Ultrafast Laser Microwelding using Filamentation - Osaka University
Ultrafast Laser Microwelding using Filamentation - Osaka University
Ultrafast Laser Microwelding using Filamentation - Osaka University
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Heterogeneous welding:<br />
Material<br />
*Thermal expansion coefficient<br />
Polymer<br />
Semiconductor<br />
Metal<br />
Alloy<br />
PMMA<br />
700 [×10 ‐ /<br />
Silicon<br />
28 [×10 ‐ /<br />
Cupper<br />
183 [×10 ‐ /<br />
Stainless steel<br />
175 [×10 ‐ /<br />
dissimilar kinds of materials<br />
Fused silica glass<br />
5.9 [×10 ‐ /<br />
<br />
<br />
<br />
<br />
Successful<br />
Borosilicate glass<br />
39 [×10 ‐ /<br />
<br />
<br />
<br />
<br />
Geometry<br />
<br />
<br />
Wide range of heterogeneous welding<br />
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