Welcome to the ISMI NGF & 450mm Industry Briefing - Sematech

SEMICON West 2008
Accelerating Manufacturing Productivity
Welcome to the ISMI
NGF & 450mm Industry Briefing
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Accelerating Manufacturing Productivity
Introduction &
Opening Remarks
Scott Kramer
VP, Manufacturing
Technology
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Meeting Outline
• Purpose
– Maintain industry communication regarding ISMI programs related to NGF
and 450mm.
– Promote supplier participation in industry collaboration forums and ISMI
supplier engagement.
– Inform industry of emerging needs and expectations related to equipment
and factory productivity for next generation fabs and 450mm transition.
• Expected results
– Attendees will gain more insight into the current status and future direction
of ISMI programs. The Briefing is expected to stimulate interest and
participation where opportunities exist for supplier engagement with ISMI.
July 16, 2008 3

Meeting Agenda
• (10) Welcome and Opening Remarks – S. Kramer
• (35) NGF Session – O. Rothe
– NGF Program overview
– NGF Guidelines priorities
– Overall productivity and cost goals
– Productivity modeling and metrics
– Outlook 2009 and Beyond
– Key messages
• (35) 450mm – T. Abell
– 450mm Program overview
– Guidelines updates
– Interoperability Test Bed results
– Silicon studies
– Supplier engagement summary
– Outlook 2009 and Beyond
– Key messages
• (10) Closing remarks and Q&A – J. Draina
July 16, 2008 4

Accelerating Manufacturing Productivity
ISMI Overview
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

ISMI Worldwide Cooperation
• Members represent over half of world
semiconductor sales
July 16, 2008 6

ISMI Mission - Accelerating
Manufacturing Productivity
ISMI provides productivity solutions for current and
future challenges in the manufacturing plants of our
membership, so that our members will achieve best in class
productivity levels.
We will accomplish this by providing platforms for
collaboration among our members and directing
development activities in key areas identified by our
members.
July 16, 2008 7

Next Generation Factory Vision Realization
450mm
450mm Factory Integration
Test Bed
450mm Factory Integration
Guidelines & Standards
450mm Silicon Wafer
450mm
Readiness
NGF
Software Infrastructure
SWP/Small lot-size Factory
Availability Improvement
FWD/Set-up Reduction
300mm Classic
Foundation
• Complementary forward-compatible paths for NGF and 450mm
– Realization of 450mm is built upon coordinated improvements from NGF and
450mm activities to efficiently utilize industry resources
• Collaboration is a critical success factor: Inside and Outside ISMI
July 16, 2008 8

Productivity Overview
• Member companies all agree – higher productivity is a
must, always
• There are multiple solutions possible
• ISMI philosophy – accelerate productivity improvement
– Be impatient
– Do not delay or hesitate
– Consider all information and possible solutions
• Introduction and timing of any productivity improvements
are determined by markets
– Decisions by informed buyers and sellers
– Free and open
– Level playing field
July 16, 2008 9

Meeting Agenda
• (10) Welcome and Opening Remarks – S. Kramer
• (35) NGF Session – O. Rothe
– NGF Program overview
– NGF guidelines priorities
– Overall productivity and cost goals
– Productivity modeling and metrics
– Outlook 2009 and beyond
– Key messages
• (35) 450mm – T. Abell
– 450mm Program overview
– Guidelines updates
– Interoperability Test Bed results
– Silicon studies
– Supplier engagement summary
– Outlook 2009 and beyond
– Key messages
• (10) Closing remarks and Q&A – J. Draina
July 16, 2008 10

SEMICON West 2008
Accelerating Manufacturing Productivity
ISMI Next Generation Factory
Program Briefing
Olaf Rothe
NGF Program Manager
July 16, 2008
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

