DRAM Future Perspectives, Are We Out of Gas? - Discobolus ...

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Current Lay of the Land

CPU CPU CPU

Unbuffered Registered Load Reduced

CPU

Each solution has tradeoffs

regarding frequency, latency,

and capacity

Solder Down

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Embedded Resistor Technology for Memory Module Design

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Current Lay of the Land CPU CPU CPU Unbuffered Registered Load Reduced CPU Each solution has tradeoffs regarding frequency, latency, and capacity Solder Down 2

Memory Chips & Stacks Classic window BGA Dual Face Down DDP RDL DDP 3DS with through silicon vias 3

Page 1: D ISCOBOLUS ESIGNS DRAM Future Pers
Page 5 and 6: Memory Hub Hub CPU 5
Page 7 and 8: Summary Current DDR4 roadmap carrie

DRAM Future Perspectives, Are We Out of Gas? - Discobolus ...

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