.2 OVERVIEW ........................................................................................................................................... 18<br />
5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING .................................. 18<br />
5.4 PRIMARY I 2 C SERIAL COMMUNICATIONS INTERFACE............................................................................... 19<br />
5.5 SECONDARY I 2 C SERIAL INTERFACE (FOR 3 RD -PARTY ACCELEROMETERS) ............................................... 19<br />
5.6 3 RD PARTY ACCELEROMETER CIRCUIT CONFIGURATIONS ........................................................................ 22<br />
5.7 INTERNAL CLOCK GENERATION ............................................................................................................. 22<br />
5.8 CLOCK OUTPUT .................................................................................................................................... 23<br />
5.9 SENSOR DATA REGISTERS ................................................................................................................... 23<br />
5.10 FIFO ................................................................................................................................................... 23<br />
5.11 INTERRUPTS ......................................................................................................................................... 23<br />
5.12 DIGITAL-OUTPUT TEMPERATURE SENSOR ............................................................................................. 23<br />
5.13 BIAS AND LDO ..................................................................................................................................... 23<br />
5.14 CHARGE PUMP ..................................................................................................................................... 23<br />
6 DIGITAL INTERFACE ............................................................................................................................... 24<br />
6.1 I 2 C SERIAL INTERFACE ......................................................................................................................... 24<br />
7 SERIAL INTERFACE CONSIDERATIONS .............................................................................................. 28<br />
7.1 <strong>ITG</strong>-<strong>3050</strong> SUPPORTED INTERFACES ..................................................................................................... 28<br />
7.2 LOGIC LEVELS ...................................................................................................................................... 28<br />
8 ASSEMBLY ............................................................................................................................................... 31<br />
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