ISMI NGF Program Mission
• Continuously refine, communicate and realize the next generation
factory vision and “19 point Factory Guidelines”
• Address global and infrastructure aspects of both hardware and
software development, targeting new capabilities in equipment and
factory productivity
• Enable retrofit of both new and improved capabilities into existing 200
and 300mm factories as a high priority
• Integrate a step-wise and coordinated waste reduction approach to
realize equipment and factory productivity improvements targets
• Provide a complementary forward-compatible approach of 300mm
NGF to 450mm to address the needs of our various member
constituencies and minimize the R&D expenditure by the industry
• Deliver NGF productivity improvements by 2012, in accordance with
the ITRS, to realize the necessary cycle time and cost reduction and to
stay on Moore’s Law
July 16, 2008 12

ISMI NGF 2008 Program Objectives
• Key supplier engagement and coordination for major
equipment improvement
– First Wafer Delay, Availability & Predictability, Quality
Data Access and Usage
• Identify requirements to implement small lot
manufacturing and single wafer processing
• Identify productivity improvements
necessary to implement fully continuous
processing
• Address requirements for advanced material
delivery and factory control systems to take
full advantage of the equipment/factory
productivity improvements
July 16, 2008 13

ISMI NGF Program Overview
NGF Target for 2012 centered at
- 50% Cycle Time Reduction
- 30% Cost Reduction
ITRS, Moore’s Law,
IDM Requirements
19 Point Guidelines
ISMI CIP Program
NPW
FWD
ISMI NGF Program
EDA
EEQA
SLS
ECM
What Else ?
DQ
PPM
VM
July 16, 2008 14

19 Point Guidelines and NGF Projects
• Member Company Prioritization in 2007
• Supplier Perspective on Priorities
• Very Good Correlation
1. Maximum 450mm carrier capacity and specification for early prototypes
2. Front Opening 450mm wafer carriers
3. Carriers designed for efficient purging with standardized purge locations
4. MHS Design to assume infrequent, anomaly manual handling only
5. Design allowing automated reticle transport
6. Standardized interfaces - equipment mainframe: process chambers
7. Standardized locations for low-cost buffers on tools (beyond loadports)
8. Equipment to be Predictive Maintenance friendly
9. Equipment maintenance and operation in parallel
10. “Smart Idle” mode for equipment
11. Facility adaptor plates
12. Equipment first wafer delay reduction
13. Single Wafer or Mini-batch (vs. Batch) processing tools
14. Equipment design for flexible capacity increments
15. Enable continuous processing of material
16. Wafer-level instruction at any time before processing
17. Single Point of Control for factory system command/control
18. Equipment to provide quality data to enable external monitoring
19. Carrier: Slot integrity flexibility
450 only
MED
LOW
LOW
LOW
HIGH
HIGH
MED
LOW
HIGH
MED
MED
HIGH
MED
MED
HIGH
MED
Equipment
Centric
PPM
SLS
EDA
DQ
VM
EEQA
ECM
FWD
July 16, 2008 15

NGF Strategic Outlook 2009 – 2013
2008 2009 2010 2011 2012 2013
Cost and Cycle Time Improvement Strategies
)
Minimized Cycle Time and Cost
Equipment Availability & Predictability
Factory Predictability
Advanced Material Control & Delivery
Projects
Advanced Factory System
Command & Control
July 16, 2008 16

SEMICON West 2008
Accelerating Manufacturing Productivity
2008 Results – Metrics &
Simulation
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Metrics and Target Definition
• Collaboration with the Joint Productivity Working
Group in Metrics, Simulation & Economics
– Metrics breakdown for cycle time and cost
– Common metrics definition
– Identification of productivity contributors
• Metrics Breakdown
– Top down quantification of improvement for
each metric using simulation guidance
• ISMI Projects: PPM, EEQA, ECM, FWD
– Target definition
– Measurement of results
– Bottom up feasibility verification
July 16, 2008 18

Productivity and Cost Goals
Breakdown Approach
Metrics Targets Contributors
Cost Modeling
and Factory Simulation
Cycle Time
Cost
Equipment Metrics
Availability……………………….xx%
Predictability ……………………xx%
…
…
Factory Metrics
Utilization………………………..xx%
WIP………………………………xx%
Capacity………………………....xx%
…
…
…
PPM
EEQA
ECM
DQ
EDA
FWD
SLS
VM
Setup Time / FWD
MTTR
Time to diagnose MTBF
Parts delivery
Unscheduled to scheduled
downtime
Variance of Repair
Deterministic PM ….
AMHS predictability
Mean delivery time
Scheduling & dispatch
cascading
Chamber dedication
Downtime predictability
Single wafer manufacturing
NPW
Small Lot Size ….
Cost Metrics
Fixed…………………………….xx%
Variable…………………………xx%
??
??
Depreciation
Maintenance
Fab Capacity
Materials
NPW
Labor ….
July 16, 2008 19

