Understanding the importance of proper memory configuration for ...
Understanding the importance of proper memory configuration for ...
Understanding the importance of proper memory configuration for ...
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Kingston Technology<br />
Optimising Memory <strong>for</strong> Data Centers<br />
Mike Mohney Q2 2013<br />
Sr Technology Manager<br />
©2012 Kingston Technology Corporation. All rights reserved. All trademarks and registered trademarks are <strong>the</strong> <strong>proper</strong>ty <strong>of</strong> <strong>the</strong>ir respective owners.
Kingston Snapshot<br />
• Founded in 1987<br />
• Privately Held Company<br />
• Financially Secure<br />
• 2012 Net Revenue <strong>of</strong> over $4 Billion<br />
• Over 40% Global Market Share<br />
• More than 4,700 Employees Worldwide<br />
• Worldwide Manufacturing & Testing<br />
• Focused Business:<br />
Memory Modules and Flash Products<br />
• Delivering over 1M units per day<br />
• Products distributed in 125 Countries and<br />
available in over 30,000 locations worldwide;<br />
widely accepted brand<br />
2
Strategic Alliances: Compatibility Check<br />
Kingston works with many facets <strong>of</strong> technology to ensure product compatibility and also teams with<br />
s<strong>of</strong>tware & entertainment leaders to add more value to Flash products.<br />
Industry Leading OS,<br />
S<strong>of</strong>tware, Hardware<br />
PC OEM’s Mo<strong>the</strong>rboard Manufacturers Value-added Content<br />
Source: Kingston Technology, April 2012<br />
3
Kingston Server Memory Dynamic Burn-In Testing<br />
100% dynamic module burn-in testing exceeds OEM specifications<br />
• Since 2004, Kingston has set a new <strong>memory</strong> reliability standard<br />
• Testing includes all DDR2 and DDR3 server <strong>memory</strong><br />
Testing simulates 3 months <strong>of</strong> heavy server use<br />
• 24 hours in Kingston-designed test chambers<br />
• Tested at 100° Celsius / 212° Fahrenheit and higher voltage<br />
• Every cell <strong>of</strong> every DRAM is continuously exercised<br />
Nearly eliminates Early Life Failures<br />
Launched in 2004<br />
DDR, DDR2, DDR3 server <strong>memory</strong><br />
Kingston<br />
Patented<br />
Kingston hold 29 patents related to <strong>memory</strong> testing<br />
*Kingston 6-month trial testing in 2004 showed that 90% <strong>of</strong> Early Life DRAM<br />
failures are now being screened at <strong>the</strong> factory – be<strong>for</strong>e shipment to customers.<br />
4
DDR3 Memory – The Mainstream Technology in 2010-2014+<br />
1987-<br />
1990<br />
FAST<br />
PAGE<br />
MODE<br />
EDO<br />
1997-<br />
1999 2000<br />
PC66<br />
PC100<br />
PC133<br />
RDRAM<br />
PC600<br />
PC700<br />
PC800<br />
2001-<br />
2002 2003<br />
DDR200<br />
DDR266<br />
DDR333<br />
DDR400<br />
RDRAM<br />
PC1066<br />
2004-<br />
2005 2006<br />
DDR2-400<br />
DDR2-533<br />
DDR2-667<br />
DDR2-800<br />
FB-DIMMs<br />
EU: RoHS/WEEE<br />
Compliance<br />
2007-<br />
2009<br />
DDR3-800<br />
DDR3-1066<br />
DDR3-1333<br />
2010-<br />
2012<br />
DDR3L 1.35V<br />
DDR3-1600<br />
DDR3-1866<br />
DDR3L-1600<br />
LRDIMM<br />
2013<br />
EU: RoHS II<br />
Compliance<br />
2014<br />
DDR3-2133<br />
DDR4-2133<br />
2015<br />
DDR4-2400<br />
DDR3 expected to top out at 2133MHz (JEDEC)<br />
• Voltages expected to drop as low as 1.25V (DDR3U)<br />
DDR4 (2014) expected to debut at 2133MHz and perhaps reach 4266MHz<br />
• Voltages planned are 1.2V - 1.05V
Servers have evolved, along with <strong>the</strong> complexity <strong>of</strong> <strong>memory</strong><br />
