MCP73831 Datasheet - Adafruit

MCP73831
8-Lead Plastic Dual-Flat, No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
D
b
p
n
L
K
E
E2
PIN 1
ID INDEX
AREA
(NOTE 1)
TOP VIEW
EXPOSED
METAL
PAD
(NOTE 2)
DETAIL
ALTERNATE
CONTACT
CONFIGURATION
2 1
D2
BOTTOM VIEW
A3
A1
A
EXPOSED
TIE BAR
(NOTE 3)
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Length §
Contact-to-Exposed Pad §
Contact Width
Units
Dimension Limits
n
e
A
A1
A3
L
K
.031 .035 .039 0.80
.118 BSC
b .008 .010 .012 0.20
* Controlling Parameter
** Not within JEDEC parameters
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad may vary according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
D
E
D2
E2
MIN
.000 .001
.008 REF.
.079 BSC
.051
.059
.012
INCHES
NOM
.020 BSC
8
–
–
MAX
.002 0.00
.069
.075
MIN
1.30**
1.50**
MILLIMETERS*
NOM
0.50 BSC
0.90
0.20 REF.
2.00 BSC
3.00 BSC
8
–
–
MAX
1.00
0.02 0.05
1.75
1.90
.016 .020 0.30 0.40 0.50
.008 – – 0.20 –
–
0.25 0.30
Revised 09-12-05
DS21984A-page 16
© 2005 Microchip Technology Inc.