40nm...40 Nanometer - UMC

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40 Nanometer - Customer-Driven Foundry Solutions UMC’s volume production 40-nanometer technology supports today’s high performance and low power requirements. Many customers have engaged with UMC for their 40nm projects, with multiple designs in various stages of production. UMC's 40nm utilizes advanced processes such as immersion lithography, ultra shallow junction, mobility enhancement techniques and ultra low-k dielectrics for maximum power and performance optimization. UMC's 40nm process consists of a low power platform (LP) focusing on the low power and low leakage design requirements for mobile and consumer applications, and a generic platform (G) that is optimized for a broad range of consumer and high-speed applications. Designers also benefit from comprehensive device offerings that include features to help optimize power and performance, different I/O voltage choices and analog/RF design resources. 40nm Key Features • Integrated flows for logic, Mixed-Signal/RF • Shallow trench isolation • Advanced mobility enhancement techniques (Channel orientation, SMT, DSL, eSiGe) • Retrograde twin well (Triple well option) Prtbe . Wires. Consumer• Wirless • Immersion Lithography implemented by NA=1.2 • Up to 1P11M copper metal layers with ULK (k=2.5) • 6T/8T SRAM bit cell option • Mini-second anneal Portable technology . Wireless for ultra . Consumer • e-Fuse option shallow junction Portable . Wireless . Consumer • BOAC (Bonding Over Active Circuit) • Poly gate & S/D with NiSi process • Wire Bond/Flip Chip option Technology to Meet Broad Applications UMC 40nm Technology Low Power (LP) Generic (G) Portable • Wireless • Consumer Graphics • Network
40nm Logic/MS/RF Devices 40nm Logic/MS/RF Technology Core Devices I/O Devices MS/RF Devices G_LVt 0.9V(1.0V) 1.8V I/O Native Vt G_RVt 0.9V(1.0V) 2.5V I/O (OD 3.3V;UD 1.8V) Bipolar G_HVt 0.9V(1.0V) Diodes LP_uLVt 1.1V MIM/MOM LP_LVt 1.1V NCAP LP_RVt 1.1V Resistors LP_HVt 1.1V Inductor G: Generic Platform LP: Low Power : RF model available; other models available upon customer request Comprehensive IP Portfolio UMC offers comprehensive design resources that enable our customers to fully realize the advantages of UMC's advanced technologies. UMC's fundamental IPs (standard cells, I/Os, and memory compilers) help customers easily migrate their designs to the next process generation to realize significant performance advantages while also reducing die size. Customers can also leverage application specific IPs that are specialized for all types of mainstream applications such as digital TVs, cellular baseband controllers, graphics, and networking to overcome time-to-market challenges. DTV PLL, USB, LVDS, Embedded Memory, HDMI, DDRn Graphic DDRn, PCI-e, HDMI, LVDS, Embedded Memory Baseband Mobile DDR,USB, LVDS, PLL, Embedded Memory Networking Mobile DDR, USB, PCI-e, SATA, Embedded Memory
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Page 5 and 6: Low Power Features of Standard Cell
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40nm...40 Nanometer - UMC

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