The RAPID 2013 Conference & Exposition Directory - Society of ...
The RAPID 2013 Conference & Exposition Directory - Society of ... The RAPID 2013 Conference & Exposition Directory - Society of ...
ConferenCe Details characterized by several experiments such as position, 2D pattern, direction, and slip/roll motion detection. Finally, it is concluded that the tactile sensor using the hybrid manufacturing method and materials is promising for various applications such as robotics, prosthetics, and wearable electronics. 11:30–11:55 pm Capability Assessment of Combining 3D Printing (FDM) and Printed Electronics (Aerosol Jet) Processes to Create Fully Printed Functionalized Devices Amos C. Breyfogle, DDM-Application Engineer, Stratasys Ken Vartanian, Director of Marketing, Optomec The need to reduce the size, weight, costs and cycle times while also increasing functionality of highly integrated systems is a design requirement for many consumer and military product development programs. To date, additive manufacturing has demonstrated new ways to produce complex physical structures that reduce dependencies on tooling and traditional manufacturing methods. However, industry has identified that further benefits can be obtained through the integration of printed electronic circuitry and components into additive manufactured structures. This technology integration furthers additive manufacturing, with the resulting fully functionalized devices demonstrating the same benefits witnessed to date with additive manufactured structures, but to a new level. Stratasys, Optomec, and Aurora Flight Sciences collaborated on a project to demonstrate how FDM and Aerosol Jet could be combined to produce typical electrical components (antenna, strain gauge, power circuit, and signal circuit) directly on the surface of 3D-printed wing structures. The exercise was a path finder to understand the capabilities of the combined technologies and the integration challenges. The results were very positive and demonstrated that the two technologies are compatible and can support immediate applications. Additional work is required to assess issues such as design rules, interface requirements, performance/lifecycle expectations, and supportability methods. 1–1:25 pm Direct-Write and Printed Electronics in Aerospace Joseph A. Marshall IV, Structural Designer, Boeing Research and Technology Airplanes, satellites, and military systems all have a need for direct-write and printed electronics. The application space is very large and includes replacing current systems, improving current systems, or enabling entirely new capabilities. The needs range from wires, sensors, antennas, lighting, and more. But the challenging lifetime demands and requirements mean that the industry must develop very robust products. Boeing currently uses direct-write technology on the 747-8 and is investigating various other applications. There are currently holes in the development path of direct-write electronics which need to be addressed, including connectors, part size limitations, substrate materials, corrosion, and more. 1:30–1:55 pm Direct Write Printing of Sensors, Antennas & Circuitry Jeff Brogan, PhD, CEO, MesoScribe Technologies Inc. MesoScribe Technologies specializes in materials processing based on its proprietary Direct Write Thermal Spray (DWTS) technology. This additive manufacturing process deposits materials in fine feature patterns producing sensors, antennas, and trace patterns using robotic 7-axis automation. A wide range of materials can be deposited including high-quality copper conductors, ceramic dielectrics and capacitors, sensor alloys, precious metals, and semiconductors. The process is compatible with most substrate/component materials including polymer laminates, fiber-filled composites, and metallic structures. DWTS is currently used in the construction of aerospace components providing embedded circuitry as well as in high-temperature propulsion systems providing diagnostic sensors (temperature, heat flux, strain) for structural health monitoring. In addition, MesoScribe has demonstrated the integration of UHF/VHF/L-Band antennas into air vehicle components and other military assets for advanced communication and signals intelligence. This presentation will summarize the latest advances in Direct Write Thermal Spray technology including material printing capabilities and hightemperature sensor performance. DWTS has a significant role 52 sme.org/rapid
