Henkel Semiconductor Solutions

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Semiconductor MaTERIALS Semiconductor MaTERIALS DIE ATTACH ADHESIVES DIE ATTACH ADHESIVES Die Attach Adhesives LAMINATE PACKAGES DIE ATTACH FILM Product Description MRT ELEctrical conductivity Dispensability Cure Schedule Thermal Conductivity, W/mK Laminate Packages PBGA, CSP, SCSP Leaded Packages SO, QFN, QFP, LCC QMI5200 (Film) ATB-100T series (Film) Non-conductive 2-in-1 dicing die attach film with good bondline thickness control. Will not bleed and does not require cure prior to wirebonding. Film thickness is 20 microns. Single layer format, low modulus adhesive for chip-stacking applications. L2 - 260 NA NA L2 - 260 Non-Conductive NA NA
Semiconductor MaTERIALS Semiconductor MaTERIALS DIE ATTACH ADHESIVES DIE ATTACH ADHESIVES LEADED PACKAGES DAX: PBGA, SCSP (cont’d from page 23) Product Description MRT ATB-S100 series (Film) ATB-100T series (Film) Single layer format, low modulus adhesive for chip-stacking applications. Single layer format, low modulus adhesive for chip-stacking applications. SMALL DIE: DISCRETES, T0220, QFN, LED Electrical Conductivity L2 - 260C NA Good NA L2 - 260C NA Very good NA 2053S Low stress adhesive for low warpage die to substrate. L2 - 260C NA Good Good Warpage, m Flow CURE SCHEDULE AAA3320 Self-Filleting adhesive for die-to-substrate applications. L3 - 260C 1 x 10 13 Good Excellent 30 min @ 100°C + 30 min @ 125°C 60 min @ 100°C + 60 min @ 150°C 30 min ramp to 175°C + 15 min @ 175°C 30 min ramp to 150°C + 30 min @ 150°C Thermal Conductivity, W/mK NA NA NA 0.3 LEADED PACKAGES LARGE DIE: QFN, TQFP Product QMI505MT QMI536HT Description Lower stress BMI-based paste for preplated, alloy 42 and black oxide finishes. High thermal version of QMI536, ideal for mixed stacked die applications. Non-die damaging filler. Finish (Cu, Ag, Au) MRT Electrical Conductivity Dispensability Ag, Au L3 - 260 2 x 10 -3 Good Ag, Au L3 - 260 1 x 10 13 Excellent QMI547 Non-conductive paste for leadframe applications. Au, Ag, Cu L3 - 260 1 x 10 13 Good QMI718 Designed to deliver exceptional JEDEC performance in SOIC packages using copper-finished leadframes. Cure SCHEDULE ≥10 sec @ 200°C (SkipCure) 30 min @ 200°C (Oven) ≥8 sec @ 150°C (SkipCure) 15 min @ 150°C (Oven) ≥8 sec @ 150°C (SkipCure) 15 min @ 150°C (Oven) Thermal Conductivity, W/mK Cu L2 - 260 2 x 10 -3 Fair 60 min @ 175°C (Oven) 2.7 3230 Low stress epoxy die attach adhesive suitable for various package sizes. Cu L3 - 260 5 x 10 -2 Fair 8290 Low stress die attach adhesive suitable for die size 450°C temperature resistance for glass-sealed hermetic packages. Electrical Conductivity CURE SCHEDULE Thermal Conductivity, W/mK Seam Seal Solder Seal 15 x 5 -5 380°C - 440°C >60 Yes Yes Yes 15 x 5 -5 330°C - 450°C >80 Yes Yes Yes Glass Seal 8006NS (WBC) 8008 (WBC) Non-conductive oven cure adhesive utilizing wafer backside coating technology. Electrically conductive snap cure adhesive utilizing wafer backside coating technology. Ag, Cu, Au L1 - 260 NA NA B-stage + 120 min @ 160°C 0.4 Ag, Cu, Au L1 - 260 1 x 10 -4 NA B-stage + 60 sec @ 230°C 2.1 QMI301 Solder and seamed-sealed packages. Low temperature cure material with very high adhesion and >340°C temperature resistance for solder-sealed hermetic packages. NA 150°C - 200°C (Oven) 1.9 Yes Yes No 8008HT (WBC) High electrical and thermal conductivity die attach. Excellent temperature resistance. Ag, Cu, Au L1 - 260 6 x 10 -5 NA B-stage + 20 sec @ 280°C 11.0 8008NC (WBC) Non-conductive snap cure adhesive utilizing wafer backside coating technology. Ag, Cu, Au L1 - 260 NA NA B-stage + 60 sec @ 280°C 0.5 8200C Low bleed adhesive for pre-plated and silver leadframe. Ag, Cu, Au L1 - 260 2 x 10 -4 Good 30 min ramp to 175°C + 15 min @ 175°C 1.2 8200TI 8200C with higher thermal conductivity and optimized adhesion on NiPdAu leadframe. Ag, Cu, Au L1 - 260 5 x 10 -5 Good 30 min ramp to 175°C + 15 min @ 175°C 3.5 84-1LMISR4 Industry standard die attach adhesive. Ag, Cu, Au L3 - 260 1 x 10 -4 Excellent 60 min @ 175°C 2.5 24 25
Page 1 and 2: Henkel - Your partner worldwide Hen
Page 3 and 4: Contents Semiconductor Market Solut
Page 5 and 6: Semiconductor Market Solutions Semi
Page 13: Semiconductor MaTERIALS Semiconduct
Page 17 and 18: Semiconductor Market Solutions SEMI
Page 19 and 20: Semiconductor MaTERIALS Semiconduct
Page 21 and 22: Semiconductor MaTERIALS Hysol ® an
Page 23 and 24: Semiconductor MATERIALS Semiconduct
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Page 27: Periodic Table of elements NOTES: 4

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