2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
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IC <strong>CMP</strong> Slurry Suppliers<br />
Cu Barrier<br />
S‐STI<br />
Oxide<br />
• High growth<br />
• Transition to Cu<br />
from Al<br />
• Grow<strong>in</strong>g passes<br />
per wafer start<br />
• Customers’ priorities<br />
differ<br />
• New slurries for each<br />
new generation?<br />
Cu Step 1<br />
3 suppliers split 75%<br />
2 others >9%<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
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