Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
Discrete components<br />
Discrete Components<br />
Die Attach Adhesives<br />
Electronic Molding<br />
Compounds<br />
Encapsulants<br />
Molding<br />
Compounds<br />
Conductive<br />
Non-Conductive<br />
GR2220<br />
FP0087<br />
Green<br />
Non-Green<br />
DA100 (Solder)<br />
QMI536HT<br />
GR2310<br />
GR15F-A<br />
KL1000-3LX<br />
QMI529HT<br />
QMI547<br />
GR2710<br />
GR15F-1<br />
KL1000-4T<br />
2600AT<br />
GR2811<br />
GR360A-F8<br />
KL5000-HT<br />
8008HT (WBC)<br />
MG40FS<br />
GR750<br />
MG15F<br />
FS849-TI<br />
GR750-SC<br />
GR750HT-25<br />
KLG100<br />
KLG200<br />
die attach Adhesives: CONDUCTIVE<br />
Product<br />
QMI529HT<br />
Description<br />
For component or die attach where very high electrical and thermal<br />
conductivity is required. Suitable for high heat dissipation devices<br />
and solder replacement applications.<br />
Finish<br />
(Cu, Ag, Au)<br />
MRT<br />
Electrical<br />
Conductivity<br />
Dispensability<br />
Ag, Au L1 - 260 4 x 10 -5 Fair<br />
Cure<br />
Schedule<br />
≥ 60 sec @ 185°C<br />
(SkipCure)<br />
30 min @ 185°C (Oven)<br />
Thermal<br />
Conductivity,<br />
W/mK<br />
7.0<br />
2600AT<br />
High thermal conductivity adhesive for thermal<br />
management applications.<br />
Cu, Ag, Au L3 - 260 5 x 10 -5 Fair<br />
30 min ramp to 200°C<br />
+ 15 min @ 200°C<br />
20<br />
8008HT (WBC)<br />
High electrical and thermal conductivity die attach. Excellent<br />
temperature resistance.<br />
Ag, Cu, Au L1 - 260 6 x 10 -5 NA<br />
B-stage +<br />
20 sec @ 280°C<br />
11<br />
Across the Board,<br />
Around the Globe.<br />
www.henkel.com/electronics<br />
<br />
FS849-TI High thermal conductivity adhesive with low electrical resistance. Ag, Au L2 - 260 2 x 10 -5 Good<br />
15 min ramp to 175°C<br />
+ 30 min @ 175C<br />
7.8<br />
4<br />
5