in the future of manufacturing, influencing product design to reduce costs while enhancing component functionality. 2-2:25 pm Pulsed Photonic Curing of Printed Functional Materials Denis Cormier, Earl W. Brinkman Professor, Industrial and Systems Testing, Rochester Institute of Technology Stan Farnsworth, Vice President of Marketing, NovaCentrix The growing interest in hybrid processes that integrate electronics within additively manufactured parts can present significant challenges when the materials involved have significantly different melting/curing temperatures. Photonic curing has been used to rapidly heat printed inks and functional films to temperatures in excess of 1000°C on low-temperature substrates such as polymers and paper. It is therefore very well suited for use within hybrid multi-material AM processes. This presentation will begin with an overview of the process as well as a discussion of its strengths and limitations. The talk will then provide examples of high-temperature functional materials that have been printed on polymer AM part surfaces and then photonically cured. The talk will conclude with a discussion of practical lessons learned. 2:30–2:55 pm 3D Structural Electronics Fabrication Using Fused Deposition Modeling and Direct-Write Micro-dispensing David Espalin, Graduate Research Associate, University of Texas at El Paso (W.M. Keck Center for 3D Innovation) Additive manufacturing fabricated unmanned aerial vehicles (UAVs) with integrated or printed electronics offer 3D design and electronic packaging flexibility that may facilitate UAV multi-role performance (i.e., reconnaissance, combat, and logistics) and as such have received much attention in the AM community as of late. Fundamentally, the advancement of 3D structural electronics using AM partly hinges on effectively interconnecting electronic components. In this particular case, the dispensing of conductive inks on FDM produced surfaces presented several challenges including those related to wetting, electrical shorting between interconnections, and unintentional ink spreading throughout the part. As a solution to some of these issues, interconnection channels were used to confine or retain inks at the desired locations and prevent electrical shorting or ink spreading. Additionally, interconnection channels produced using micromachining achieved micro-scale features. Through this work, it was determined that FDM processing parameters and machining depths influenced successful electrical interconnection—which in the end, could be used to produce functional electronic systems using FDM. 3–3:25 pm RF Printed Circuit Structures Using a Commercially Available Direct Print Tool Ken Church, PhD, President, nScrypt Inc. The mechanical segment of 3D printing has penetrated the manufacturing barrier, but the electrical segment has not. It is clear that mechanical structures are more mature than their electrical counter parts, but for the electrical segment to mature it must accomplish what the mechanical structures have accomplished; perform at a level that meets or exceeds stateof-the-art. 3D electronic structures that have unique shape but inferior performance will be novel but not pervasive. To address the electrical performance issue it is imperative to involve electrical experts in 3D printing. A number of companies and universities are working on 3D electronic devices and this will provide a foundation for future products, but more is needed to make this a viable solution for true printed circuits. nScrypt sells commercial tools for the electronic industry and has recently added an nScrypt Fused Deposition (nFD) pump on their micro-dispensing platform. 3D printing of next generation printed circuit structures has the potential to penetrate an existing printed circuit boards market; a commercially available 3D printing tool can make this viable. nScrypt and the University of South Florida have teamed up to utilize this tool and work in the more challenging RF regime of printed electronics. Multi-bit RF phase shifters are challenging for any fabrication process and 3D printing these can show improvement in ruggedness and durability without degrading the performance. This has implications that reach into many industries, including the Department of Defense. In addition to the DoD, the printed circuit boards market for consumer products is in excess of $50B annually. For these industries to embrace the 3D printing approach, the tools must be commercially available and 6/2013 – RAPID 53
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- Page 26 and 27: At-A-Glance RAPID 2013 June 10-13 |
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- Page 32 and 33: Keynote Presentations Monday, June
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ConferenCe Details<br />
characterized by several experiments such as position, 2D<br />
pattern, direction, and slip/roll motion detection. Finally, it is<br />
concluded that the tactile sensor using the hybrid manufacturing<br />
method and materials is promising for various applications such<br />
as robotics, prosthetics, and wearable electronics.<br />