Productivity and Cost Goals - Targets
Factor Target Cycle Time Cost
2007 Data From To 25-Wafer 12-Wafer 25-Wafer 12-Wafer
Cost Modeling
and Factory Simulation
Cycle Time Option
Availability 87% 91% 7.6% N/A -1.7% N/A
First Wafer Delay
Setup
Batch SWP
2008 Data
MIN MIN LOTS
Availability 87% 91%
First Wafer Delay
Setup
Batch SWP
MIN MIN LOTS
8.3 6.2
2.1% N/A -1.8% N/A
9.2 6.9
6/2 1 19.1% 51.4% -3.3% -15.3%
8.3 6.2 10.5% 12.8% 4.6% 4.4%
9.2 6.9
6/2 1 7.8% 29.3% -0.3% 0.5%
Cascading
LOTS
1,2,4 1,2 35% 39% 1.7% 1.6%
NPW 12% 10% 1.8% 1.5%
Overall 46% 62% 7.5% 8.0%
July 16, 2008 20

300mm NGF Program Addendum
Cycle Time vs Wafer Cost Change
Wafer Cost Change
25%
20%
15%
10%
5%
0%
-5%
-10%
-15%
-20%
-25%
-30%
-35%
Increased Benefit for NGF High Mix with
additional Cascading and NPW Initiatives
Currently identified opportunities
of
*
improvement
*
Similar Benefit for NGF High Mix with
SWP/SLS & +5%EA, +25% FWD
ISMI NGF Program
Target in accordance
with ITRS
Cycle Time Reduction
Further refinement and
investigation underway
-40%
-70% -65% -60% -55% -50% -45% -40% -35% -30% -25% -20% -15% -10% -5% 0% 5%
Cycle Time Change
Wafer Cost Reduction
ISMI NGF
Program
High Mix
Baseline
(712 tools)
July 16, 2008 21

SEMICON West 2008
Accelerating Manufacturing Productivity
2009 Outlook and Beyond
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Outlook 2009 and Beyond
Improved equipment productivity, lower cycle time, small lot size and
single wafer manufacturing require significant factory operations
improvements to leverage their full benefit
• Equipment Availability & Predictability
– Continued focus on equipment productivity improvement
• PPM, EEQA, EDA/DQ
• Supplier pilots, factory integration and solutions
• Factory Predictability
• Advanced Material Control & Delivery
• Advanced Factory System Command & Control
– Investigate productivity improvement areas in factory operations
• Cascading
• AMHS
• Scheduling & dispatch
• Decision support systems
• Network communications for command & control
• Equipment changes related to areas above
July 16, 2008 23

Manufacturing Improvement and
Waste Reduction
• How to improve waste reduction activity?
• One reduction brings about many effects!
• One effect needs many efforts for waste reduction!
Stabilization of equipment
OEE improvement
Variation control for fine pattern
Cycle time reduction
Material expense reduction
Yield enhancement
Waste of equipment utilization
Waste of maintenance
Waste of poor achievement of
product performance
Waste of order fulfillment delay
Waste of over production
Waste of material over
consumption
This slide by courtesy of NEC
July 16, 2008 24

SEMICON West 2008
Accelerating Manufacturing Productivity
NGF Key Messages
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

NGF Key Messages
• ISMI NGF target remains 50% cycle time and 30% cost
improvement
• NGF program has identified more productivity
improvement opportunities, enabling both cycle time and
cost improvements at the same time
• Equipment productivity improvement projects have
progressed to a stage of active supplier engagement (ECM,
FWD, PPM, EEQA)
– PPM embraced as currently most promising project, with EDA/DQ
usage by suppliers and IDM’s as fundamental enabler
– Testing of software and EDA functionalities critical for enabling and
implementing new NGF capabilities
July 16, 2008 26

