Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
Vertical Probing Experiences - Semiconductor Wafer Test Workshop
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<strong>Vertical</strong> <strong>Probing</strong> <strong>Experiences</strong><br />
<strong>Experiences</strong>: Probe Technologies<br />
• Buckling Beam & Hybrid Buckling Beam<br />
– Wire Through Guide Plates<br />
– Sourced From<br />
• Feinmetall (ViProbe®)<br />
• IBM (COBRA)<br />
• Int’l Contact Tech. (VCT)<br />
• K & S (CobraProbe)<br />
• MicroProbe (Apollo)<br />
• Wentworth Labs (COBRA®)<br />
Courtesy of Feinmetall<br />
Illustration Courtesy of SWTW/Intel (ref. 3)<br />
June 3, 2003 2003 Southwest <strong>Test</strong> <strong>Workshop</strong> 8
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