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2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group

2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group

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IC <strong>CMP</strong> Slurry Suppliers<br />

• Mostly ≤ 65 nm<br />

S‐STI<br />

Cu Barrier 1 strong supplier, >70% • S<strong>in</strong>gle process per wafer<br />

start<br />

• Cerium is costly<br />

Oxide<br />

Cu Step 1<br />

Tungsten<br />

KHoll<strong>and</strong>@<strong>Techcet</strong>.com

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