2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group 2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
IC CMP Slurry Suppliers Cu Barrier S‐STI Oxide • High growth • Transition to Cu from Al • Growing passes per wafer start • Customers’ priorities differ • New slurries for each new generation? Cu Step 1 3 suppliers split 75% 2 others >9% Tungsten KHolland@Techcet.com
IC CMP Slurry Suppliers • High growth, but less volume than Cu polish • Customers’ priorities similar • New slurries for each new generation due to low k dielectrics? 1 major >40% 4 others >10% Cu Barrier S‐STI Oxide Cu Step 1 Tungsten KHolland@Techcet.com
- Page 1 and 2: 2009 Market Slurries and Particles
- Page 3 and 4: Major Slurry Trends • For IC manu
- Page 5 and 6: Annual Revenue (M$USD) IC CMP Slurr
- Page 7 and 8: Abrasive and Slurry Suppliers • N
- Page 9 and 10: IC CMP Slurry Suppliers Cu Barrier
- Page 11 and 12: IC CMP Slurry Suppliers Cu Barrier
- Page 13: Transition to Copper 100% Interconn
- Page 17 and 18: Si Wafer and Slurry • SiC for Si
- Page 19 and 20: The Techcet Group, LLC • Techcet
IC <strong>CMP</strong> Slurry Suppliers<br />
• High growth, but less<br />
volume than Cu polish<br />
• Customers’ priorities<br />
similar<br />
• New slurries for each<br />
new generation due to<br />
low k dielectrics?<br />
1 major >40%<br />
4 others >10%<br />
Cu Barrier<br />
S‐STI<br />
Oxide<br />
Cu Step 1<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
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