Henkel Semiconductor Solutions

Semiconductor
Market Solutions
Semiconductor
Market Solutions
QFN
QFN
Die Attach ADHESIVES: SMALL Die, ≤5.0 mm x 5.0 mm
Die Attach ADHESIVES: Large die, ≥5 mm x 5 mm
Product
Description
Finish
(Cu, Ag, Au)
MRT
Electrical
Conductivity
Dispensability
CURE SCHEDULE
Thermal
Conductivity,
W/mK
Product
Description
Finish
(Ag, Cu, Ni)
MRT
Electrical
Conductivity
Dispensability
CURE SCHEDULE
Thermal
Conductivity,
W/mK
QMI519
JEDEC L1 260°C for SOIC, QFN packages, and preplated finishes.
Exceptional performance on clean uncoated silver-plated finishes.
High adhesion, excellent electrical and thermal performance.
Ag, Au L1 - 260 1 x 10 -4 Very Good
≥10 sec @ 200°C
(SkipCure)
30 min @ 200°C (Oven)
3.8
QMI505MT
Lower stress BMI-based paste for preplated, alloy 42 and
black oxide finishes.
Au L3 - 260 2 x 10 -3 Good
≥10 sec @ 200°C
(SkipCure)
30 min @ 200°C (Oven)
2.4
QMI529HT
For component or die attach where very high electrical and thermal
conductivity is required. Suitable for high heat dissipation devices
and solder replacement applications.
Ag, Au L1 - 260 4 x 10 -5 Fair
QMI547 Non-conductive paste for leadframe applications. Cu, Ag, Au L3 - 260 1 x 10 13 Excellent
8006NS
(WBC)
Non-conductive oven cure adhesive utilizing wafer backside
coating technology.
Ag, Cu, Au L1 - 260 NA NA
≥60 sec @ 185°C
(SkipCure)
30 min @ 185°C (Oven)
≥8 sec @ 150°C
(SkipCure)
15 min @ 150°C (Oven)
B-stage
+ 120 min @ 160°C
7.0
0.3
0.4
QMI536HT
High thermal version of QMI536, ideal for mixed stacked
die applications. Non-die damaging filler.
Ag, Au L3 - 260 1 x 10 13 Excellent
QMI547 Non-conductive paste for leadframe applications. Cu, Ag, Au L3 - 260 1 x 10 13 Good
≥8 sec @ 150°C
(SkipCure)
15 min @ 150°C (Oven)
≥8 sec @150°C
(SkipCure)
15 min @ 150°C (Oven)
0.9
0.3
8008 (WBC)
Electrically conductive snap cure adhesive utilizing wafer backside
coating technology.
Ag, Cu, Au L1 - 260 1 x 10 -4 NA
B-stage
+ 60 sec @ 230°C
2.1
QMI718
Designed to deliver exceptional JEDEC performance
in SOIC packages using copper-finished leadframes.
Cu L2 - 260 2 x 10 -3 Fair 60 min @ 175°C (Oven) 2.7
8008HT
(WBC)
High thermal conductivity snap cure adhesive utilizing wafer
backside coating technology.
Ag, Cu, Au L1 - 260 5 x 10 -5 NA
B-stage
+ 20 sec @ 280°C
11
3230
Low stress epoxy die attach adhesive suitable for various
package sizes.
Cu L3 - 260 5 x 10 -2 Fair
30 min ramp to 175°C
+ 15 min @ 175°C
0.6
8008NC
(WBC)
Non-conductive snap cure adhesive utilizing wafer backside
coating technology.
Ag, Cu, Au L1 - 260 NA NA
B-stage
+ 60 sec @ 250°C
0.5
8290
Low stress die attach adhesive suitable for die size