Henkel Semiconductor Solutions

Semiconductor
MaTERIALS
Semiconductor
MaTERIALS
DIE ATTACH ADHESIVES
DIE ATTACH ADHESIVES
LEADED PACKAGES
DAX: PBGA, SCSP (cont’d from page 23)
Product Description MRT
ATB-S100
series (Film)
ATB-100T
series (Film)
Single layer format, low modulus adhesive for
chip-stacking applications.
Single layer format, low modulus adhesive for
chip-stacking applications.
SMALL DIE: DISCRETES, T0220, QFN, LED
Electrical
Conductivity
L2 - 260C NA Good NA
L2 - 260C NA Very good NA
2053S Low stress adhesive for low warpage die to substrate. L2 - 260C NA Good Good
Warpage, m Flow CURE SCHEDULE
AAA3320 Self-Filleting adhesive for die-to-substrate applications. L3 - 260C 1 x 10 13 Good Excellent
30 min @ 100°C
+ 30 min @ 125°C
60 min @ 100°C
+ 60 min @ 150°C
30 min ramp to 175°C
+ 15 min @ 175°C
30 min ramp to 150°C
+ 30 min @ 150°C
Thermal
Conductivity,
W/mK
NA
NA
NA
0.3
LEADED PACKAGES
LARGE DIE: QFN, TQFP
Product
QMI505MT
QMI536HT
Description
Lower stress BMI-based paste for preplated, alloy 42 and black
oxide finishes.
High thermal version of QMI536, ideal for mixed stacked die
applications. Non-die damaging filler.
Finish
(Cu, Ag, Au)
MRT
Electrical
Conductivity
Dispensability
Ag, Au L3 - 260 2 x 10 -3 Good
Ag, Au L3 - 260 1 x 10 13 Excellent
QMI547 Non-conductive paste for leadframe applications. Au, Ag, Cu L3 - 260 1 x 10 13 Good
QMI718
Designed to deliver exceptional JEDEC performance in SOIC packages
using copper-finished leadframes.
Cure
SCHEDULE
≥10 sec @ 200°C
(SkipCure)
30 min @ 200°C (Oven)
≥8 sec @ 150°C
(SkipCure)
15 min @ 150°C (Oven)
≥8 sec @ 150°C
(SkipCure)
15 min @ 150°C (Oven)
Thermal
Conductivity,
W/mK
Cu L2 - 260 2 x 10 -3 Fair 60 min @ 175°C (Oven) 2.7
3230 Low stress epoxy die attach adhesive suitable for various package sizes. Cu L3 - 260 5 x 10 -2 Fair
8290 Low stress die attach adhesive suitable for die size 450°C
temperature resistance for glass-sealed hermetic packages.
Electrical
Conductivity
CURE SCHEDULE
Thermal
Conductivity,
W/mK
Seam
Seal
Solder
Seal
15 x 5 -5 380°C - 440°C >60 Yes Yes Yes
15 x 5 -5 330°C - 450°C >80 Yes Yes Yes
Glass
Seal
8006NS
(WBC)
8008 (WBC)
Non-conductive oven cure adhesive utilizing wafer backside
coating technology.
Electrically conductive snap cure adhesive utilizing wafer backside
coating technology.
Ag, Cu, Au L1 - 260 NA NA B-stage + 120 min @ 160°C 0.4
Ag, Cu, Au L1 - 260 1 x 10 -4 NA B-stage + 60 sec @ 230°C 2.1
QMI301
Solder and seamed-sealed packages. Low temperature cure
material with very high adhesion and >340°C temperature
resistance for solder-sealed hermetic packages.
NA 150°C - 200°C (Oven) 1.9 Yes Yes No
8008HT
(WBC)
High electrical and thermal conductivity die attach. Excellent
temperature resistance.
Ag, Cu, Au L1 - 260 6 x 10 -5 NA B-stage + 20 sec @ 280°C 11.0
8008NC
(WBC)
Non-conductive snap cure adhesive utilizing wafer backside
coating technology.
Ag, Cu, Au L1 - 260 NA NA B-stage + 60 sec @ 280°C 0.5
8200C Low bleed adhesive for pre-plated and silver leadframe. Ag, Cu, Au L1 - 260 2 x 10 -4 Good
30 min ramp to 175°C
+ 15 min @ 175°C
1.2
8200TI
8200C with higher thermal conductivity and optimized adhesion
on NiPdAu leadframe.
Ag, Cu, Au L1 - 260 5 x 10 -5 Good
30 min ramp to 175°C
+ 15 min @ 175°C
3.5
84-1LMISR4 Industry standard die attach adhesive. Ag, Cu, Au L3 - 260 1 x 10 -4 Excellent 60 min @ 175°C 2.5
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