27.09.2014 Views

PDF (double-sided) - Physics Department, UCSB - University of ...

PDF (double-sided) - Physics Department, UCSB - University of ...

PDF (double-sided) - Physics Department, UCSB - University of ...

SHOW MORE
SHOW LESS

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

Figure 5.2: Fabrication Building Blocks – a) Crossover: The insulator layer “I”<br />

allows for a top wiring trace “T” to cross a base wiring trace “B” without making<br />

electrical contact. b) Via: A hole in the insulator layer “I” allows the top wiring<br />

“T” to connect to the base wiring “B”. c) Junction: A tunnel junction is formed<br />

using a controlled oxide on the top wiring “T” to provide a thin barrier to the<br />

junction wiring layer “J”.<br />

layers provide the basic building blocks <strong>of</strong> the qubit circuit: Traces, crossovers,<br />

vias, and junctions (see Figure 5.2).<br />

5.3 Base Wiring Layer<br />

5.3.1 Aluminum Sputter Deposition<br />

The fabrication begins with the definition <strong>of</strong> the base wiring layer. For this,<br />

a sapphire (crystalline Al 2 O 3 ) wafer (thin round disk) is covered with a 150 nm<br />

thick layer <strong>of</strong> aluminum using a method called “Sputtering”.<br />

Sputtering is a<br />

process in which a disk <strong>of</strong> pure aluminum (called “Target”) is bombarded with<br />

argon ions. The impact causes aluminum atoms to be ejected from the target. If<br />

92

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!