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MT8206<br />
PRELIMINARY, SUBJECT TO CHANGE WITHOUT NOTICE MTK CONFIDENTIAL, NO DISCLOSURE<br />
�13.BOM of lead free package<br />
Supplied by SPIL Inc.<br />
Substrate: PPT/Nayan/Kinsus<br />
S/E: ABLEBOND 2000<br />
Bonding wire: gold<br />
M/C: PLASKON NXG-1FP<br />
Solder ball: Sn/Ag/Cu: 95.5/ 4/ 0.5%<br />
June, 2006
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