Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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Contents<br />
<strong>Semiconductor</strong> Market <strong>Solutions</strong><br />
Discrete Components .......................... 5<br />
Quad Flat Pack (QFP). .......................... 9<br />
Quad Flat No-Lead (QFN) ...................... 11<br />
Dynamic Random Access Memory (DRAM) ....... 14<br />
Ball Grid Array/Chip Scale Package (BGA/CSP). ... 15<br />
Flash Memory ................................ 19<br />
<strong>Semiconductor</strong> Materials<br />
Die Attach Adhesives. ......................... 21<br />
<strong>Semiconductor</strong> Underfills ...................... 26<br />
Hysol ® <strong>Semiconductor</strong> Encapsulants. ............ 29<br />
Hysol ® Thermal Compression Materials .......... 31<br />
Hysol ® Coating Powders ....................... 33<br />
Hysol ® Electronic Molding Compounds ........... 34<br />
Hysol ® and Hysol ® Huawei <strong>Semiconductor</strong><br />
Molding Compounds .......................... 36<br />
Multicore ® Accurus Solder Spheres ............. 44<br />
Periodic Table of Elements ..................... 48
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