2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
2009 Market Slurries and Particles in CMP & a Bit ... - Techcet Group
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<strong>2009</strong> <strong>Market</strong><br />
<strong>Slurries</strong> <strong>and</strong> <strong>Particles</strong> <strong>in</strong><br />
<strong>CMP</strong> & a <strong>Bit</strong> Beyond<br />
NCCAVS <strong>CMP</strong>UG Semicon W Meet<strong>in</strong>g<br />
Karey Holl<strong>and</strong>, Ph.D.<br />
July 14, <strong>2009</strong><br />
<strong>Techcet</strong> <strong>Group</strong>, LLC.<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com<br />
www.techcet.com
<strong>Slurries</strong> & <strong>Particles</strong> <strong>in</strong> High Tech<br />
• IC <strong>CMP</strong> is by far the largest <strong>in</strong> Revenues<br />
• Si Wafer production<br />
• Cutt<strong>in</strong>g the Si Ingot <strong>in</strong>to wafers uses SiC<br />
cutt<strong>in</strong>g fluids<br />
• Si Wafer polish<strong>in</strong>g <strong>and</strong> f<strong>in</strong>al polish use high<br />
purity & excellent surface quality <strong>CMP</strong> with<br />
silicas<br />
• Lower tech applications abound … re-use<br />
of spent <strong>CMP</strong> slurries?<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 2
Major Slurry Trends<br />
• For IC manufactur<strong>in</strong>g, silica dom<strong>in</strong>ates the slurry<br />
market <strong>in</strong> amount used<br />
• For STI, ceria is preferred for more advanced<br />
technologies, but is much more expensive per<br />
gram.<br />
• For Wire Cutt<strong>in</strong>g of the Si Ingot (IC <strong>and</strong> Solar)<br />
SiC particles are used as cutt<strong>in</strong>g fluid<br />
• For Si wafer manufactur<strong>in</strong>g polish it’s silica<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com<br />
AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 3
• Silica Comes <strong>in</strong> 3 Types<br />
Silica for <strong>CMP</strong><br />
• “Fumed”: flame vapor-phase hydrolysis of SiCl 4 or the<br />
like … 3 major suppliers<br />
• “Colloidal”: precipitated from sodium silicate & H 2 SO 4 ...<br />
>8 suppliers<br />
• “Sol”: Stöber process condensation of silicon alkoxide<br />
(TEOS, TMOS) w/ ammonia & water, at least 2 major<br />
suppliers<br />
• Abrasives <strong>and</strong> Applications<br />
• Oxide/ILD ≤65nm use less aggressive particles: fumed<br />
to colloidal or milled fumed<br />
• Copper “Step 1” predom<strong>in</strong>ately uses Colloidal<br />
• Copper Barrier (<strong>and</strong> Dielectric Cap) uses Colloidal or Sol<br />
• Tungsten fumed <strong>and</strong> colloidal<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 4
Annual Revenue (M$USD)<br />
IC <strong>CMP</strong> Slurry Growth ?<br />
1,200<br />
1,000<br />
800<br />
600<br />
400<br />
200<br />
Cu Barrier<br />
Cu Step 1<br />
Tungsten<br />
Oxide<br />
☺<br />
?<br />
<br />
0<br />
S-STI<br />
2006 2007 2008 <strong>2009</strong> 2010 2011 2012<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 5
ILD Abrasive Migration<br />
140<br />
25%<br />
Revenues ($M)<br />
100<br />
60<br />
20%<br />
15%<br />
10%<br />
0<br />
Colloidal<br />
Fumed<br />
Volume %<br />
Colloidal<br />
2002 2003 2004 2005 2006 2007 2008 <strong>2009</strong><br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 6
Abrasive <strong>and</strong> Slurry<br />
Suppliers<br />
• Numerous Suppliers of Slurry (>21)<br />
• Abrasives only (>15)<br />
• <strong>Slurries</strong> only (>15)<br />
• Both Slurry <strong>and</strong> Abrasives (>6)<br />
• Unlike <strong>CMP</strong> Pads, the Slurry <strong>and</strong> Abrasive<br />
Supplier List is Stable<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com CGMG 07/2008 7<br />
AVS <strong>CMP</strong>-UG 07/<strong>2009</strong>
IC <strong>CMP</strong> Slurry <strong>Market</strong> Size<br />
by Application Revenue<br />
Cu Barrier<br />
19%<br />
S‐STI<br />
8%<br />
Oxide<br />
16%<br />
Cu Step 1<br />
28%<br />
Tungsten<br />
29%<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Suppliers<br />
Cu Barrier<br />
1 major >40%<br />
4 others >10%<br />
S‐STI<br />
1 strong supplier, >70%<br />
Oxide<br />
2 major suppliers, >30% each<br />
Cu Step 1<br />
3 suppliers split 75%<br />
2 others >9%<br />
Tungsten<br />
1 strong supplier, >75%<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Suppliers<br />
Cu Barrier<br />
S‐STI<br />
Cu Step 1<br />
Oxide<br />
