HP BladeSystem Family - Critical Facilities Round Table
HP BladeSystem Family - Critical Facilities Round Table HP BladeSystem Family - Critical Facilities Round Table
Robust Solution Requires a Holistic Approach • Complex problem • Multi-layered challenge • Interdependencies –standardsbased approach • Energy – finite planet resource Temperatur e 2nd law-based tool from chip scale to data center scale Non-uniform power Flow irreversibility Thermodynamic irreversibility Non-ideal effects Energ y flow Non-uniform power Flow irreversibility Non-ideal effects SYSTEM Non-uniform power CHIP Flow and thermodynamic work Ground state (ambient) DATA CENTER Exergy (available work) Source: HP Labs and UC Berkeley
It’s now one conversation Cooling solutions Infrastructure products Chip design System design Data center services Energy efficient data center (lowest TCO) Server & storage consolidation Industry standards Virtualization & automation technologies Power & cooling management Business continuity & availability
- Page 1 and 2: The Case for BladeSystem Servers No
- Page 3 and 4: Hardware Density Directions • Tre
- Page 5 and 6: Processors • Today and near futur
- Page 7 and 8: Long Term Server Power Density Cust
- Page 9 and 10: Datacenter Inefficiencies • Unman
- Page 11 and 12: Addressing High Density Zones • D
- Page 13 and 14: Problem: Limited power budget and g
- Page 15 and 16: The HP BladeSystem approach to simp
- Page 17 and 18: c7000 Enclosure Front View Server b
- Page 19 and 20: Processor Naming Decoder - AMD AMD
- Page 21 and 22: The Impact of New Memory Styles •
- Page 23 and 24: Using 32A 3Ø PDU - Intl • S332 -
- Page 25 and 26: Greater efficiency and cost savings
- Page 27 and 28: Dynamic Power Saver Operation Switc
- Page 29 and 30: ProLiant Power Regulator: advanced
- Page 31 and 32: Power Regulator for ProLiant Overvi
- Page 33 and 34: ProLiant Power Management ROM or Op
- Page 35 and 36: c7000 PARSEC Architecture • Hybri
- Page 37 and 38: Fans • Fan Laws − Volume of air
- Page 39 and 40: HP Active Cool Fan • Custom fan d
- Page 41 and 42: Enclosure Management Enclosure infl
- Page 43 and 44: HP Insight Display Local BladeSyste
- Page 45 and 46: Cooling Strategies: How is the mark
- Page 47: Industry needs to benchmark data ce
- Page 51 and 52: Introducing HP Dynamic Smart Coolin
- Page 53 and 54: HP Data Center Solution Builder Pro
- Page 55: Thank you! Ken Baker BladeSystem In
It’s now one conversation<br />
Cooling<br />
solutions<br />
Infrastructure<br />
products<br />
Chip<br />
design<br />
System<br />
design<br />
Data<br />
center<br />
services<br />
Energy efficient<br />
data center<br />
(lowest TCO)<br />
Server<br />
&<br />
storage<br />
consolidation<br />
Industry<br />
standards<br />
Virtualization<br />
&<br />
automation<br />
technologies<br />
Power<br />
&<br />
cooling<br />
management<br />
Business<br />
continuity &<br />
availability
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