<strong>configuration</strong><br />
2000 2013<br />
• 4 Memory Slots<br />
• Maximum Memory:<br />
2 GB<br />
• Memory Configuration<br />
Option 4x512MB<br />
• 24 Memory Slots<br />
• Maximum Memory:<br />
768 GB<br />
• Multiple Memory<br />
Configuration options
Today, Server Memory Configuration is influenced by many things<br />
Technology:<br />
ECC UDIMM, ECC<br />
Reg or LRDIMM<br />
Speed:<br />
Memory<br />
CPU<br />
Module quantity<br />
Voltage:<br />
Business requirements: 1.5V or 1.35V<br />
power, per<strong>for</strong>mance, capacity Power budget<br />
Memory budget<br />
Channels: Single, dual,<br />
triple or quad<br />
Memory expertise<br />
DRAM<br />
manufacturing<br />
technology<br />
Processor<br />
Selection<br />
Ranks:<br />
1, 2 or 4<br />
Processor<br />
Generation<br />
Module capacity
Memory Configuration Options by Processor<br />
Memory Supported<br />
Memory Configuration<br />
Xeon 5500 Series Up to DDR3-1333 Triple-Channel = K3 kits<br />
Xeon 5600 Series<br />
Xeon E5 Series<br />
Xeon 6500 / 7500 / E7 Series<br />
Xeon W3500 / 3600 / E3 Series<br />
Up to DDR3-1333 /<br />
DDR3L<br />
Up to DDR3-1600<br />
DDR3-1066<br />
DDR3L on E7 Series<br />
Up to DDR3-1066<br />
DDR3L on W3600<br />
Triple-Channel = K3 kits<br />
Quad-channel = K4 kits<br />
Triple-channel = K3 kits<br />
Quad-channel = K4 kits<br />
Triple-channel = K3 kits<br />
Xeon LC3500 Up to DDR3-1066 Dual-channel = K2 kits<br />
Opteron 8400 / 2400 Series Up to DDR2-800 Dual-channel = K2 kits<br />
Opteron 6100 / 6200 Series<br />
Up to DDR3-1333 /<br />
DDR3L<br />
Quad-channel = K4 kits<br />
Opteron 4100 / 4200 Series DDR3 / DDR3L Dual-channel = K2 kits<br />
Note: This is not a complete list <strong>of</strong> lower-end processors used <strong>for</strong> entry-level 1P servers.<br />
8
Intel Xeon E5-2600 and E5-1600 Processors<br />
Processor Model<br />
Determines Memory<br />
Speed (Bandwidth)<br />
9<br />
Source: Intel.com
Module Types For Server Plat<strong>for</strong>ms (2009-2013+)<br />
Unbuffered ECC DIMM Registered DIMM Load Reduced DIMM<br />
E5 & 6200 Series Only<br />
• You can configure a server <strong>memory</strong> with ei<strong>the</strong>r:<br />
• Unbuffered ECC DIMMs – up to 8GB each* – For entry-level servers & workstations<br />
• Registered DIMMs – up to 32GB each* – For mid-range and higher-end servers & workstations<br />
• Load Reduced DIMMs – up to 32GB each – For faster maximum capacity plat<strong>for</strong>ms<br />
• Optimizing Memory:<br />
• Install <strong>memory</strong> in kits <strong>of</strong> identical modules according to <strong>memory</strong> architecture<br />
• Configure all processors <strong>the</strong> same way <strong>for</strong> most bandwidth<br />
Install ei<strong>the</strong>r all RDIMMs or all ECC UDIMMs or all LRDIMMs, cannot mix!<br />
Mixing DDR3 (1.5V) and DDR3L (1.35V) will default <strong>the</strong> <strong>memory</strong> to 1.5V.<br />
* Plat<strong>for</strong>ms may limit <strong>the</strong> number <strong>of</strong> Unbuffered ECC or Quad Rank modules that can be installed.<br />
10
Intel Reference – E5-2600 DDR3 RDIMM Memory Speeds<br />
1.5V<br />
Module Type<br />
(No Mixing in<br />
a Server)<br />
Registered<br />
DIMM<br />
(RDIMM)<br />
Module Ranks<br />
SR/DR=Single/Dual<br />
QR = Quad<br />
1 DIMM per<br />
Channel<br />
1 DPC<br />
2 DIMMs per<br />
Channel<br />
2 DPC<br />
3 DIMMs per<br />
Channel<br />
3DPC<br />
SR/DR 1600 1600 1066<br />
QR 1066 800 X<br />
Module Type<br />
(No Mixing in<br />
a Server)<br />
Registered<br />
