2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group

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IC CMP Slurry Challenges • ILD/PMD/Oxide • Commoditization and Affect on Suppliers • Improved surface finish post CMP • Selective STI • Lower Defects and Lower Cost (Ceria Expense) • Tungsten • Lower Defects and Lower Cost (Competition) • Copper and Barrier • Each Cu Node Expects a New Formulation • Costly for Supplier, Pricy for End User • FEOL Polish • Polish of ILD thru poly gate prior to poly etchback and metal gates KHolland@Techcet.com AVS CMP-UG 07/2009 16
Si Wafer and Slurry • SiC for Si ingot slicing not a large market • Solar use is >5x the volume of IC wafers • SiC revenues will approach $40M in 2009 KHolland@Techcet.com AVS CMP-UG 07/2009 17
Page 1 and 2: 2009 Market Slurries and Particles
Page 3 and 4: Major Slurry Trends • For IC manu
Page 5 and 6: Annual Revenue (M$USD) IC CMP Slurr
Page 7 and 8: Abrasive and Slurry Suppliers • N
Page 9 and 10: IC CMP Slurry Suppliers Cu Barrier
Page 11 and 12: IC CMP Slurry Suppliers Cu Barrier
Page 13 and 14: Transition to Copper 100% Interconn
Page 15: IC CMP Slurry Suppliers • High gr
Page 19 and 20: The Techcet Group, LLC • Techcet

2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group

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