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Henkel Semiconductor Solutions

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<strong>Semiconductor</strong><br />

Market <strong>Solutions</strong><br />

<strong>Semiconductor</strong><br />

Market <strong>Solutions</strong><br />

Discrete components<br />

Discrete Components<br />

Die Attach Adhesives<br />

Electronic Molding<br />

Compounds<br />

Encapsulants<br />

Molding<br />

Compounds<br />

Conductive<br />

Non-Conductive<br />

GR2220<br />

FP0087<br />

Green<br />

Non-Green<br />

DA100 (Solder)<br />

QMI536HT<br />

GR2310<br />

GR15F-A<br />

KL1000-3LX<br />

QMI529HT<br />

QMI547<br />

GR2710<br />

GR15F-1<br />

KL1000-4T<br />

2600AT<br />

GR2811<br />

GR360A-F8<br />

KL5000-HT<br />

8008HT (WBC)<br />

MG40FS<br />

GR750<br />

MG15F<br />

FS849-TI<br />

GR750-SC<br />

GR750HT-25<br />

KLG100<br />

KLG200<br />

die attach Adhesives: CONDUCTIVE<br />

Product<br />

QMI529HT<br />

Description<br />

For component or die attach where very high electrical and thermal<br />

conductivity is required. Suitable for high heat dissipation devices<br />

and solder replacement applications.<br />

Finish<br />

(Cu, Ag, Au)<br />

MRT<br />

Electrical<br />

Conductivity<br />

Dispensability<br />

Ag, Au L1 - 260 4 x 10 -5 Fair<br />

Cure<br />

Schedule<br />

≥ 60 sec @ 185°C<br />

(SkipCure)<br />

30 min @ 185°C (Oven)<br />

Thermal<br />

Conductivity,<br />

W/mK<br />

7.0<br />

2600AT<br />

High thermal conductivity adhesive for thermal<br />

management applications.<br />

Cu, Ag, Au L3 - 260 5 x 10 -5 Fair<br />

30 min ramp to 200°C<br />

+ 15 min @ 200°C<br />

20<br />

8008HT (WBC)<br />

High electrical and thermal conductivity die attach. Excellent<br />

temperature resistance.<br />

Ag, Cu, Au L1 - 260 6 x 10 -5 NA<br />

B-stage +<br />

20 sec @ 280°C<br />

11<br />

Across the Board,<br />

Around the Globe.<br />

www.henkel.com/electronics<br />

<br />

FS849-TI High thermal conductivity adhesive with low electrical resistance. Ag, Au L2 - 260 2 x 10 -5 Good<br />

15 min ramp to 175°C<br />

+ 30 min @ 175C<br />

7.8<br />

4<br />

5

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