DIMM<br />
(RDIMM)<br />
Module Ranks<br />
SR/DR=Single/Dual<br />
QR = Quad<br />
1 DIMM per<br />
Channel<br />
1DPC<br />
1.35V<br />
2 DIMMs per<br />
Channel<br />
2DPC<br />
3 DIMMs per<br />
Channel<br />
3DPC<br />
SR/DR 1333 1333 1.5V<br />
QR 800 800 X<br />
1DPC 2DPC 3DPC<br />
11
Intel Reference – E5-2600 DDR3 LRDIMM & ECC UDIMM Memory Speeds<br />
1.5V / 1.35V<br />
Module Type<br />
(No Mixing in a Server)<br />
Module Ranks<br />
SR/DR=Single/Dual<br />
QR = Quad<br />
1 DIMM per<br />
Channel<br />
1 DPC<br />
2 DIMMs per<br />
Channel<br />
2 DPC<br />
3 DIMMs per<br />
Channel<br />
3DPC<br />
Load Reduced<br />
DIMM<br />
(LRDIMM)<br />
QR at 1.5V 1333 1333 1066<br />
QR at 1.35V 1066 1066 1066<br />
1DPC 2DPC 3DPC<br />
1.5V 1.35V<br />
Module Type<br />
(No Mixing in a Server)<br />
System Configuration<br />
1 DIMM per<br />
Channel<br />
1 DPC<br />
2 DIMMs<br />
per Channel<br />
2 DPC<br />
3 DIMMs<br />
per Channel<br />
3DPC<br />
1 DIMM per<br />
Channel<br />
1 DPC<br />
2 DIMMs per<br />
Channel<br />
2 DPC<br />
3 DIMMs per<br />
Channel<br />
3DPC<br />
ECC<br />
Unbuffered<br />
DIMM<br />
(ECC UDIMM)<br />
4 Sockets Per<br />
Processor<br />
8/12 Sockets<br />
Per Processor<br />
1600 1333 X 1333 X X<br />
1333 1333 X 1333 1066 X<br />
12
Balancing <strong>the</strong> Xeon 5500/5600 with Memory<br />
4G<br />
2G<br />
8G<br />
4G<br />
2G<br />
2G<br />
8G<br />
2G<br />
Unbalanced<br />
Configuration<br />
Near-Balanced<br />
Configuration<br />
8G<br />
4G<br />
2G<br />
vs<br />
8G<br />
4G<br />
Balanced<br />
Configuration<br />
8G<br />
4G<br />
2G<br />
Ultimate bandwidth and per<strong>for</strong>mance<br />
All sockets identically populated<br />
Stream-Triad Bandwidth<br />
(MB/sec)<br />
30000<br />
20000<br />
10000<br />
0<br />
Unbalanced<br />
3 channels<br />
Up to 17%<br />
lower b/w <strong>for</strong><br />
unbalanced<br />
<strong>configuration</strong><br />
Balanced<br />
3 channels<br />
Source: Intel
Set your goals be<strong>for</strong>e you choose your <strong>memory</strong><br />
Capacity<br />
Virtualization<br />
SQL databases<br />
In-Memory databases<br />
Big data/HADOOP<br />
Per<strong>for</strong>mance<br />
Complex modeling<br />
Audio & video editing<br />
Banking trades<br />
Transactions/second<br />
Power<br />
Power draw<br />
Heat dissipation<br />
Cooling requirements<br />
…or a combination <strong>of</strong> all <strong>of</strong> <strong>the</strong> above
How can <strong>the</strong> right Server DRAM <strong>configuration</strong> help your business?<br />
Reduce power consumption<br />
Save 6% Power consumption<br />
budget per server just by<br />
using <strong>proper</strong> server <strong>memory</strong><br />
<strong>configuration</strong><br />
Server per<strong>for</strong>mance<br />
improvement <strong>for</strong> transactional<br />
or database servers<br />
Higher frequency <strong>memory</strong><br />
provides faster access to data or<br />
improved transaction times<br />
Improve server<br />
consolidation ratios<br />
Go from 7 to 30 Active VMs<br />
just by increasing your server<br />
<strong>memory</strong> configs from 192 to<br />
768GB.<br />
Delay hardware refresh<br />
expenses<br />
By using <strong>the</strong> highest capacity<br />
and speeds in <strong>the</strong> fewest<br />
available slots, <strong>the</strong> server has a<br />
future upgrade path when your<br />
environment requires a boost
Capacity Benchmark: Increasing capacity allows <strong>for</strong> more<br />
database virtual machines<br />
7 VMs<br />
with<br />
192 GB<br />
10 VMs<br />