NGF Key Messages
• ISMI addresses factory operations and environment as
next step with continued focus on equipment productivity
improvements
– Approach to waste reduction becomes a strategic part of
productivity improvement
– Retrofit of new capabilities into existing factories highly desirable
• ISMI is committed to continued communication and
collaboration between suppliers and IDMs
• The identification of additional leverages will enable further
productivity improvements beyond the reported results
July 16, 2008 27

For more Information…
This presentation material will be made available for
download at the SEMATECH public website:
www.ismi.sematech.org
Meetings and News – Past Meeting Proceedings – ISMI
Industry Briefings
To initiate individual discussions with the ISMI Team, please
contact:
– Olaf Rothe, NGF Program Manager
(olaf.rothe@ismi.sematech.org)
– Brad Van Eck, NGFR Project Manager
(brad.van.eck@ismi.sematech.org)
July 16, 2008 28

SEMICON West 2008
Accelerating Manufacturing Productivity
ISMI 450mm
Program Briefing
Tom Abell
450 Program Manager
July 16, 2008
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.
Portions of this document contain ISMI
Confidential Information as marked

ISMI 450mm Program Mission
and Objectives
Mission:
• Enable cost-effective 450mm transition through coordination and
development of infrastructure, guidance, and industry readiness
2008 Objectives:
1. 450mm wafer availability to enable 450mm development
2. Timely coordination and support of 450mm transition projects and
strategic industry activities
3. Creation of testable Next Generation Factory Architecture guidelines
and coordination of standards to accelerate 450mm
4. Prototype testing of 450mm Factory Integration Interoperability
challenges
July 16, 2008 30

ISMI 450mm Program Structure for 2008
450mm Transition Program
Si Wafer Readiness
• Supplier Engagement
• ESH Challenges
• Economic Monitoring
• Industry Collaboration
• Si supplier readiness
• Si Bank and wafer testing
Factory Integration Guidelines and Standards
• Guideline development
• Standards coordination
Factory Integration Interoperability Test Bed
• Prototype wafer handling and factory
interface facility and testing
July 16, 2008 31

ISMI 450mm Strategic Planning
• ISMI’s 450mm strategic roadmap targets
capabilities required for 2012 pilot line
• Enabling components of this target include:
– Factory Integration test data for robust standards
– Guidance on equipment and factory aspects
– Test wafer generation and metrology capability
– Equipment demonstration guidance
– Improvement of silicon quality and availability
July 16, 2008 32

SEMICON West 2008
Accelerating Manufacturing Productivity
Guidelines Update and
Interoperability Test Bed
Results
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Factory Integration Guideline
Summary
The 450mm Guidelines and Standards team has
developed significant clarifying detail in H1’08 in the
following areas:
• 450mm Carrier Design (ISMI Unified GL’s #2 and #3)
– Purge retention, carrier ID, carrier “run card” pocket, carrier
vibration, wafer pitch/carrier height
• 450mm Wafer Handling (ISMI GL #2)
– Wafer backside contact area & carrier constraint zones
• 450mm Material Handling Guidelines (ISMI GL #4)
– Manual handling design for carrier
Clarification to guidelines will be discussed at the ISMI
450mm Guidelines and Test Bed Project Report-Out
following this Briefing from 3:00~6:00 P.M.
July 16, 2008 34

SEMI IPIC Inputs :
Testing/Evaluation Areas of Interest
Inputs to ISMI for consideration in testing/evaluation of prototypes/test bed in
areas that are of interest to 450 IPIC TF
– KC pin and groove interface due to:
• Carrier weight
• Pin shape and Groove shape design compatibility
• Theta/lead-in for carrier seating
– Validate wafer pitch and wafer pickup, set down, extraction volume, etc.
based on blue ballot definitions/parameters:
• 1st step: Initial feasibility of the values in the blue ballot, especially for wafer
pitch
• 2nd step: Direction on how to account for long term variations of carriers and
tools?
– ISMI share the test setup/conditions when the data is published:
• Type of end-effector, range of end-effectors, etc.
• The more information about the parameters the better we are in a position to
confirm the assumptions in the blue ballot, i.e., end-effector variation, wafer
deflection, etc.
ISMI’s Interoperability Test Bed is working closely with the SEMI IPIC Task Force to
enable data-based standards
July 16, 2008 35

