2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group 2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
• Silica Comes in 3 Types Silica for CMP • “Fumed”: flame vapor-phase hydrolysis of SiCl 4 or the like … 3 major suppliers • “Colloidal”: precipitated from sodium silicate & H 2 SO 4 ... >8 suppliers • “Sol”: Stöber process condensation of silicon alkoxide (TEOS, TMOS) w/ ammonia & water, at least 2 major suppliers • Abrasives and Applications • Oxide/ILD ≤65nm use less aggressive particles: fumed to colloidal or milled fumed • Copper “Step 1” predominately uses Colloidal • Copper Barrier (and Dielectric Cap) uses Colloidal or Sol • Tungsten fumed and colloidal KHolland@Techcet.com AVS CMP-UG 07/2009 4
Annual Revenue (M$USD) IC CMP Slurry Growth ? 1,200 1,000 800 600 400 200 Cu Barrier Cu Step 1 Tungsten Oxide ☺ ? 0 S-STI 2006 2007 2008 2009 2010 2011 2012 KHolland@Techcet.com AVS CMP-UG 07/2009 5
- Page 1 and 2: 2009 Market Slurries and Particles
- Page 3: Major Slurry Trends • For IC manu
- Page 7 and 8: Abrasive and Slurry Suppliers • N
- Page 9 and 10: IC CMP Slurry Suppliers Cu Barrier
- Page 11 and 12: IC CMP Slurry Suppliers Cu Barrier
- Page 13 and 14: Transition to Copper 100% Interconn
- Page 15 and 16: IC CMP Slurry Suppliers • High gr
- Page 17 and 18: Si Wafer and Slurry • SiC for Si
- Page 19 and 20: The Techcet Group, LLC • Techcet
• Silica Comes <strong>in</strong> 3 Types<br />
Silica for <strong>CMP</strong><br />
• “Fumed”: flame vapor-phase hydrolysis of SiCl 4 or the<br />
like … 3 major suppliers<br />
• “Colloidal”: precipitated from sodium silicate & H 2 SO 4 ...<br />
>8 suppliers<br />
• “Sol”: Stöber process condensation of silicon alkoxide<br />
(TEOS, TMOS) w/ ammonia & water, at least 2 major<br />
suppliers<br />
• Abrasives <strong>and</strong> Applications<br />
• Oxide/ILD ≤65nm use less aggressive particles: fumed<br />
to colloidal or milled fumed<br />
• Copper “Step 1” predom<strong>in</strong>ately uses Colloidal<br />
• Copper Barrier (<strong>and</strong> Dielectric Cap) uses Colloidal or Sol<br />
• Tungsten fumed <strong>and</strong> colloidal<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 4
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