with<br />
256 GB<br />
30 VMs<br />
with<br />
768 GB<br />
Testing done with 1vCPU and 25GB RAM per VM on an HP Proliant DL380p Gen 8. For details, please see benchmark paper<br />
http://www.kingston.com/us/business/server_solutions/ram_per<strong>for</strong>mance.aspx
Power Benchmark: Save 6% on your total server power budget<br />
Savings at load in Watts<br />
16X16GB=256GB<br />
8X32GB=256GB<br />
Test system: SiS<strong>of</strong>tware BurnInTest 7.1 Pro on Intel® Romley plat<strong>for</strong>m HP Proliant ML350p Gen8 with two Intel Xeon E5 2650 processors and up to 256GB, 384GB or 512GB <strong>of</strong> <strong>memory</strong> (Dualrank<br />
KTH-PL316/16G or quad-rank KTH-PL310QLV/32G) installed. Tested in HP per<strong>for</strong>mance mode. Intel Hyper-threading technology disabled.
Per<strong>for</strong>mance Benchmark:<br />
Per<strong>for</strong>mance Result:<br />
40%<br />
Increased sustained<br />
transfer speeds –<br />
Ideal <strong>for</strong> scenarios<br />
where resources<br />
written to <strong>memory</strong><br />
require highest<br />
achievable<br />
per<strong>for</strong>mance to<br />
remain efficient.<br />
Relative <strong>memory</strong> frequency per<strong>for</strong>mance measured using<br />
SiS<strong>of</strong>t Sandra 2012<br />
70<br />
60<br />
50<br />
40<br />
30<br />
20<br />
10<br />
0<br />
41,9<br />
54,5<br />
64,1<br />
69,7<br />
800MHz 1066MHz 1033MHz 1600MHz<br />
Test <strong>configuration</strong> included SiS<strong>of</strong>tware Sandra 2012 Memory benchmark on Intel® Romley plat<strong>for</strong>m S2600GZ with two Xeon E5-2665 2.40GHz processors and<br />
192GB <strong>of</strong> <strong>memory</strong> (2 x KVR16R11D4K4/32) installed. CPU Hyper-threading and power saving features disabled.
Server <strong>memory</strong> <strong>configuration</strong> optimisation<br />
These scenarios illustrate that all three<br />
objectives can not be optimised at <strong>the</strong> same<br />
time. Priority should be to support <strong>the</strong><br />
business objective.<br />
Scenario 1<br />
Power<br />
• Scenario 1 shows that <strong>for</strong> this<br />
business achieving power<br />
optimisation is critical, while<br />
per<strong>for</strong>mance is more important than<br />
capacity.<br />
Capacity<br />
Per<strong>for</strong>mance<br />
• Scenario 2 shows that achieving<br />
maximum capacity has a higher<br />
priority than power or per<strong>for</strong>mance<br />
optimisation.<br />
Scenario 2<br />
Power<br />
In addition, <strong>the</strong> actual cost <strong>of</strong> <strong>the</strong> <strong>memory</strong> still<br />
needs to be considered.<br />
Capacity<br />
Per<strong>for</strong>mance
Kingston is educating <strong>the</strong> market on <strong>the</strong>se <strong>configuration</strong>s
Kingston Summary<br />
• Ranked #1 in DRAM<br />
• Ranked #1 in USB drives<br />
• Listed on America’s largest private companies<br />
• Worldwide presence/financially solid<br />
• Channel leadership – OEM, channel, Retail, eTail<br />
• Major investments in technology<br />
• Seat on JEDEC standards council<br />
• R&D partnerships with ODMs, datacenters, and technology leaders<br />
• Most extensive testing in <strong>the</strong> industry<br />
• Guaranteed compatibility/certifications<br />
• Flat, flexible organization able to customize solutions <strong>for</strong> a variety <strong>of</strong> business relationships<br />
• Managing <strong>the</strong> quality process – from wafer to module<br />
21
22<br />
Thank You
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