11:30–11:55 pm<br />
Capability Assessment <strong>of</strong> Combining 3D Printing<br />
(FDM) and Printed Electronics (Aerosol Jet) Processes<br />
to Create Fully Printed Functionalized Devices<br />
Amos C. Breyfogle, DDM-Application Engineer, Stratasys<br />
Ken Vartanian, Director <strong>of</strong> Marketing, Optomec<br />
<strong>The</strong> need to reduce the size, weight, costs and cycle times while<br />
also increasing functionality <strong>of</strong> highly integrated systems is a<br />
design requirement for many consumer and military product<br />
development programs. To date, additive manufacturing<br />
has demonstrated new ways to produce complex physical<br />
structures that reduce dependencies on tooling and traditional<br />
manufacturing methods. However, industry has identified that<br />
further benefits can be obtained through the integration <strong>of</strong> printed<br />
electronic circuitry and components into additive manufactured<br />
structures. This technology integration furthers additive<br />
manufacturing, with the resulting fully functionalized devices<br />
demonstrating the same benefits witnessed to date with additive<br />
manufactured structures, but to a new level.<br />
Stratasys, Optomec, and Aurora Flight Sciences collaborated<br />
on a project to demonstrate how FDM and Aerosol Jet could be<br />
combined to produce typical electrical components (antenna,<br />
strain gauge, power circuit, and signal circuit) directly on<br />
the surface <strong>of</strong> 3D-printed wing structures. <strong>The</strong> exercise was<br />
a path finder to understand the capabilities <strong>of</strong> the combined<br />
technologies and the integration challenges. <strong>The</strong> results were<br />
very positive and demonstrated that the two technologies are<br />
compatible and can support immediate applications. Additional<br />
work is required to assess issues such as design rules, interface<br />
requirements, performance/lifecycle expectations, and<br />
supportability methods.<br />
1–1:25 pm<br />
Direct-Write and Printed Electronics in Aerospace<br />
Joseph A. Marshall IV, Structural Designer,<br />
Boeing Research and Technology<br />
Airplanes, satellites, and military systems all have a need for<br />
direct-write and printed electronics. <strong>The</strong> application space is<br />
very large and includes replacing current systems, improving<br />
current systems, or enabling entirely new capabilities. <strong>The</strong> needs<br />
range from wires, sensors, antennas, lighting, and more. But the<br />
challenging lifetime demands and requirements mean that the<br />
industry must develop very robust products. Boeing currently<br />
uses direct-write technology on the 747-8 and is investigating<br />
various other applications. <strong>The</strong>re are currently holes in the<br />
development path <strong>of</strong> direct-write electronics which need to be<br />
addressed, including connectors, part size limitations, substrate<br />
materials, corrosion, and more.<br />
1:30–1:55 pm<br />
Direct Write Printing <strong>of</strong> Sensors,<br />
Antennas & Circuitry<br />
Jeff Brogan, PhD, CEO, MesoScribe Technologies Inc.<br />
MesoScribe Technologies specializes in materials processing<br />
based on its proprietary Direct Write <strong>The</strong>rmal Spray (DWTS)<br />
technology. This additive manufacturing process deposits<br />
materials in fine feature patterns producing sensors, antennas,<br />
and trace patterns using robotic 7-axis automation. A wide<br />
range <strong>of</strong> materials can be deposited including high-quality<br />
copper conductors, ceramic dielectrics and capacitors,<br />
sensor alloys, precious metals, and semiconductors. <strong>The</strong><br />
process is compatible with most substrate/component<br />
materials including polymer laminates, fiber-filled composites,<br />
and metallic structures. DWTS is currently used in the<br />
construction <strong>of</strong> aerospace components providing embedded<br />
circuitry as well as in high-temperature propulsion systems<br />
providing diagnostic sensors (temperature, heat flux, strain)<br />
for structural health monitoring. In addition, MesoScribe has<br />
demonstrated the integration <strong>of</strong> UHF/VHF/L-Band antennas into<br />
air vehicle components and other military assets for advanced<br />
communication and signals intelligence. This presentation will<br />
summarize the latest advances in Direct Write <strong>The</strong>rmal Spray<br />
technology including material printing capabilities and hightemperature<br />
sensor performance. DWTS has a significant role<br />
52 sme.org/rapid
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