ISMI Carrier Metrics and Testing
Items
Wafer to End
effecter
clearance
FOUP critical
dimensions
Weight and CG
Transport Flange
Backside Wafer
Support
25 Wafer
Capacity
Hardware currently at the
ISMI Test Bed under test
Removable
manual
handles
Carrier ID
Purging
Wafer Pitch
Door Interoperability
Conveyor Rails
Info pads
Kinematic
couplings
July 16, 2008 36

EFEMs / Loadport Metrics and
Testing Items
Wafer
rotation
and sag
End Effector
thickness and sag
Precise,
accurate &
repeatable
placement
Pitch
Budget
EFEMs max
thru-put
FIMS Std.,
door opening
cycle time
& req’d
closure force
Carrier
purging
Capability
RFID Exclusion
Space
Hardware currently at the ISMI
Test Bed under test
ESD Prevent
= Ω Grounding
Slot integrity
& material
redirect mode
BOLTS Std.
Dimensions
Loadport Std.
Dimensions
July 16, 2008 37

Joint ISMI & ITG-Japan Statement
• ISMI’s Interoperability Test Bed (ITB) and the Japan
Interoperability Test Group teams (ITG-J) have agreed to
develop a constructive and cooperative relationship related to
450mm factory integration standards.
• This relationship will combine the strengths of both
organizations to focus on standards related to 450mm carriers,
loadports, EFEMs and AMHS.
• Both efforts intend to provide complementary test reports to the
related standard committees and/or task forces using common
test methods to enable data-based 450mm standardization.
• We believe that the ISMI ITB and ITG-Japan efforts can benefit
from each other and advance industry knowledge for 450mm.
July 16, 2008 38

SEMICON West 2008
Accelerating Manufacturing Productivity
Silicon Studies
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Polysilicon Sag Comparison to Single
Crystal
450mm
Polycrystalline
Silicon
300mm
925µm
START
925µm
CUT
300mm
775µm
GRIND
Single Crystal
Silicon
Sag = 84 µm
Polycrystalline
Silicon
Sag = 85 µm
COMPARE
Same support
configuration
• Sag of polysilicon wafers are representative of single crystal
• 450mm tests will occur once single crystal wafers are obtained
July 16, 2008 40

450mm Support Method Effect on Sag
FULL PERIPHERY SUPPORT
CANTILEVER SUPPORT
Center
950μm
Bowl shape
500μm
430μm
Saddle shape
850μm
• Wafer sag is highly dependent on wafer support and wafer thickness
• Data on actual prototype FOUP supports will be collected within the
ISMI Test Bed
July 16, 2008 41

Si Wafer Bank – 450mm Poly Wafers
Inventory # of Loans # of Wafers Loaned # Available
97 11 70 27
Testing Examples
• Wafer Sag • Wafer Handling • Shipping • Wafer Pitch • Shock / Vibration
Statement
Statement
of
of
Work
Work
(SOW)
(SOW)
•
•
# of
of
Wafers
Wafers
•
•Loan
Loan Length
Length
•
•
Test
Test
Plans
Plans
ISMI
Approval
Ship
Wafers
Test
Results
Return
Wafers
Polysilicon wafers are available for loan to suppliers from ISMI
Contact: Michael Bishop, michael.bishop@ismi.sematech.org
July 16, 2008 42

SEMICON West 2008
Accelerating Manufacturing Productivity
Supplier Engagement
Summary
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2008 Production Equipment
Supplier Engagement Activity
• High-level engagement with process and metrology
supplier management
– Description of ISMI 450mm program structure, progress and
plans for 2008
– Understand suppliers concerns, plans and needs
• Various types of meetings to engage effectively
– Individual supplier meetings for information sharing
>20 suppliers met and scheduled
– Periodic workshops on Guidelines and Test Bed progress to
keep interested suppliers informed of new developments and
data
– Continue briefings at major forums (SEMICON West, ISMI
Symposium, SEMICON Japan, etc.)
July 16, 2008 44