2 major suppliers<br />
>30% each<br />
• Commodity bus<strong>in</strong>ess<br />
• Customer pric<strong>in</strong>g pressure<br />
• Low passes per wafer start<br />
<strong>in</strong> newer nodes<br />
• Opportunities <strong>in</strong> ≤ 45 nm<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Suppliers<br />
Cu Barrier<br />
S‐STI<br />
Oxide<br />
Cu Step 1<br />
Tungsten<br />
1 strong supplier, >75%<br />
• Aggressive patent defense<br />
• W not large growth market<br />
• Slurry dilution &<br />
competition would erode<br />
marg<strong>in</strong>s<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Suppliers<br />
• Mostly ≤ 65 nm<br />
S‐STI<br />
Cu Barrier 1 strong supplier, >70% • S<strong>in</strong>gle process per wafer<br />
start<br />
• Cerium is costly<br />
Oxide<br />
Cu Step 1<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
Transition to Copper<br />
100%<br />
Interconnects<br />
80%<br />
71%<br />
74%<br />
Percent Wafer Starts w/ Cu<br />
60%<br />
40%<br />
20%<br />
2%<br />
15%<br />
37%<br />
51%<br />
45%<br />
56%<br />
0%<br />
RAM MPU<br />
180 nm<br />
RAM MPU<br />
130 nm<br />
RAM MPU<br />
90 nm<br />
RAM MPU<br />
65 nm<br />
RAM MPU<br />
45 nm<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 13
IC <strong>CMP</strong> Slurry Suppliers<br />
Cu Barrier<br />
S‐STI<br />
Oxide<br />
• High growth<br />
• Transition to Cu<br />
from Al<br />
• Grow<strong>in</strong>g passes<br />
per wafer start<br />
• Customers’ priorities<br />
differ<br />
• New slurries for each<br />
new generation?<br />
Cu Step 1<br />
3 suppliers split 75%<br />
2 others >9%<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Suppliers<br />
• High growth, but less<br />
volume than Cu polish<br />
• Customers’ priorities<br />
similar<br />
• New slurries for each<br />
new generation due to<br />
low k dielectrics?<br />
1 major >40%<br />
4 others >10%<br />
Cu Barrier<br />
S‐STI<br />
Oxide<br />
Cu Step 1<br />
Tungsten<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com
IC <strong>CMP</strong> Slurry Challenges<br />
• ILD/PMD/Oxide<br />
• Commoditization <strong>and</strong> Affect on Suppliers<br />
• Improved surface f<strong>in</strong>ish post <strong>CMP</strong><br />
• Selective STI<br />
• Lower Defects <strong>and</strong> Lower Cost (Ceria Expense)<br />
• Tungsten<br />
• Lower Defects <strong>and</strong> Lower Cost (Competition)<br />
• Copper <strong>and</strong> Barrier<br />
• Each Cu Node Expects a New Formulation<br />
• Costly for Supplier, Pricy for End User<br />
• FEOL Polish<br />
• Polish of ILD thru poly gate prior to poly etchback <strong>and</strong><br />
metal gates<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 16
Si Wafer <strong>and</strong> Slurry<br />
• SiC for Si <strong>in</strong>got slic<strong>in</strong>g not a large market<br />
• Solar use is >5x the volume of IC wafers<br />
• SiC revenues will approach $40M <strong>in</strong> <strong>2009</strong><br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 17
Slurry Disposal<br />
• Lower tech applications abound<br />
• Reclaim <strong>and</strong> re-use of spent <strong>CMP</strong> slurries<br />
• Concentrate used slurry<br />
• Reduce heavy metal contam<strong>in</strong>ation<br />
• Road filler or ??<br />
• Does it pay to be green?<br />
KHoll<strong>and</strong>@<strong>Techcet</strong>.com AVS <strong>CMP</strong>-UG 07/<strong>2009</strong> 18
The <strong>Techcet</strong> <strong>Group</strong>, LLC<br />
• <strong>Techcet</strong> Partners<br />
• John Housley<br />
• Lita Shon-Roy<br />
• Steven Holl<strong>and</strong>, Ph.D.<br />
• Karey Holl<strong>and</strong>, Ph.D.<br />
• <strong>CMP</strong> Technical Associates<br />
• Michael Fury, Ph.D.<br />
• Robert Rhoades, Ph.D.<br />
© <strong>2009</strong> <strong>Techcet</strong> <strong>Group</strong>, LLC<br />
NCCAVS <strong>CMP</strong>UG<br />
July 14, <strong>2009</strong> 19
The <strong>Techcet</strong> <strong>Group</strong>, LLC<br />
• <strong>2009</strong> <strong>CMP</strong> Report Orders<br />
• Lita Shon-Roy<br />
• 925-413-9373<br />
• LShonRoy@<strong>Techcet</strong>.com<br />
• Karey Holl<strong>and</strong><br />
• 503-647-5440<br />
• KHoll<strong>and</strong>@<strong>Techcet</strong>.com<br />
• Fax 480-275-3101<br />
© <strong>2009</strong> <strong>Techcet</strong> <strong>Group</strong>, LLC<br />
NCCAVS <strong>CMP</strong>UG<br />
July 14, <strong>2009</strong> 20
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