Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MATERIALS<br />
<strong>Semiconductor</strong><br />
MATERIALS<br />
Hysol ® and Hysol ® Huawei <br />
<strong>Semiconductor</strong> Molding<br />
CompoundS<br />
SURFACE MOUNT/LEADFRAMEs<br />
QFP, T/lQFP, TSOP<br />
SOIC<br />
SURFACE MOUNT/LEADFRAMES<br />
Hysol ® and Hysol ® Huawei <br />
<strong>Semiconductor</strong> Molding<br />
CompoundS<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
package<br />
size<br />
MSL GREEN % FILLER<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
PRODUCT<br />
DESCRIPTION<br />
surface<br />
finish<br />
package<br />
size<br />
MSL GREEN % FILLER<br />
SPIRAL<br />
FLOW, cm<br />
CTE a1,<br />
ppm/°C<br />
Tg, °C<br />
Hysol ® Huawei<br />
KL7000HA<br />
Hysol ®<br />
GR828D<br />
Hysol ® Huawei<br />
KLG730<br />
Hysol ®<br />
GR868<br />
High adhesion and high strength molding compound<br />
suitable for SOT, SSOP, and QFP packages. Provides ultra<br />
low stress, low moisture absorption, high purity and high<br />
reliability. Its low viscosity properties enable low wire sweep<br />
molding with a large operating window.<br />
Green, ultra low stress and high adhesion molding<br />
compound designed for SOIC, TSOP and QFP<br />
packages with lead-free finishing. Hysol ® GR828D<br />
targets package finishings that require Ag adhesion<br />
retention after MSL soaking and IR reflow process.<br />
High adhesion, ultra low stress and green mold compound<br />
suitable for SOIC, TSOP, D/D2PAK, QFP, L/TQFP. Its low<br />
viscosity properties enable low wire sweep molding with a<br />
large operating window. It has no flame retardants but offers<br />
a 1/8" flammability rating.<br />
GR868 (C102924-129) is a green (non-bromine/antimony<br />
and phosphorus) semiconductor grade low stress, low<br />
moisture absorption and high adhesion molding compound.<br />
It is especially designed for all large and thin packages with<br />
highest MSL performance possible on Ni/Pd and Cu/Ag<br />
leadframes. It is unique as it offers the highest retention of<br />
adhesion even after the harshest reflow condition due to its<br />
low modulus at high temperature. It is especially suitable for<br />
TQFP and low k packages.<br />
all QFP<br />