Overview of Individual Production
Equipment Supplier Engagements
• Suppliers briefed on ISMI 450mm program and
requested continued interaction and updates
• Discussed concerns on business issues
• Requests for information about timing, technology
node and equipment performance requirements
• Requests for ISMI to coordinate test wafer
generation and metrology availability
• Some suppliers have already done detailed
studies on 450mm technical challenges
• Proposals for early tools have been received
July 16, 2008 45

SEMICON West 2008
Accelerating Manufacturing Productivity
2009 Outlook and Beyond
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

2009 Outlook & Beyond
• Silicon development and testing activities will shift to single
crystal for process test and production grade wafers
• Expanded scope of Interoperability Test Bed activities,
continued guideline clarification, and interaction with SEMI
task forces
• Increased scope of 450mm EHS analysis
• Investigation of 450mm operational challenges
• Expanded interactions with process and metrology
suppliers to enable equipment development
– Discuss evolving business concerns
– Discussions on equipment performance requirements
– Test wafer generation and metrology capability
July 16, 2008 47

SEMICON West 2008
Accelerating Manufacturing Productivity
Key Messages
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Key Messages
• Samsung, tsmc and Intel are committed to the 450mm
wafer size transition and are working with ISMI to realize a
2012 pilot line target date.
• Development of 450mm silicon wafers is progressing from
sintered mechanical handling test wafers to single crystal
wafers in 2008
– 100 mechanical handling test wafers have been delivered to ISMI
for measurement and ITB testing
– 5 different thicknesses have been received and are being
measured for mechanical properties
– Wafers are available for loan and have been loaned
– Sag of polysilicon wafers are comparable to single crystal
July 16, 2008 49

Key Messages (continued)
• ISMI’s Interoperability Test Bed is underway on factory
interface testing
– Suppliers have signed contracts for demonstrations of prototype
hardware in ISMI’s Austin lab with more under discussion.
– Prototype hardware has been received at ISMI and is under test
– Test Bed User’s Group discussing interoperability challenges
– Agreement to work with Japan’s Interoperability Test Group
• Clarifications to 19-Point Unified Guidelines that relate to
450mm are being provided for improved understanding
and early discussion of challenges
– Constructive two-way exchanges with SEMI IPIC Task Force
– Information and proposals reviewed with individual suppliers and
ESG
– ISMI Report Out will follow this Briefing at 3:00 P.M.
July 16, 2008 50

Key Messages (continued)
• ISMI is assessing the Environmental, Health and Safety
related challenges for 450mm realization
– Environmental challenges, carrier handling, ergonomics and fall
protection
• ISMI is engaging with the industry and suppliers in several
ways at different levels on 450mm
– Briefings and workshops at industry forums
– Continued interactions in SEMI Standards forums
– Expanded engagement with production equipment suppliers
– Continued engagement with factory interface and silicon
infrastructure suppliers
July 16, 2008 51

For more Information…
• This presentation material will be made available
for download at the SEMATECH public website:
www.ismi.sematech.org
Meetings and News – Past Meeting Proceedings –
ISMI Industry Briefings
• To initiate individual discussions with the ISMI
Team, please contact:
– Tom Abell, 450mm Program Manager
(tom.abell@ismi.sematech.org)
– Denis Fandel, 450mm Project Manager
(denis.fandel@ismi.sematech.org)
July 16, 2008 52

SEMICON West 2008
Accelerating Manufacturing Productivity
Conclusion
Questions and Answers
Joe Draina
Director, ISMI
Copyright ©2008
SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center
and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

Q & A
July 16, 2008 54

For more Information…
• This presentation material will be made available
for download at the SEMATECH public website:
www.ismi.sematech.org
Meetings and News – Past Meeting Proceedings –
ISMI Industry Briefings
• To initiate individual discussions with the ISMI
Team, please contact:
– Olaf Rothe
(olaf.rothe@ismi.sematech.org)
– Tom Abell
(tom.abell@ismi.sematech.org)
July 16, 2008 55