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AS6081<br />
Appendix - C.1<br />
Minimum Counterfeit<br />
Part Detection Methods
AS6081<br />
Appendix - C.1.1<br />
Documentation and<br />
Packaging Inspection<br />
(100%)
Exterior<br />
Packaging<br />
Inspection
Counterfeit<br />
factory box
Interior Packaging Inspection
Barcode DOES NOT<br />
Match Human-<br />
Readable Data
OCM Document Inspection
Counterfeit<br />
C of C’s
Counterfeit<br />
Labels
3 rd Party Reels – especially small<br />
parts w/o markings
Counterfeit HID Card
AS6081<br />
Appendix - C.1.2<br />
Visual Inspection<br />
(100%)
Different Date<br />
Codes
Component Markings & Physical<br />
Condition
Datasheet Comparison
Mechanical Verification
Microscopy<br />
Microscopic Inspection<br />
Inspection
Marks from Prior use or<br />
3 rd Party Tampering
Rust Inside Terminal
Chip in Glass<br />
Capacitor
Substandard Solder Balls
Visual Evidence of<br />
Blacktopping
Blacktop in Dimple<br />
Visual Evidence<br />
of Blacktopping
Damaged Leads
AS6081<br />
Appendix - C.1.3<br />
Inspection for Evidence<br />
of Remarking or<br />
Resurfacing
AS6081<br />
Appendix - C.1.3.1<br />
Marking Permanency<br />
Test<br />
(Sampling)
Mineral Spirits/Alcohol Test
After Marking Permanency<br />
Before Marking Permanency
AS6081<br />
Appendix - C.1.3.2<br />
Surface Finish<br />
Permanency Test<br />
(Sampling)
Acetone Test
Before<br />
After
Laser-Etch Remarking Still<br />
Visible After Black-Topping<br />
Has Been Removed
Baked-On Black-Topping<br />
Scraping<br />
Required<br />
to Remove<br />
Baked-On<br />
Finish
Example of a<br />
Sandblasted<br />
Component<br />
Surface<br />
Note there are<br />
NO Sanding<br />
Marks
Dynaloy Dynasolve 750<br />
Heated<br />
Solvent<br />
Testing
Exposed Sanded Surface<br />
Counterfeit Device
Sanding Marks Clearly Evident
AS6081<br />
Appendix - C.1.4<br />
X-Ray Inspection<br />
(100%)
Exemplar<br />
Suspect<br />
Dual Screens allow for<br />
Comparative Analysis
Match Pin-Out to Datasheet
Images Taken Through Tubes
X-Ray Image Seen Through<br />
Mfg’s Tubes
Images Taken Through Sealed Bags
Components in Trays as<br />
Seen Through Sealed Bags
AS6081<br />
Appendix - C.1.5<br />
X-Ray Fluorescence<br />
(100%)
AS6081<br />
Appendix - C.1.6<br />
Decapsulation / Die<br />
Inspection<br />
(Sampling)
AS6081<br />
Appendix - C.2<br />
Additional Counterfeit<br />
Part Detection Tests
AS6081<br />
Appendix - C.2<br />
• Scanning Acoustic Microscopy<br />
• Destructive Physical Analysis<br />
• Thermal Cycle Testing<br />
• Electrical Testing<br />
• Burn-In<br />
• Hermeticity Verification
AS6081<br />
Appendix - C.2.1<br />
Scanning Acoustic<br />
Microscopy Inspection<br />
(Sampling)
Surface Image Scans<br />
for Resurfacing<br />
“Blacktop” Detection
Exemplar<br />
Suspect
Exemplar<br />
Suspect
Exemplar<br />
Suspect
Exemplar<br />
Suspect
Exemplar<br />
Suspect
Exemplar<br />
Suspect
Latent Defect Detection<br />
(on same 6 parts)<br />
• Cracks<br />
• Voiding<br />
• Delamination
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Exemplar<br />
Device<br />
Internal<br />
Image Scan<br />
Suspect<br />
Device
Surface Layer Scan<br />
Exemplar<br />
Suspect
Surface Layer Scan<br />
Exemplar<br />
Suspect
Surface Layer Scan<br />
Exemplar<br />
Suspect
Surface Layer Scan<br />
Exemplar<br />
Suspect
Calculating Die Void %
Total % of Die Attach Void
MIL-STD-883G<br />
Method 2030<br />
“Ultrasonic Inspection”
MIL-STD-883G<br />
Method 2030<br />
“Ultrasonic Inspection”<br />
“a. Contact area voids in excess of<br />
50 percent of the total intended<br />
contact area.”
Relative Standards<br />
• MIL-STD-883G<br />
• MIL-STD-1580B<br />
•J-STD-035<br />
• NASA PEM-INST-001<br />
•ESA/SCC No. 25200
J-STD-035<br />
Provides<br />
C-SAM<br />
inspection<br />
process<br />
roadmap
MIL-STD-1580B<br />
“Acoustic Microscopy”
Dynasolve 750 Testing<br />
Purpose: To determine suitable<br />
conditions in which Dynasolve<br />
750 will consistently remove the<br />
new blacktopping from a<br />
counterfeit device while not<br />
damaging the factory top-coating<br />
on an authentic component.
Dynaloy Dynasolve 750<br />
Dynasolve 750 is used<br />
for dissolving cured<br />
urethanes, silicones,<br />
anhydride-cure epoxies<br />
and photo-resist films.
Parameters Tested<br />
Samples of similar authentic and<br />
counterfeit devices were soaked<br />
in Dynasolve 750 at 5 degree<br />
intervals between 80 – 180<br />
degrees Celsius for a maximum<br />
of one hour per temperature<br />
setting.
Conclusion<br />
Our results found that Dynasolve<br />
750 pre-heated to 105 degrees<br />
Celsius consistently removed the<br />
new blacktopping from counterfeit<br />
devices when soaked for 45<br />
minutes.<br />
When these same test conditions<br />
were performed on exemplar<br />
devices we saw no removal of the<br />
factory topcoat.
Sample ½ soaked for 45 minutes in Dynasolve<br />
750 @ 105 degrees Celsius – the new<br />
blacktopping was completely removed to expose<br />
the sanded surface<br />
Counterfeit Device
Exposed Sanded Surface<br />
Counterfeit Device
Treated Area<br />
Untreated Area
Sanding Marks Clearly Evident
Damage was caused to a known good device<br />
when ½ soaked for 45 minutes in Dynasolve 750<br />
at a temperature of 140 degrees Celsius<br />
Exemplar Device
After Dynasolve 750 Testing<br />
Sample ½ soaked for 45 minutes in Dynasolve 750 @<br />
105 degrees Celsius – No topcoat removed<br />
Exemplar Device
After Dynasolve 750 Testing<br />
Both Samples ½ soaked for 45 minutes<br />
in Dynasolve 750 @ 105 degrees Celsius<br />
Exemplar<br />
Device<br />
Counterfeit<br />
Device
This test procedure<br />
should be considered a<br />
destructive test as<br />
demonstrated by these<br />
C-SAM images.
Before Dynasolve Soak
After Dynasolve Soak
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