2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group 2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
IC CMP Slurry Challenges • ILD/PMD/Oxide • Commoditization and Affect on Suppliers • Improved surface finish post CMP • Selective STI • Lower Defects and Lower Cost (Ceria Expense) • Tungsten • Lower Defects and Lower Cost (Competition) • Copper and Barrier • Each Cu Node Expects a New Formulation • Costly for Supplier, Pricy for End User • FEOL Polish • Polish of ILD thru poly gate prior to poly etchback and metal gates KHolland@Techcet.com AVS CMP-UG 07/2009 16
Si Wafer and Slurry • SiC for Si ingot slicing not a large market • Solar use is >5x the volume of IC wafers • SiC revenues will approach $40M in 2009 KHolland@Techcet.com AVS CMP-UG 07/2009 17
- Page 1 and 2: 2009 Market Slurries and Particles
- Page 3 and 4: Major Slurry Trends • For IC manu
- Page 5 and 6: Annual Revenue (M$USD) IC CMP Slurr
- Page 7 and 8: Abrasive and Slurry Suppliers • N
- Page 9 and 10: IC CMP Slurry Suppliers Cu Barrier
- Page 11 and 12: IC CMP Slurry Suppliers Cu Barrier
- Page 13 and 14: Transition to Copper 100% Interconn
- Page 15: IC CMP Slurry Suppliers • High gr
- Page 19 and 20: The Techcet Group, LLC • Techcet
IC <strong>CMP</strong> Slurry Challenges<br />
• ILD/PMD/Oxide<br />
• Commoditization <strong>and</strong> Affect on Suppliers<br />
• Improved surface f<strong>in</strong>ish post <strong>CMP</strong><br />
• Selective STI<br />
• Lower Defects <strong>and</strong> Lower Cost (Ceria Expense)<br />
• Tungsten<br />
• Lower Defects <strong>and</strong> Lower Cost (Competition)<br />
• Copper <strong>and</strong> Barrier<br />
• Each Cu Node Expects a New Formulation<br />
• Costly for Supplier, Pricy for End User<br />
• FEOL Polish<br />
• Polish of ILD thru poly gate prior to poly etchback <strong>and</strong><br />
metal gates<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 16
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