Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
QFN<br />
QFN<br />
Die Attach ADHESIVES: SMALL Die, ≤5.0 mm x 5.0 mm<br />
Die Attach ADHESIVES: Large die, ≥5 mm x 5 mm<br />
Product<br />
Description<br />
Finish<br />
(Cu, Ag, Au)<br />
MRT<br />
Electrical<br />
Conductivity<br />
Dispensability<br />
CURE SCHEDULE<br />
Thermal<br />
Conductivity,<br />
W/mK<br />
Product<br />
Description<br />
Finish<br />
(Ag, Cu, Ni)<br />
MRT<br />
Electrical<br />
Conductivity<br />
Dispensability<br />
CURE SCHEDULE<br />
Thermal<br />
Conductivity,<br />
W/mK<br />
QMI519<br />
JEDEC L1 260°C for SOIC, QFN packages, and preplated finishes.<br />
Exceptional performance on clean uncoated silver-plated finishes.<br />
High adhesion, excellent electrical and thermal performance.<br />
Ag, Au L1 - 260 1 x 10 -4 Very Good<br />
≥10 sec @ 200°C<br />
(SkipCure)<br />
30 min @ 200°C (Oven)<br />
3.8<br />
QMI505MT<br />
Lower stress BMI-based paste for preplated, alloy 42 and<br />
black oxide finishes.<br />
Au L3 - 260 2 x 10 -3 Good<br />
≥10 sec @ 200°C<br />
(SkipCure)<br />
30 min @ 200°C (Oven)<br />
2.4<br />
QMI529HT<br />
For component or die attach where very high electrical and thermal<br />
conductivity is required. Suitable for high heat dissipation devices<br />
and solder replacement applications.<br />
Ag, Au L1 - 260 4 x 10 -5 Fair<br />
QMI547 Non-conductive paste for leadframe applications. Cu, Ag, Au L3 - 260 1 x 10 13 Excellent<br />
8006NS<br />
(WBC)<br />
Non-conductive oven cure adhesive utilizing wafer backside<br />
coating technology.<br />
Ag, Cu, Au L1 - 260 NA NA<br />
≥60 sec @ 185°C<br />
(SkipCure)<br />
30 min @ 185°C (Oven)<br />
≥8 sec @ 150°C<br />
(SkipCure)<br />
15 min @ 150°C (Oven)<br />
B-stage<br />
+ 120 min @ 160°C<br />
7.0<br />
0.3<br />
0.4<br />
QMI536HT<br />
High thermal version of QMI536, ideal for mixed stacked<br />
die applications. Non-die damaging filler.<br />
Ag, Au L3 - 260 1 x 10 13 Excellent<br />
QMI547 Non-conductive paste for leadframe applications. Cu, Ag, Au L3 - 260 1 x 10 13 Good<br />
≥8 sec @ 150°C<br />
(SkipCure)<br />
15 min @ 150°C (Oven)<br />
≥8 sec @150°C<br />
(SkipCure)<br />
15 min @ 150°C (Oven)<br />
0.9<br />
0.3<br />
8008 (WBC)<br />
Electrically conductive snap cure adhesive utilizing wafer backside<br />
coating technology.<br />
Ag, Cu, Au L1 - 260 1 x 10 -4 NA<br />
B-stage<br />
+ 60 sec @ 230°C<br />
2.1<br />
QMI718<br />
Designed to deliver exceptional JEDEC performance<br />
in SOIC packages using copper-finished leadframes.<br />
Cu L2 - 260 2 x 10 -3 Fair 60 min @ 175°C (Oven) 2.7<br />
8008HT<br />
(WBC)<br />
High thermal conductivity snap cure adhesive utilizing wafer<br />
backside coating technology.<br />
Ag, Cu, Au L1 - 260 5 x 10 -5 NA<br />
B-stage<br />
+ 20 sec @ 280°C<br />
11<br />
3230<br />
Low stress epoxy die attach adhesive suitable for various<br />
package sizes.<br />
Cu L3 - 260 5 x 10 -2 Fair<br />
30 min ramp to 175°C<br />
+ 15 min @ 175°C<br />
0.6<br />
8008NC<br />
(WBC)<br />
Non-conductive snap cure adhesive utilizing wafer backside<br />
coating technology.<br />
Ag, Cu, Au L1 - 260 NA NA<br />
B-stage<br />
+ 60 sec @ 250°C<br />
0.5<br />
8290<br />
Low stress die attach adhesive suitable for die size<br />